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毕文波 封面图

毕文波 (Wenbo Bi)

Shandong University

32H指数
136论文数
2.9K被引数
收录论文 69
发表时间
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Effect of single-indenter and double-indenter scratching on residual stress in 4H-SiC单压头和双压头划痕对4H-SiC残余应力的影响
errPrecision Engineering-Journal of the International Societies for Precision Engineering and Nanotechnology
IF3.7
err2026-09-01
err0
PREAI
errSun, Hao; Ge, Mengran; Bi, Wenbo; Ge, Peiqi; Wang, Peizhi; Lu, Chuan
err分享
err收藏
Effect of fracture strength anisotropy on crack initiation and evolution in 4H-SiC4H-SiC中断裂强度各向异性对裂纹萌生和演化的影响
errEngineering Fracture Mechanics
IF5.3
err2026-08-24
err0
PREAI
errHao Sun; Mengran Ge; Junrui Jiang; Peiqi Ge; Wenbo Bi; Peizhi Wang
err分享
err收藏
Defect detection of monocrystalline silicon wafers for photovoltaic applications using an improved you only look once version 8 small algorithm单晶硅光伏应用中基于改进YOLOv8小算法的缺陷检测
errEngineering Applications of Artificial Intelligence
IF8
err2026-04-19
err0
PREAI
errWenbo Bi; Xinyu Wang; Na Liu; Xu Xing; Lu Li; Hao Liu
err分享
err收藏
Progress and critical challenges in slicing of thin semiconductor wafers using ultra-fine diamond wire超细金刚石线切割薄半导体晶圆的进展与关键挑战
errMaterials Science in Semiconductor Processing
IF4.6
err2025-10-30
err0
PREAI
errPeiqi Ge; Zhecan Cao; Zongqiang Li; Peizhi Wang; Wenbo Bi; Mengran Ge; Wenkun Xie; Xu Xing
err分享
err收藏
A rocking-floating-variable speed feeding mode for slicing single-crystal silicon carbide一种用于单晶碳化硅切片的摇摆-浮动-变速进给模式
errInternational Journal of Mechanical Sciences
IF9.4
err2025-08-13
err0
PREAI
errHao Sun; Mengran Ge; Xu Xing; Baoju Yang; Peiqi Ge; Peizhi Wang; Wenbo Bi
err分享
err收藏
Entropy-driven synthesis of CoB nanosheets for high-performance water splitting electrocatalysts熵驱动的CoB纳米片合成用于高性能水分解电催化剂
errRenewable Energy
IF9.1
err2025-07-11
err0
PREAI
errMeihong Fan; Minghao Wang; Wenbo Bi; Yuzhu Jiang; Hui Chen; Xingquan He; Qingqing Pan
err分享
err收藏
Experimental Study on Microwave Drying Characteristics of Granite Slabs花岗岩板坯微波干燥特性试验研究
errENERGY TECHNOLOGY
IF3.6
err2024-01-16
err1
PREAI
errBi, Wenbo; Liu, Na; Wang, Xinyu
err分享
err收藏
Effect of liquid bridge on the thickness deviation between wafers sawn by diamond wire
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2023-12-01
err3
PREAI
errZheng, Jintao; Ge, Mengran; Ge, Peiqi; Xing, Xu; Bi, Wenbo; Zhao, Yukang
err分享
err收藏
A representation points based method for object detection on the surface of electroplated diamond wire saw
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2023-12-01
err1
PREAI
errZhao, Yukang; Ge, Peiqi; Bi, Wenbo; Zheng, Jintao
err分享
err收藏
Effect of a liquid bridge on the dynamic behavior of diamond wires during slicing
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2023-05-01
err3
PREAI
errZheng, Jintao; Ge, Mengran; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang
err分享
err收藏
Machine vision-based transverse vibration measurement of diamond wire
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2023-03-01
err3
PREAI
errZheng, Jintao; Zhao, Yukang; Ge, Mengran; Bi, Wenbo; Ge, Peiqi
err分享
err收藏
MRF based image stitching of electroplated diamond wire saw: For improving visual inspection accuracy of manufacturing quality
errMEASUREMENT
IF5.6
err2023-02-01
err8
PREAI
errZhao, Yukang; Ge, Peiqi; Bi, Wenbo; Zheng, Jintao; Liu, Na
err分享
err收藏
Transverse forced vibration of a diamond wire under support excitations
errINTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
IF9.4
err2023-01-01
err11
PREAI
errZheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
err分享
err收藏
Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing
errSOLAR ENERGY
IF6.6
err2022-05-01
err10
PREAI
errZheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
err分享
err收藏
Experimental and numerical study on heat transfer enhancement by Flow-induced vibration in pulsating flow脉动流中流动诱导振动强化传热的实验和数值研究
errAPPLIED THERMAL ENGINEERING
IF6.9
err2022-05-01
err29
PREAI
errDuan, Derong; Cheng, Yujun; Ge, Mengran; Bi, Wenbo; Ge, Peiqi; Yang, Xuefeng
err分享
err收藏
Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing超薄晶片切片电镀金刚石线间液桥的作用机理
errSOLAR ENERGY
IF6.6
err2022-01-01
err14
PREAI
errZheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
err分享
err收藏
The study of crack damage and fracture strength for single crystal silicon wafers sawn by fixed diamond wire固定金刚石线锯单晶硅片的裂纹损伤和断裂强度研究
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2021-11-01
err9
PREAI
errLiu, Tengyun; Ge, Peiqi; Bi, Wenbo; Gao, Yufei
err分享
err收藏
An on-line inspection method for abrasive distribution uniformity of electroplated diamond wire saw电镀金刚石线锯磨料分布均匀性的在线检测方法
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2021-11-01
err12
PREAI
errZhao, Yukang; Bi, Wenbo; Ge, Peiqi
err分享
err收藏
Influence of silicon anisotropy on surface shape deviation of wafer by diamond wire saw硅各向异性对金刚石线锯圆片表面形状偏差的影响
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2021-10-01
err19
PREAI
errLi, Zongqiang; Ge, Peiqi; Bi, Wenbo; Li, Chengyun; Wang, Chao; Meng, Jianfeng
err分享
err收藏
Fabrication of thin resin-bonded diamond wire and its application to ductile-mode wire sawing of mono-crystalline silicon树脂结合金刚石细线的制备及其在单晶硅延性线锯中的应用
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2021-05-01
err19
PREAI
errGe, Mengran; Wang, Peizhi; Bi, Wenbo; Ge, Peiqi
err分享
err收藏

