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Andriy Gusak

Cherkasy National University

30H指数
244论文数
3.8K被引数
收录论文 29
发表时间
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Coarsening of BCC precipitates following spinodal-like decomposition in the B2 phase of AlCoCrFeNiTi0.2 compositionally complex alloy在AlCoCrFeNiTi0.2复杂成分合金B2相中自旋odal-like分解后的体心立方沉淀相粗化
errmaterials science and engineering: a
IF0
err2026-04-21
err0
PREAI
errRuixuan Li; Serhii Abakumov; Andriy Gusak; Zhiqiang Luo; Minqing Wang; Gerhard Wilde; Yong Zhang; Sergiy Divinski
err分享
err收藏
Barrier effect of Sn-Bi-In multi-principal element solder on thermomigrationSn-Bi-In多主元焊料的壁垒效应对热迁移的影响
errmaterials science and engineering: a
IF0
err2026-02-10
err0
PREAI
errYifan Yao; Xingchao Mao; A.M. Gusak; Lulin Xie; Yuanxing Duan; Qinglei Sun; Angmin Li; Junlei Qi; Wenbin Wang; Qiyuan He; Yingxia Liu
err分享
err收藏
Elementary Monte Carlo model of the anisotropic recrystallization and 'anti-ripening' under intensive stirring and high supersaturations各向异性再结晶及“反粗化”在强烈搅拌和高过饱和度条件下的基本蒙特卡罗模型
errPhys. Chem. Chem. Phys.
IF0
err2025-12-29
err0
PREAI
errSerhii Abakumov; Eugen Rabkin; Andriy Gusak
err分享
err收藏
A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface Area
errNANOMATERIALS
IF4.3
err2025-02-19
err0
errOAAI
errTu, King-Ning; Gusak, Andriy M.; Sun, Qinglei; Yao, Yifan
err分享
err收藏
Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology
errSCRIPTA MATERIALIA
IF5.6
err2024-09-01
err2
PREAI
errYao, Yifan; Gusak, A. M.; Chen, Chih; Liu, Yingxia; Tu, K. N.
err分享
err收藏
Memory effects during co-deposition of binary alloys
errSCRIPTA MATERIALIA
IF5.6
err2024-03-01
err0
PREAI
errTitova, A.; Zapolsky, H.; Gusak, A.
err分享
err收藏
Flux-driven transformations in open systems revisited - crystallization of amorphous Ni-P driven by reaction with Sn开放系统中的通量驱动转变重新审视-与Sn反应驱动的非晶态ni-p结晶
errACTA MATERIALIA
IF9.3
err2023-12-01
err0
PREAI
errGusak, Andriy M.; Titova, Anastasiia; Chen, Zhong
err分享
err收藏
To suppress thermomigration of Cu-Sn intermetallic compounds in flip-chip solder joints抑制倒装芯片焊点中cu-sn金属间化合物的热迁移
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-05-01
err6
errOAAI
errHuang, Yan-Rong; Tran, Dinh-Phuc; Hsu, Po-Ning; Yang, Shih-Chi; Gusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
Eutectic crystallization and melting in sharp concentration gradients
errJOURNAL OF CHEMICAL PHYSICS
IF3.1
err2023-04-24
err2
PREAI
errGusak, Andriy; Titova, Anastasiia
err分享
err收藏
Evolution of interfacial voids in Cu-to-Cu jointsCu--cu接头界面空隙的演化
errMATERIALS CHARACTERIZATION
IF5.5
err2022-08-01
err9
PREAI
errLiu, Hung-Che; Yang, Shih-Chi; Ong, Jia-Juen; Tran, Dinh-Phuc; Gusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
Interfacial void ripening in Cu-Cu joints
errMATERIALS CHARACTERIZATION
IF5.5
err2021-11-01
err14
PREAI
errLiu, Hung-Che; Gusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
A kinetic model of copper-to-copper direct bonding under thermal compression热压缩下铜与铜直接键合的动力学模型
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2021-11-01
err53
errOAAI
errShie, Kai-Cheng; Gusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
Modeling of abnormal grain growth in (111) oriented and nanotwinned copper
errSCIENTIFIC REPORTS
IF3.9
err2021-10-14
err11
errOAAI
errGusak, A. M.; Chen, Kuan-Ju; Tu, K. N.; Chen, Chih
err分享
err收藏
Alternative algorithms for simultaneous modeling of ordering and intermediate compound growth during reactive diffusion
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2021-02-01
err2
PREAI
errPasichna, Viktoriia; Gusak, Andriy
err分享
err收藏
Ultra-thin intermetallic compound formation in microbump technology by the control of a low Zn concentration in solder
errMATERIALIA
IF2.9
err2020-08-01
err9
PREAI
errLiu, Yingxia; Pu, Li; Gusak, Andriy; Zhao, Xiuche; Tan, Chengwe; Tu, K. N.
err分享
err收藏
Extremely rapid grain growth in scallop-type Cu6Sn5 during solid-liquid interdiffusion reactions in micro-bump solder joints
errSCRIPTA MATERIALIA
IF5.6
err2020-04-01
err53
PREAI
errGusak, A. M.; Tu, K. N.; Chen, Chih
err分享
err收藏
The effect of introducing stochasticity to kinetic mean-field calculations: Comparison with lattice kinetic Monte Carlo in case of regular solid solutions
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2020-01-01
err8
PREAI
errZaporozhets, Tetyana, V; Taranovskyy, Andriy; Jager, Gabriella; Gusak, Andriy M.; Erdelyi, Zoltan; Toman, Janos J.
err分享
err收藏
Phase competition in solid-state reactive diffusion revisited-Stochastic kinetic mean-field approach
errJOURNAL OF CHEMICAL PHYSICS
IF3.1
err2019-05-03
err12
PREAI
errGusak, Andriy; Zaporozhets, Tetiana; Storozhuk, Nadiia
err分享
err收藏
A comparison between complete and incomplete cellular precipitations
errSCRIPTA MATERIALIA
IF5.6
err2018-03-01
err6
PREAI
errTu, K. N.; Gusak, A. M.
err分享
err收藏
Stochastic kinetic mean field model
errCOMPUTER PHYSICS COMMUNICATIONS
IF3.4
err2016-07-01
err18
PREAI
errErdelyi, Zoltan; Pasichnyy, Mykola; Bezpalchuk, Volodymyr; Toman, Janos J.; Gajdics, Bence; Gusak, Andriy M.
err分享
err收藏

研究方向

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合作学者
合作期刊
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Qingyu Yan
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陈钟 封面图
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H 指数: 104 · 论文数: 1.2K
S
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H 指数: 103 · 论文数: 626
J
Jianyu Huang
H 指数: 95 · 论文数: 581
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