R. Reif - Publications, H-index & Citations

R. Reif

机构信息待补充

41H指数

202论文数

5.4K被引数

收录论文 10

发表时间

Low-temperature deposition of highly textured aluminum nitride by direct current magnetron sputtering for applications in thin-film resonators

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

PREAI

Naik, RS; Reif, R; Lutsky, JJ; Sodini, CG

Observation of interfacial void formation in bonded copper layers

APPLIED PHYSICS LETTERS

IF3.6

2005-11-09

PREAI

Tan, CS; Reif, R; Theodore, ND; Pozder, S

Process development and bonding quality investigations of silicon layer stacking based on copper wafer bonding

APPLIED PHYSICS LETTERS

IF3.6

2005-07-13

PREAI

Chen, KN; Chang, SM; Fan, A; Tan, CS; Shen, LC; Reif, R

Abnormal contact resistance reduction of bonded copper interconnects in three-dimensional integration during current stressing

APPLIED PHYSICS LETTERS

IF3.6

2004-12-23

PREAI

Chen, KN; Tan, CS; Fan, A; Reif, R

Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application

APPLIED PHYSICS LETTERS

IF3.6

2003-04-21

OAAI

Tan, CS; Fan, A; Chen, KN; Reif, R

Microstructure evolution and abnormal grain growth during copper wafer bonding

APPLIED PHYSICS LETTERS

IF3.6

2002-11-11

PREAI

Chen, KN; Fan, A; Tan, CS; Reif, R; Wen, CY

Effect of rinsing and drying on silicon surface cleaning for epitaxial growth

METALS AND MATERIALS INTERNATIONAL

IF4

2002-10-01

PREAI

Kim, HW; Kim, KS; Hwang, WS; Reif, R

Interfacial morphologies and possible mechanisms of copper wafer bonding

JOURNAL OF MATERIALS SCIENCE

IF3.9

2002-01-01

PREAI

Chen, KN; Fan, A; Reif, R

Interconnect limits on gigascale integration (GSI) in the 21st century

PROCEEDINGS OF THE IEEE

IF25.9

2001-03-01

605

PREAI

Davis, JA; Venkatesan, R; Kaloyeros, A; Beylansky, M; Souri, SJ; Banerjee, K; Saraswat, KC; Rahman, A; Reif, R; Meindl, JD

Evaluation of oxalyl fluoride for a dielectric etch application in an inductively coupled plasma etch tool

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2001-01-01

PREAI

Karecki, S; Chatterjee, R; Pruette, L; Reif, R; Sparks, T; Beu, L; Vartanian, V; Novoselov, M

研究方向