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J
Jungwan Cho
Sungkyunkwan University
24
H指数
97
论文数
2.0K
被引数
0
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30
发表时间
发表时间
IF
被引数
Phonon Thermal Transport and Cooling Limits in Submicron Heteroepitaxial β-Ga2O3 Films on SiC
子微米异质外延β-Ga₂O₃薄膜在SiC上的声子热输运与冷却极限
Acta Materialia
IF
9.3
2026-02-15
0
PRE
AI
Taeyeon Kim; Hyeongyun Kim; Hongju Mun; Jihyeon Park; Jongwon Baek; Minkyu Je; Jihyun Kim; Dae-Woo Jeon; Jungwan Cho
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A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations
微电子封装热-力分析框架综述:力学、材料性能确定与结构考虑
Materials Science in Semiconductor Processing
IF
4.6
2025-12-10
0
PRE
AI
Jeong-Hyeon Park; Eunhye Lee; Im-Deok Kim; Hyunwoo Jung; Jihyun Kim; Jungwan Cho; Jong-hyoung Kim; Tae-Ik Lee; Seung-Kyun Kang; Eun-Ho Lee
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One-Step Transformation of Single-Walled Carbon Nanotube Networks into High-Performance Multilayer Graphene-Rich Films via Laser Shockwave Compaction
通过激光冲击波压实将单壁碳纳米管网络一步转化为高性能多层富石墨烯薄膜
Advanced Functional Materials
IF
19
2025-09-23
0
PRE
AI
Jianlin Li; Juyeon Seo; Peiyun Feng; Dongyun Seo; Jihyun Kim; Dina N. Oosthuizen; Jungwan Cho; Byungjin Cho; Ahmed A. Busnaina; Hyun Young Jung; Dongsik Kim; Yung Joon Jung
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Boiling dynamics in microporous copper-coated manifold microchannels
微孔铜涂层集管微通道中的沸腾动力学
Applied Thermal Engineering
IF
6.9
2025-09-15
0
PRE
AI
Youngseob Lee; Daeyoung Kong; Jaewon Hwang; Seokwon Jeong; Jungwan Cho; Hyoungsoon Lee
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Etchant-Free Wafer-Scale 2D Transfer and van der Waals 3D Integration via Peel-Off Force Engineering
无刻蚀晶圆级二维材料转移与基于剥离力工程的范德华三维集成
ACS Nano
IF
16
2025-07-08
0
PRE
AI
Jinhyeok Pyo; Jungmoon Lim; Junsung Byeon; Sohyeon Park; Sungsan Kang; Seonyou Park; Sung-Tae Lee; Eunmin Kim; Min Kyeong Kim; Jung Inn Sohn; John Hong; Jungwan Cho; Kyung-Ho Park; SeungNam Cha; Sangyeon Pak
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Phonon mean free path analysis in polycrystalline nanostructured thin films
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF
5.8
2025-04-01
1
PRE
AI
Tomabechi, Riku; Taniguchi, Ryusei; Kato, Haruka; Cho, Jungwan; Hori, Takuma
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Simultaneous determination of the phase boundary thermal resistance and thermal conductivity in phase-separated TiO2 thin films
ACTA MATERIALIA
IF
9.3
2024-09-01
0
PRE
AI
Kim, Jihyun; Lee, Seunghyeon; Park, Sung Il; Baek, Jongwon; Seo, Dongyun; Choi, Gyung-Min; An, Jihwan; Cho, Jungwan
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Anisotropic and inhomogeneous thermal conductivity of sub-micrometer polycrystalline diamond thin films: A Monte Carlo ray tracing simulation study
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER
IF
6.4
2024-08-01
1
PRE
AI
Baek, Jongwon; Bae, Junyoung; Hori, Takuma; Cho, Jungwan
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Enhanced boiling heat transfer via microporous copper surface integration in a manifold microgap
APPLIED THERMAL ENGINEERING
IF
6.9
2024-03-01
7
PRE
AI
Kim, Kiwan; Kong, Daeyoung; Kim, Yunseo; Jang, Bongho; Cho, Jungwan; Kwon, Hyuk-Jun; Lee, Hyoungsoon
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Thermal conductivity of yttria-stabilized zirconia thin films grown by plasma-enhanced atomic layer deposition
JOURNAL OF THE AMERICAN CERAMIC SOCIETY
