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A
Amber Shrivastava
indian institute of technology system (iit system)
15
H指数
88
论文数
741
被引数
0
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16
发表时间
发表时间
IF
被引数
Comprehensive analysis of friction stir deposited Inconel 600: Thermal, structural, and mechanical insights
CIRP JOURNAL OF MANUFACTURING SCIENCE AND TECHNOLOGY
IF
5.4
2026-01-21
0
PRE
AI
Mishra, Neeraj K.; Nakrani, Jignesh; Shrivastava, Amber
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Influence of microstructural anisotropy on corrosion behavior of SS316L manufactured by wire arc additive manufacturing
SS316L线弧增材制造中微观结构各向异性对腐蚀行为的影响
Electrochimica Acta
IF
5.6
2025-10-20
0
PRE
AI
Parth Vaidya; Rahul Agrawal; Rajeev Gupta; Amber Shrivastava
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Effect of a deposit-substrate interface on fatigue crack propagation in WAAM-deposited SS316L: XFEM modeling with orthotropic material properties
沉积物-基体界面效应对WAAM沉积SS316L疲劳裂纹扩展的影响:具有正交各向异性材料特性的XFEM建模
International Journal of Solids and Structures
IF
3.8
2025-08-15
0
OA
AI
Jignesh Nakrani; Amber Shrivastava; Wenyi Yan
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Interface geometry modification to trap plasticized flash for improved joint strength of dissimilar rotary friction welds
界面几何形状修改以捕获增塑飞边,以提高异种旋转摩擦焊的接头强度
DEFENCE TECHNOLOGY
IF
5.9
2024-12-01
0
OA
AI
Mishra, Neeraj Kumar; Manikandan, S. G. K.; Meshram, Suresh; Shrivastava, Amber
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Interfacial inhomogeneous plastic deformation during rotary friction welding of dissimilar AA2219-SS321 joint combination with AA6061 interlayer
JOURNAL OF ADVANCED JOINING PROCESSES
IF
4
2024-11-01
2
OA
AI
Mishra, Neeraj Kumar; Manikandan, S. G. K.; Shrivastava, Amber
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Viability of WAAM for fabrication/repair of SS316: Fatigue crack growth behavior for varied notch locations in the vicinity of WAAM-substrate interface
WAAM用于制造/修复SS316的可行性: WAAM-基板界面附近不同缺口位置的乏力裂纹扩展行为
THEORETICAL AND APPLIED FRACTURE MECHANICS
IF
5.6
2024-10-01
4
PRE
AI
Nakrani, Jignesh; Mishra, Neeraj K.; Ajay, V.; Yan, Wenyi; Shrivastava, Amber
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Understanding the anisotropic mechanical behaviour and dislocation analysis of additively manufactured CoCr alloy: insight from atomistic simulation
JOURNAL OF MATERIALS SCIENCE
IF
3.9
2024-08-01
1
PRE
AI
Singh, Rohit; Shrivastava, Amber
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Influence of Cu/Ni interlayers on rotary friction welded dissimilar SS321-Ti6Al4V joints
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2023-12-18
5
PRE
AI
Mishra, Neeraj Kumar; Manikandan, S. G. K.; Neethu, N.; Shrivastava, Amber
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Effect of notch location on fatigue crack growth behavior for inhomogeneous material domains in friction stir welded magnesium alloy
INTERNATIONAL JOURNAL OF FATIGUE
IF
6.8
2023-12-01
10
PRE
AI
Nakrani, Jignesh; Yan, Wenyi; Shrivastava, Amber
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Anisotropic fatigue crack propagation in wire arc additively manufactured 316L stainless steel
INTERNATIONAL JOURNAL OF FATIGUE
IF
6.8
2023-12-01
7
PRE
AI
Ajay, V.; Nakrani, Jignesh; Mishra, Neeraj K.; Shrivastava, Amber
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Perceptions of primary and secondary care clinicians treating diabetic foot: A pan India study and quantitative analysis
DIABETES RESEARCH AND CLINICAL PRACTICE
IF
7.4
2023-12-01
0
PRE
AI
Tayade, Apakrita; Kumar, Prabhat; Kumar, Saurav; Ghyar, Rupesh; Shrivastava, Amber; Ravi, Bhallamudi
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Microstructure and texture evolution during incremental sheet forming of AA1050 alloy
JOURNAL OF MATERIALS SCIENCE
IF
3.9
2022-03-11
11
PRE
AI
Kumar, Abhishek; Shrivastava, Amber; Narasimhan, K.; Mishra, Sushil
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Microstructure and texture evolution of complete Mg-3Al-0.2Ce alloy blanks upon multi-pass friction stir processing with spiral strategy
MATERIALS TODAY COMMUNICATIONS
IF
4.5
2021-03-01
11
PRE
AI
Gotawala, Nikhil; Kumar, Abhishek; Mishra, Sushil; Shrivastava, Amber
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Laser processing of multiple surface characteristics for Ti6Al4V biomedical implants
MATERIALS AND MANUFACTURING PROCESSES
IF
4.7
2020-11-02
18
PRE
AI
Ghate, Nakul D.; Shrivastava, Amber
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Phase transformation during friction stir processing of dual-phase 600 steel
JOURNAL OF MATERIALS SCIENCE
IF
3.9
2019-12-05
12
PRE
AI
Gotawala, Nikhil; Wadighare, Abhishek; Shrivastava, Amber
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Numerical and experimental investigation of melting with internal heat generation within cylindrical enclosures
APPLIED THERMAL ENGINEERING
IF
6.9
2014-06-01
13
PRE
AI
Shrivastava, Amber; Williams, Brian; Siahpush, Ali S.; Savage, Bruce; Crepeau, John
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研究方向
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合作学者
合作期刊
B
Brian Williams
H 指数: 82 · 论文数: 597
R
Rajeev Gupta
H 指数: 49 · 论文数: 340
W
Wenyi Yan
H 指数: 47 · 论文数: 379
S
Sushil Mishra
H 指数: 28 · 论文数: 182
B
B. Ravi
H 指数: 27 · 论文数: 116
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