Ziyuan Chai - Publications, H-index & Citations

Ziyuan Chai

Beihang University

7H指数

19论文数

350被引数

收录论文 7

发表时间

Liquid Metal-Reinforced Epoxy Nanocomposite with Enhanced Mechanical Properties and Superior Electrical and Thermal Conductivity 液态金属增强的环氧树脂纳米复合材料，具有增强的机械性能和优异的导电性和导热性

ADVANCED FUNCTIONAL MATERIALS

IF19

2025-10-01

PREAI

Sun, Yue; Chai, Ziyuan; He, Yueran; Su, Yunting; Li, Mingxue; Jiang, Lei; Heng, Liping

Hierarchically-structured light-thermal solid slippery interface for anti-/ de-icing 层级结构的光-热固体滑润界面用于防冰/除冰

CHEMICAL ENGINEERING JOURNAL

IF13.2

2025-06-01

PREAI

Zhao, Di; Sun, Xu; Chai, Ziyuan; Chi, Chengcheng; Zuo, Xiaobiao; Jiang, Lei; Heng, Liping

Flexible solid-liquid nanocomposite with high surface resistivity for effective electromagnetic interference shielding and heat dissipation 具有高表面电阻率的柔性固液纳米复合材料，用于有效的电磁干扰屏蔽和散热

MATERIALS HORIZONS

IF10.7

2025-01-01

PREAI

Sun, Yue; Dong, Tinglei; Chai, Ziyuan; Li, Mingxue; Jiang, Lei

A Photoelectric Synergistic Flexible Solid Slippery Surface for All-Day Anti-Icing/Frosting 一种全天防冰/结霜的光电协同柔性固体光滑表面

SMALL METHODS

IF9.1

2024-11-13

OAAI

Chai, Ziyuan; Teng, Ziyi; Guo, Pu; He, Yueran; Zhao, Di; Zuo, Xiaobiao; Liu, Kesong; Jiang, Lei; Heng, Liping

Flexible solid-liquid bi-continuous electrically and thermally conductive nanocomposite for electromagnetic interference shielding and heat dissipation 用于电磁干扰屏蔽和散热的柔性固液双连续导电和导热纳米复合材料

NATURE COMMUNICATIONS

IF15.7

2024-09-06

OAAI

Sun, Yue; Su, Yunting; Chai, Ziyuan; Jiang, Lei; Heng, Liping

Light-Induced Dynamic Manipulation of Liquid Metal Droplets in the Ambient Atmosphere 环境大气中液态金属液滴的光致动态操纵

ACS NANO

IF16

2024-03-06

PREAI

Tan, Shengda; Han, Xiao; Sun, Yue; Guo, Pu; Sun, Xu; Chai, Ziyuan; Jiang, Lei; Heng, Liping

Slippery Graphene-Bridging Liquid Metal Layered Heterostructure Nanocomposite for Stable High-Performance Electromagnetic Interference Shielding

ACS NANO

IF16

2023-06-29

PREAI

Sun, Yue; Han, Xiao; Guo, Pu; Chai, Ziyuan; Yue, Jingyi; Su, Yunting; Tan, Shengda; Sun, Xu; Jiang, Lei; Heng, Liping

研究方向