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牛新环 封面图

牛新环 (Xinhuan Niu)

Hebei University of Technology

31H指数
169论文数
3.2K被引数
收录论文 30
发表时间
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Applications; Progress; and Challenges of Surfactants in Chemical Mechanical Polishing for Copper Interconnects表面活性剂在铜互连化学机械抛光中的应用、进展与挑战
errLangmuir
IF3.9
err2026-05-26
err0
PREAI
errMengqi Wang; Xinhuan Niu; Jiakai Zhou; Bin Hu; Jiahui Li; Zheng Wu; Ziliang Liu; Qing Ma; Shaobo Song; Yingqian Jia
err分享
err收藏
Review of the Effect of pH Regulators on the Performance of Chemical Mechanical Polishing for Electronic Materials电子材料化学机械抛光中pH调节剂对性能的影响综述
errSurfaces and Interfaces
IF6.3
err2026-05-07
err0
PREAI
errShaobo Song; Xinhuan Niu; Jiakai Zhou; Zheng Wu; Bin Hu; Jiahui Li; Mengqi Wang; Ziliang Liu; Qing Ma
err分享
err收藏
Recent advances in design and preparation of abrasives for chemical mechanical polishing of hard-brittle materials近年来硬脆材料化学机械抛光用磨料的制备与设计进展
errj. mater. chem. c
IF0
err2026-03-05
err0
PREAI
errQing Ma; Xinhuan Niu; Jiakai Zhou; Ziliang Liu; Mengqi Wang; Shaobo Song; Zheng Wu; Bin Hu; Jiahui Li; Jiao Hong
err分享
err收藏
A green, inhibitor-free CMP slurry enabled by synergistic surfactant design for cobalt-based copper interconnects
errApplied Surface Science
IF6.9
err2026-01-12
err0
PREAI
errJiahui Li; Chao He; Xinhuan Niu; Jiakai Zhou; Changxin Dong; Xinjie Li; Zheng Wu; Bin Hu
err分享
err收藏
Effects of R-group functionalized amino acid inhibitors on the CMP performance of copper films: Experimental and atomistic insightsR-基团功能化氨基酸抑制剂对铜薄膜化学机械抛光（CMP）性能的影响：实验与原子尺度见解
errColloids and Surfaces A: Physicochemical and Engineering Aspects
IF5.4
err2025-10-24
err0
PREAI
errZheng Wu; Xinhuan Niu; Jiakai Zhou; Changxin Dong; Chao He; Xinjie Li; Jiahui Li; Bin Hu
err分享
err收藏
Ligand-performance relationships of surface-modified CeO2 in chemical mechanical polishing: A case of coordination number表面改性CeO2在化学机械抛光中的配体-性能关系：配位数的一个案例
errSurfaces and Interfaces
IF6.3
err2025-09-23
err0
PREAI
errJunjie Xue; Xuexin You; Fangwei Lu; Haining Zhang; Bo Gao; Chengrui Xin; Fengyu Li; Baimei Tan; Xinhuan Niu; Simin Li; Fan Zhang; Hui Shen
err分享
err收藏
A novel slurry for Cu films CMP in Ru-based Cu interconnects: Integration of experimental and theoretical calculations一种用于Ru基Cu互连中Cu薄膜化学机械抛光的创新浆料：实验与理论计算的结合
errMaterials Science in Semiconductor Processing
IF4.6
err2025-09-19
err0
PREAI
errZheng Wu; Changxin Dong; Xinhuan Niu; Jiakai Zhou; Chao He; Xinjie Li; Bin Hu; Jiahui Li
err分享
err收藏
Unveiling the mechano-chemical synergy of AMP derivatives as multi-functional pH regulators on C-, R-, and M-plane sapphire CMP via experiments and DFT calculations揭示AMP衍生物作为多功能pH调节剂在C-、R-和M-面蓝宝石化学机械抛光(CMP)中的机化学协同作用：实验与DFT计算
errTribology International
IF6.9
err2025-08-22
err0
PREAI
errBin Hu; Xinhuan Niu; Jiakai Zhou; Changxin Dong; Chao He; Xinjie Li; Zheng Wu; Jiahui Li
err分享
err收藏
Revolutionizing Chemical Mechanical Polishing with Machine Learning: A Comprehensive Review of Challenges and Opportunities利用机器学习革新化学机械抛光：挑战与机遇的全面综述
errArchives of Computational Methods in Engineering
IF12.1
err2025-08-13
err0
PREAI
errJiakai Zhou; Xinhuan Niu; Ziliang Liu; Qing Ma; Jiahui Li; Bin Hu; Zheng Wu
err分享
err收藏
Unveiling Microscopic Mechanisms of Chemical Mechanical Polishing via Multi-Scale Theoretical Calculations通过多尺度理论计算揭示化学机械抛光的微观机制
errJournal of Computational Chemistry
IF4.8
err2025-08-09
err0
PREAI