研究方向

机器视觉检测半导体材料加工、检测与装备研发机电产品设计固结磨粒线锯丝制造工艺与装备高性能复合钻石线锯的研发及产业化，山东省重大创新工程，第二位半导体金刚线切片、研磨装备及工具光伏单晶硅细线超薄切片加工缆绳悬挂式水文监测车开发，企业委托项目，负责人医护机器人转移车系统设计与关键技术研究，企业委托项目，负责人机器视觉综合检测系统研制，企业委托项目，负责人肌肉电刺激及张力测试系统开发，企业委托项目，负责人一流本科教育背景下工程实验教学改革，校实验室研究项目，主持大学生创新实践能力培养机器视觉综合实验项目建设，校实验室研究项目，主持工业机电驱动实验基于虚拟仪器的扭振实验台的研制，校实验室软件项目，主持近期主要的代表性论文、著作、专利
合作学者
合作期刊
H
Hongwei Song
H 指数: 83 · 论文数: 484
白雪 封面图
白雪 (Xue Bai)
H 指数: 73 · 论文数: 486
陈
陈冠英 (Guanying Chen)
H 指数: 71 · 论文数: 321
董
董博华 (Biao Dong)
H 指数: 68 · 论文数: 364
陈聪 封面图
陈聪 (Cong Chen)
H 指数: 64 · 论文数: 264
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