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Zhongming Jiang

Changsha University of Science & Technology

10H指数
29论文数
1.2K被引数
收录论文 11
发表时间
Coverage and reliability improvement of copper metallization layer in through hole at BGA area during load board manufacture
err2024-01-22
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errZhu, Kai; Xing, Ruimin; Jiang, Zhongming; Zhong, Rongjun; Chen, Liuming; Liu, Jianhui; Miao, Hua; Zhou, Guoyun
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