errBin Hu; Xinhuan Niu; Jiakai Zhou; Changxin Dong; Chao He; Xinjie Li; Zheng Wu; Jiahui Li
err分享
err收藏
Oxygen Vacancy Engineering in Co-Doped CeO2 for Silica Wafer PolishingCeO2中掺杂Co的氧空位工程用于硅片抛光
errACS Applied Nano Materials
IF5.5
err2025-07-10
err0
PREAI
errJiabao Cheng; Yunhui Shi; Xinhuan Niu; Baimei Tan; Zhe Li; Yanjie Cheng; Yizhan Wang; Jiawei Qiu; Yao Xu; Yongxin Wang; Chao He; Changxin Dong
err分享
err收藏
Dual modification of Co doped CeO2 abrasives for enhanced chemical mechanical polishing performanceCo掺杂CeO2磨料的双重改性以提高化学机械抛光性能
errCeramics International
IF5.6
err2025-06-11
err0
PREAI
errJiabao Cheng; Yunhui Shi; Yizhan Wang; Jiawei Qiu; Yao Xu; Yongxin Wang; Xinhuan Niu; Baimei Tan
err分享
err收藏
Highly Corrosion-Resistant Ultrafine Silver Fiber Biopotential Sensor for Long-Term Monitoring高耐腐蚀超细银纤维生物电势传感器用于长期监测
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2025-03-27
err0
PREAI
errWang, LM; Luo, D; Yang, Y; Wu, H; Peterson, J; Gustafsson, S; Guo, L; Niu, X; Liu, H
err分享
err收藏
Smart Health Monitoring: Review of Electrochemical Biosensors for Cortisol Monitoring智能健康监测：电化学生物传感器在皮质醇监测中的应用综述
errADVANCED HEALTHCARE MATERIALS
IF9.6
err2025-03-18
err1
PREAI
errLi, ZJ; Luo, D; Zhang, YQ; Niu, X; Liu, H
err分享
err收藏
Effects of organic compounds rich in phosphate functional groups as multifunctional inhibitors on copper film chemical-mechanical polishing properties: Combined experiment and theoretical calculation
errTRIBOLOGY INTERNATIONAL
IF6.9
err2025-01-01
err0
PREAI
errDong, Changxin; Niu, Xinhuan; He, Chao; Li, Xinjie; Wu, Zheng; Li, Jiahui; Hu, Bin; Shi, Yunhui; Cheng, Jiabao; Luan, Xiaodong
err分享
err收藏
Exploring the effectiveness of polyhydroxy complexing agents in sapphire chemical mechanical polishing: Combining experiments and theoretical calculation
errTRIBOLOGY INTERNATIONAL
IF6.9
err2024-11-01
err0
PREAI
errLi, Xinjie; Zou, Yida; Niu, Xinhuan; Jia, Yingqian; Zhan, Ni; Liu, Jianghao; He, Chao; Dong, Changxin; Shi, Yunhui
err分享
err收藏
Chemical mechanical polishing for copper films in integrated circuit wiring layers using an advanced slurry
errTRIBOLOGY INTERNATIONAL
IF6.9
err2024-10-01
err4
PREAI
errLiu, Jianghao; Niu, Xinhuan; Jia, Yingqian; Zhan, Ni; Zou, Yida; Shi, Yunhui; Zhou, Jianwei
err分享
err收藏
Chemical-mechanical synergies effects of multi-purpose pH regulators on C-, A-, and R-plane sapphire polishing
errTRIBOLOGY INTERNATIONAL
IF6.9
err2024-07-01
err4
PREAI
errZou, Yida; Niu, Xinhuan; Zhan, Ni; Liu, Jianghao; Li, Xinjie; He, Chao; Dong, Changxin; Shi, Yunhui
err分享
err收藏
Corrosion inhibition mechanisms of triazole derivatives on copper chemical mechanical polishing: Combined experiment and DFT study三唑衍生物对铜化学机械抛光的缓蚀机理: 结合实验和DFT研究
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-05-01
err15
PREAI
errLiu, Jianghao; Niu, Xinhuan; Jia, Yingqian; Zhan, Ni; Zou, Yida; Shi, Yunhui; Zhou, Jianwei
err分享
err收藏
Inhibition Effect and Mechanism of 2-Mercaptopyrimidine on Cobalt-Based Copper Interconnects Chemical Mechanical Polishing: Combined Experimental and DFT Study
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2023-10-17
err11
errOAAI
errLiu, Jianghao; Niu, Xinhuan; Zhan, Ni; Zou, Yida; Yan, Han; Qu, Minghui; Luo, Fu; Shi, Yunhui; Zhou, Jianwei
err分享
err收藏

研究方向

2010129-131139-142
合作学者
合作期刊
刘
刘晔 (Ye Liu)
H 指数: 69 · 论文数: 769
武
武峥 (Zheng Wu)
H 指数: 54 · 论文数: 218
Y
Yaqian Zhang
H 指数: 52 · 论文数: 278
罗
罗聃 (Dan Luo)
H 指数: 52 · 论文数: 434
M
Ming Sun
H 指数: 49 · 论文数: 365
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