R.J. Gutmann - Publications, H-index & Citations

R.J. Gutmann

rensselaer polytechnic institute

42H指数

381论文数

7.2K被引数

收录论文 17

发表时间

Silicon nitride chemical mechanical polishing mechanisms

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

PREAI

Hu, YZ; Gutmann, RJ; Chow, TP

Chemical-mechanical polishing of parylene N and benzocyclobutene films

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

PREAI

Yang, GR; Zhao, YP; Neirynck, JM; Murarka, SP; Gutmann, RJ

Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2019-12-06

PREAI

Borst, CL; Thakurta, DG; Gill, WN; Gutmann, RJ

Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2008-01-01

OAAI

Kwon, Yongchai; Jindal, Anurag; Augur, Rod; Seok, Jongwon; Cale, Timothy S.; Gutmann, Ronald J.; Lu, Jian-Qiang

Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2007-01-01

PREAI

Kwon, Yongchai; Seok, Jongwon; Lu, Jian-Qiang; Cale, Timothy S.; Gutmann, Ronald J.

Low-temperature titanium-based wafer bonding Ti/Si, Ti/SiO2, and Ti/Ti

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2007-01-01

PREAI

Yu, Jian; Wang, Yinmin; Moore, Richard L.; Lu, Jian-Qiang; Gutmann, Ronald J.

Low-temperature silicon wafer bonding based on Ti/Si solid-state amorphization

APPLIED PHYSICS LETTERS

IF3.6

2006-08-28

OAAI

Yu, Jian; Wang, Yinmin; Lu, Jian-Qiang; Gutmann, Ronald J.

Critical adhesion energy of benzocyclobutene-bonded wafers

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2006-01-01

OAAI

Kwon, Y; Seok, J; Lu, JQ; Cale, TS; Gutmann, RJ

Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2006-01-01

PREAI

Niklaus, F; Kumar, RJ; McMahon, JJ; Yu, J; Lu, JQ; Cale, TS; Gutmann, RJ

Thermal cycling effects on critical adhesion energy and residual stress in benzocyclobutene-bonded wafers

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2005-01-01

PREAI

Kwon, Y; Seok, J; Lu, JQ; Cale, TS; Gutmann, RJ

Integrated flip-chip flex-circuit packaging for power electronics applications

IEEE TRANSACTIONS ON POWER ELECTRONICS

IF6.5

2004-03-01

PREAI

Xiao, Y; Shah, HN; Natarajan, R; Rymaszewski, EJ; Chow, TP; Gutmann, RJ

Surface kinetics model for SiLK chemical mechanical polishing

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2002-01-01

PREAI

Borst, CL; Thakurta, DG; Gill, WN; Gutmann, RJ

Three-dimensional chemical mechanical planarization slurry flow model based on lubrication theory

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2001-01-01

PREAI

Thakurta, DG; Borst, CL; Schwendeman, DW; Gutmann, RJ; Gill, WN

p-type GaSb and Ga0.8In0.2Sb layers grown by metalorganic vapor phase epitaxy using silane as the dopant source

APPLIED PHYSICS LETTERS

IF3.6

1996-12-16

PREAI

Ehsani, H; Bhat, I; Gutmann, R; Charache, G

INHERENT TRADEOFF IN NONCOHERENT DETECTION

PROCEEDINGS OF THE IEEE

IF25.9

1978-01-01

PREAI

GUTMANN, RJ; ROSE, K

RADIATION EFFECTS IN TRANSIT-TIME MICROWAVE DIODES

PROCEEDINGS OF THE IEEE

IF25.9

1974-01-01

PREAI

GUTMANN, RJ; BORREGO, JM; GHANDHI, SK

AFTEREFFECTS IN IMPATT OSCILLATORS WITH TRANSIENT IONIZING-RADIATION

PROCEEDINGS OF THE IEEE

IF25.9

1973-01-01

PREAI

BORREGO, JM; GUTMANN, RJ; COTTRELL, PE; GHANDHI, SK

研究方向