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J

Jiamiao Ni

Shanghai Jiao Tong University

H指数:10

被引数:352

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First-principles screening of dopants for high-conductivity graphene/copper interfaces

IF0

2026-01-290

OAAI

Significantly enhanced heat transport capability across nitrogen-doped graphene/metal interface through lattice substitution induced inelastic phonon scattering

通过晶格取代诱导的非弹性声子散射显著增强氮掺杂石墨烯/金属界面处的热输运能力

Acta Materialia

IF9.3

2026-01-010

PRE

Ultralow Resistivity of Copper Nanofilms Enhanced by Cubic Boron Nitride Coherent Interface

立方氮化硼共格界面增强的铜纳米薄膜超低电阻率

ACS Applied Materials & Interfaces

IF8.2

2025-07-210

PRE

Microstructure and electronic properties of the graphene/{111} copper interface modulated by the rotation angle

石墨烯/{111}铜界面的微观结构与电子性质受旋转角度调制

SCRIPTA MATERIALIA

IF5.6

2025-07-010

PRE

Phonon state modulated by interfacial binding at carbon/copper interface

碳/铜界面处由界面结合调控的声子态

Acta Materialia

IF9.3

2025-06-040

PRE

The influence of graphene substrate on microstructures and electrical properties of vapor-deposited copper thin films

SCRIPTA MATERIALIA

IF5.6

2024-12-010

PRE

Surface morphology and associated high temperature evolution of copper covered with vapor deposited graphene

SURFACE & COATINGS TECHNOLOGY

IF6.1

2024-07-010

PRE

Radio-Frequency Conductivity Characteristics and Corresponding Mechanism of Graphene/Copper Multilayer Structures

IF3.2

2024-06-190

OAAI

Electrical Resistivity Measurements of Surface-Coated Copper Foils

表面涂覆铜箔的电阻率测量

IF3.2

2024-06-171

OAAI

Characterizing Local Electronic States of Twin Boundaries in Copper

表征铜中孪晶边界的局部电子态

IF9.1

2024-04-232

PRE

Effect of Copper Surface Roughness on the High-Temperature Structural Stability of Single-Layer-Graphene

IF3.2

2024-04-031

OAAI

Achieving atomically flat copper surface: Formation of mono-atomic steps and associated strain energy mechanisms

ACTA MATERIALIA

IF9.3

2024-01-011

PRE

Enhanced electrical conductivity of copper by nitrogen-doped graphene

氮掺杂石墨烯增强铜的导电性

SCRIPTA MATERIALIA

IF5.6

2024-01-018

PRE

Two-Step Thermal Transformation of Multilayer Graphene Using Polymeric Carbon Source Assisted by Physical Vapor Deposited Copper

IF3.2

2023-08-132

OAAI

Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States

ACS APPLIED MATERIALS & INTERFACES

IF8.2

2023-07-052

PRE

Enhanced Heat Transport Capability across Boron Nitride/Copper Interface through Inelastic Phonon Scattering

通过非弹性声子散射增强氮化硼/铜界面的传热能力

ADVANCED FUNCTIONAL MATERIALS

IF19

2022-07-2724

PRE