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Bofu Li

tsinghua university

13H指数
61论文数
1.0K被引数
收录论文 12
发表时间
High Cu-Cu Bonding Strength Achievement Using Micron Copper Particles Under Formic Acid Atmosphere在甲酸气氛下使用微米铜颗粒实现高Cu-Cu键合强度
err2025-03-31
err0
errOAAI
errLi, Bofu; Luo, Yinyin; Li, Dejian; Li, Dameng; Yang, Baobin; Gong, Baoliang; Han, Shunfeng; He, Siliang; Cai, Miao
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The Effect of BEOL Design Factors on the Thermal Reliability of Flip-Chip Chip-Scale PackagingBEOL设计因素对倒装芯片级封装热可靠性的影响
err2025-01-22
err0
errOAAI
errLi, Dejian; Li, Bofu; Han, Shunfeng; Li, Dameng; Yang, Baobin; Gong, Baoliang; Zhang, Zhangzhang; Yu, Chang; Chen, Pei
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Self-assembled metal colloid films: Two approaches for preparing new SERS active substrates
err2004-01-23
err166
PREAI
errLi, XL; Xu, WQ; Zhang, JH; Jia, HY; Yang, B; Zhao, B; Li, BF; Ozaki, Y
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Mercaptoacetic acid-capped silver nanoparticles colloid: Formation, morphology, and SERS activity
err2003-04-08
err218
PREAI
errLi, XL; Zhang, JH; Xu, WQ; Jia, HY; Wang, X; Yang, B; Zhao, B; Li, BF; Ozaki, Y
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