IF
3.8
2023-05-15
1
PRE
AI
Park, Sung Il; Yang, Byung Chan; Kim, Jihyun; Ko, Jaeyoon; Choi, Gyung-Min; An, Jihwan; Cho, Jungwan
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Modeling and analyzing near-junction thermal transport in high-heat-flux GaN devices heterogeneously integrated with diamond
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER
IF
6.4
2023-04-01
13
PRE
AI
Kim, Taeyoung; Song, Changhwan; Park, Sung Il; Lee, Seong Hyuk; Lee, Bong Jae; Cho, Jungwan
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Fundamental conduction cooling limits for sub-1 μm Ga2O3 devices integrated with diamond
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF
5.8
2022-08-01
13
PRE
AI
Kim, Taeyeon; Park, Sung Il; Song, Changhwan; Lee, Hyoungsoon; Cho, Jungwan
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High-Temperature Skin Softening Materials Overcoming the Trade-Off between Thermal Conductivity and Thermal Contact Resistance
高温皮肤软化材料克服了热导率和接触热阻之间的权衡
SMALL
IF
12.1
2021-08-12
18
PRE
AI
Kim, Taehun; Kim, Seongkyun; Kim, Eungchul; Kim, Taesung; Cho, Jungwan; Song, Changsik; Baik, Seunghyun
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Thermal conductivity of plasma-enhanced atomic layer deposited hafnium zirconium oxide dielectric thin films
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY
IF
6.2
2021-06-01
6
PRE
AI
Kim, Jihyun; Lee, Sungje; Song, Yiwen; Choi, Sukwon; An, Jihwan; Cho, Jungwan
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Tunable solid-state thermal rectification by asymmetric nonlinear radiation
MATERIALS HORIZONS
IF
10.7
2021-01-01
5
PRE
AI
Lee, Junbyeong; Jan, Agha Aamir; Ganorkar, Shraddha Prakash; Cho, Jungwan; Lee, Dongwoo; Baik, Seunghyun
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The effect of GaN epilayer thickness on the near-junction thermal resistance of GaN-on-diamond devices
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
IF
5.8
2020-09-01
36
PRE
AI
Song, Changhwan; Kim, Jihyun; Cho, Jungwan
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Hierarchically Structured Laser-Induced Graphene for Enhanced Boiling on Flexible Substrates
ACS APPLIED MATERIALS & INTERFACES
IF
8.2
2020-07-24
39
PRE
AI
Kong, Daeyoung; Kang, Minsoo; Kim, Kyung Yeun; Jang, Jina; Cho, Jungwan; In, Jung Bin; Lee, Hyoungsoon
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Low cross-plane thermal conductivity of sub-1 μm polycrystalline silicon thin films for thermoelectric applications
ENERGY CONVERSION AND MANAGEMENT
IF
10.9
2019-01-01
7
PRE
AI
Kim, Jihyun; Cho, Jungwan
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Thickness-dependent thermal conductivity of ultrathin (< 100 nm) barium titanate films
CERAMICS INTERNATIONAL
IF
5.6
2019-01-01
5
PRE
AI
Kim, Yechan; Park, Joonsuk; Shin, Jeongwoo; An, Jihwan; Cho, Jungwan
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Thermal conductivity of ultrathin BaTiO3 films grown by plasma-assisted atomic layer deposition
通过等离子体辅助原子层沉积生长的超薄BaTiO3薄膜的热导率
SCRIPTA MATERIALIA
IF
5.6
2018-09-01
8
PRE
AI
Cho, Jungwan; Park, Joonsuk; Prinz, Fritz B.; An, Jihwan
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研究方向
暂时未获取到该数据
合作学者
合作期刊
R
Ronald K. Hanson
H 指数: 100 · 论文数: 1.2K
K
Kenneth E. Goodson
H 指数: 85 · 论文数: 743
Y
Young‐Min Kim
H 指数: 80 · 论文数: 1.6K
D
David F. Davidson
H 指数: 64 · 论文数: 336
F
Fritz B. Prinz
H 指数: 64 · 论文数: 607
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