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H

Hyun‐Sik Kim

University of Seoul

46H指数
380论文数
1.3W被引数
收录论文 176
发表时间
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Amphoteric Cu-Doping Leading to High Thermoelectric Performance in p-Type Bismuth Antimony Telluride两性Cu掺杂导致p型碲化铋锑的高热电性能
errAdvanced Functional Materials
IF19
err2026-09-23
err0
errOAAI
errMoritz Thiem; Zhiyuan Li; Minsu Heo; Fangyi Hu; Tian Lan; Youngdeog Koh; Ruiwen Xie; Chuanmu Tian; Marc Widenmeyer; Hyun-Sik Kim; Jan P. Hofmann; Yuan Yu; Hongbin Zhang; Anke Weidenkaff; G. Jeffrey Snyder; Wenjie Xie
err分享
err收藏
Effective mass model for thermoelectrics热电材料的有效质量模型
errenergy environ. sci.
IF0
err2026-03-31
err0
errOAAI
errMinsu Heo †; Kyu Hyoung Lee †; Junwoo Song †; Changwoo Lee; Insub Lee; Kwangjoo Kim; Hoon Wee; Joonhyun Lee; Youngdeog Koh; Hyun-Sik Kim; G. Jeffrey Snyder
err分享
err收藏
SPEED: Structured kernel block pruning with filter groups for efficient and elastic SW-HW co-design in FPGA-based CNN accelerators
errNeurocomputing
IF6.5
err2026-02-07
err0
PREAI
errKwanghyun Koo; Sunwoong Kim; Hyun Kim
err分享
err收藏
Carrier scattering mechanism change in Se and S co-doped AgSbTe2 thermoelectric materials
errJournal of the Korean Ceramic Society
IF3.8
err2026-01-21
err0
PREAI
errMinsu Heo; Se Yun Kim; Ui Chan Song; Chang-Hui Jeong; Jun Kyo Seo; Sang-il Kim; Hyun-Sik Kim
err分享
err收藏
Strain-engineered H(Ca1−xSrx)2Nb3O10 layered perovskite ceramics with enhanced dielectric properties for high-temperature applications应变工程化的H(Ca1−xSrx)2Nb3O10层状钙钛矿陶瓷，具有增强的高温应用介电性能
errJournal of the Korean Ceramic Society
IF3.8
err2025-12-08
err0
PREAI
errJeong-Yeon Kim; Seyun Kim; Changwoo Lee; Ui Chan Song; Sang-il Kim; Hyun-Sik Kim
err分享
err收藏
Laser solder ball jetting of SAC305/ENIG joints: Microstructure, kinetics, and reliability under multiple reflow cyclesSAC305/ENIG焊点的激光焊料球喷射：微观结构、动力学及多回流循环下的可靠性
errIntermetallics
IF4.8
err2025-11-28
err0
PREAI
errSeungchan Ka; Deborah Bae; Ashutosh Sharma; Jae Pil Jung; Hyun-Sik Kim
err分享
err收藏
Rugged thermoelectric generator by squeezing carbon nanotube-coated sponge for scalable manufacturing通过挤压碳纳米管涂层海绵实现可扩展制造的坚固热电发电机
errAdvanced Composites and Hybrid Materials
IF21.8
err2025-11-22
err0
errOAAI
errYena Kim; Jungmin Park; Yeong A. Kang; Eun Jin Bae; Young Hun Kang; Mijeong Han; Hyun-Sik Kim; Gimin Park; Wonjin Na; Jong Wook Roh; Jungwon Kim
err分享
err收藏
Aqueous Lithium Hydroxide Chemistry Based on Hierarchically Assembled Hydrogenated Borophene/Cobalt-Nickel Compounds for Rechargeable High-Performance Supercapattery基于分层组装的氢化硼酚/钴-镍化合物的氢氧化锂水溶液化学，用于可充电的高性能超级电池
errAdvanced Energy Materials
IF26
err2025-11-21
err0
PREAI
errSeunghwan Jo; Ozden Gunes Yildiz; Hyun-Sik Kim; Liting Zhang; Ki Hoon Shin; Seong Hyeok Kwon; Keon Beom Lee; Paul Simon; Umut Aydemir; Ghim Wei Ho; Jung Inn Sohn
err分享
err收藏
Oxidation fronts and oxide scale growth modeling in spark plasma sintered ZrC ultra-high temperature ceramic火花等离子烧结ZrC超高温陶瓷中的氧化前锋与氧化物 scales 生长建模
errJournal of the European Ceramic Society
IF6.2
err2025-11-11
err0
errOAAI
errYun-Ching Lin; Richard Huizenga; Hyun-Sik Kim; Hans Brouwer; Amir Mohseni Armaki; Vera Popovich; Yinglu Tang
err分享
err收藏
Cu Filling into Seed and Seedless Layered Through-Silicon-Via and Hybrid Bonding for High-Density Semiconductor Packaging
