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K

Kyung‐Wook Paik

harbin institute of technology

36H指数
401论文数
5.7K被引数
收录论文 9
发表时间
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The grain refinements effect of Zn alloying on low-temperature Sn-Bi-In lead-free solder
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-03-01
err8
errOAAI
errXu, Sunwu; Li, Yifei; Jing, Xinyi; Paik, Kyung-Wook; He, Peng; Zhang, Shuye
err分享
err收藏
In-situ isothermal aging TEM analysis of a micro Cu/ENIG/Sn solder joint for flexible interconnects用于柔性互连的微Cu/ENIG/Sn焊点的原位等温老化TEM分析
errJOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
IF14.3
err2024-01-01
err48
PREAI
errLiu, Jinhong; Xu, Jianhao; Paik, Kyung-Wook; He, Peng; Zhang, Shuye
err分享
err收藏
The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-11-01
err10
errOAAI
errZhang, Shuye; Wang, Shaoan; Zhang, Shang; Chen, Xiangyu; Zeng, Chen; Paik, Kyung-Wook; He, Peng
err分享
err收藏
Crack mechanism correlated with Sn grain orientations on Ni metal surface subjected to 1000 thermal shocks
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-09-01
err9
errOAAI
errJing, Xinyi; Luo, Keyu; Paik, Kyung-Wook; He, Peng; Zhang, Shuye
err分享
err收藏
Cu-Cu joining using citrate coated ultra-small nano-silver pastes
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2021-02-01
err59
PREAI
errZhang, Shuye; Wang, Qian; Lin, Tiesong; Zhang, Pengzhe; He, Peng; Paik, Kyung-Wook
err分享
err收藏
Acoustic Matching Layer Films Using B-Stage Thermosetting Polymer Resins for Ultrasound Transducer Applications
errIEEE TRANSACTIONS ON ULTRASONICS FERROELECTRICS AND FREQUENCY CONTROL
IF3.7
err2020-10-01
err11
PREAI
errPark, Jae-Hyeong; Lee, Sang-Mok; Park, Jongcheol; Lee, Hyunjoo Jenny; Paik, Kyung-Wook
err分享
err收藏
Ultrathin Nanofibrous Membranes Containing Insulating Microbeads for Highly Sensitive Flexible Pressure Sensors含绝缘微珠的超薄纳米纤维膜，用于高灵敏度柔性压力传感器
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2020-02-26
err81
PREAI
errJin, Taiyu; Pan, Yan; Jeon, Guk-Jin; Yeom, Hye-In; Zhang, Shuye; Paik, Kyung-Wook; Park, Sang-Hee Ko
err分享
err收藏
Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2019-03-21
err26
PREAI
errLee, Tae-Ik; Jo, Woosung; Kim, Wansun; Kim, Ji-Hye; Paik, Kyung-Wook; Kim, Taek-Soo
err分享
err收藏
Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging
errCOMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
IF8.9
err2018-04-01
err97
PREAI
errLee, Dongju; Lee, Seyong; Byun, Segi; Paik, Kyung-Wook; Song, Sung Ho
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
T
Taek‐Soo Kim
H 指数: 62 · 论文数: 571
P
Peng He
H 指数: 57 · 论文数: 628
王倩 封面图
王倩 (Qian Wang)
H 指数: 42 · 论文数: 471
S
Sang‐Hee Ko Park
H 指数: 41 · 论文数: 252
T
Tiesong Lin
H 指数: 38 · 论文数: 247
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