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Tejasvi Das

Rochester Institute of Technology

3H指数
19论文数
19被引数
收录论文 3
发表时间
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A 124 $\mu$W Inductive Sensing SoC With Force and Position Detection for Virtual Buttons
errIEEE Transactions on Industrial Electronics
IF7.2
err2026-04-10
err0
PREAI
errSiddharth Maru; Michael Kost; Eric King; Jason Wardlaw; Xin Zhao; Rahul Gawde; Tejasvi Das
err分享
err收藏
A Sub-μA LDO With Analog Adaptive Enhancements for Scalable PSRR, Load Range, and Bandwidth Extension亚微安低-dropout稳压器，采用模拟自适应增强技术，实现可扩展的电源抑制比、负载范围和带宽扩展
errieee transactions on circuits and systems i: regular papers
IF0
err2026-01-23
err0
PREAI
errDaniel Zeznick; Ramana Ranganatham; Jacob O’Donnell; Chirag Adiga; Will B. Wright; Tejasvi Das
err分享
err收藏
Enabling Long Chain Lengths and High-Throughput for Time-Domain Neuromorphic Computing实现长链长度和高通量用于时域神经形态计算
errieee transactions on circuits and systems ii express briefs
IF0
err2025-08-01
err0
PREAI
errKarsten Bergthold; Hagar Hendy; Elaine Greenfield; Cory Merkel; Tejasvi Das
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
C
Cory Merkel
H 指数: 13 · 论文数: 92
R
Ramana Ranganatham
H 指数: 3 · 论文数: 7
J
Jason Lee Wardlaw
H 指数: 2 · 论文数: 8
K
Karsten Bergthold
H 指数: 2 · 论文数: 5
H
Hagar Hendy
H 指数: 2 · 论文数: 10
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