errKOREAN JOURNAL OF MATERIALS RESEARCH
IF0.3
err2025-11-01
err0
PREAI
errLim, Chae Yeon; Seon, Shin Hui; Kim, Hyun-Sik; Jung, Jae Pit
err分享
err收藏
Enhancing thermoelectric efficiency of Bi2Se3 alloys via significant reduction of lattice thermal conductivity by complementary defect structure formed by heavy Fe addition通过重Fe添加形成的互补缺陷结构显著降低晶格热导率，进而提升Bi2Se3合金的热电效率。
errJournal of Alloys and Compounds
IF6.3
err2025-09-15
err0
PREAI
errSamuel Kimani Kihoi; BeomSoo Kim; Changwoo Lee; Hyun-Sik Kim; Sang-il Kim
err分享
err收藏
Li-Well ZnO Memtransistors: High Reliability for Neuromorphic ApplicationsLi-Well ZnO memtransistors: 高可靠性用于神经形态应用
errAdvanced Materials
IF26.8
err2025-09-10
err0
errOAAI
errKi-Hoon Son; Hyun-Sik Kim; Dae-Hee Han; Hyung-Kyu Lim; Hong-Sub Lee
err分享
err收藏
High-Dielectric Ultrathin BaTiO3 Anode via Electrophoretic Deposition: A Platform for Pseudocapacitive Li Storage and Interface Stabilization高介电超薄BaTiO3阳极的制备：一种用于赝电容锂存储和界面稳定的平台
errACS APPLIED ENERGY MATERIALS
IF5.5
err2025-09-01
err0
PREAI
errLee, Ji-Yeon; Shin, Jiwon; Heo, Minsu; Yoo, Chanyoung; Chang, Mincheol; Kim, Jedo; Kim, Hyun-Sik; Park, Byoung-Nam
err分享
err收藏
Development of two-dimensional layered ZnSb-based thermoelectric materials via alkali metal alloying通过碱金属合金化制备二维层状ZnSb基热电材料
errJournal of Alloys and Compounds
IF6.3
err2025-09-01
err0
PREAI
errPeyala Dharmaiah; Gwang Min Park; Minsu Heo; Jaebaek Ju; Hyun-Sik Kim; Hea Jung Park; Sung Ok Won; Tae Heon Kim; Seong Keun Kim; Jin-Sang Kim; Seung-Hyub Baek
err分享
err收藏
Simultaneous Fermi Level and Weighted Mobility Engineering in CaCuP-Based Thermoelectrics via Multi-Route Compositional Tuning通过多路径组分调控实现CaCuP基热电材料的同步费米能级与加权迁移率工程
errAdvanced Electronic Materials
IF5.3
err2025-08-13
err0
errOAAI
errMelis Akturk Aktas; Minsu Heo; Se Yun Kim; Saba Sepahban Shahgoli; Tugser Yilmaz; Hyun-Sik Kim; Umut Aydemir
err分享
err收藏
Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging激光束功率对用于MEMS封装的激光焊mini-LEDs微观结构演变和界面动力学的影响
errmaterials science materials in electronics
IF0
err2025-08-07
err0
PREAI
errJun Ho Ku; Sri Harini Rajendran; Ashutosh Sharma; Jae Pil Jung; Hyun-Sik Kim
err分享
err收藏
Development of n-type Ti2CoNiSb2 double half-Heusler compound by the breaking of valence-balanced rule and achieving high thermoelectric performance via Bi/Cu co-doping通过打破价态平衡规则，并采用Bi/Cu共掺杂制备n型Ti2CoNiSb2双半Heusler化合物，实现高热电性能。
errJournal of Materiomics
IF9.6
err2025-08-07
err0
errOAAI
errRahidul Hasan; Seungki Jo; Seung Yong Lee; Yan Gu; Kyung Tae Kim; Dong Won Chun; Sang-il Kim; Hyun-Sik Kim; Kyu Hyoung Lee
err分享
err收藏
Mitigating Surface Deactivation for N2O Abatement Using Plasma Activated Co-reactants利用等离子体活化共反应物减轻N2O减排过程中的表面失活
errACS Catalysis
IF13.1
err2025-07-30
err0
PREAI
errZachary D. Feng; Aston King; Jiefeng Diao; Caroline Leung; Hyunsik Kim; Hyunwoo Park; Graeme Henkelman; C. Buddie Mullins; Thomas C. Underwood
err分享
err收藏
Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging用于微型化3D MEMS封装的先进玻璃通孔（TGV）电填充电镀与焊料凸点技术
errJournal of Alloys and Compounds
IF6.3
err2025-07-29
err0
PREAI
errChul Hwa Jung; Jae Pil Jung; Ashutosh Sharma; Hyun-Sik Kim
err分享
err收藏
Evolution of electrical, thermal, and thermoelectric transport properties of solid-solution alloys of CoSe2 and CoS2CoSe2和CoS2固溶体合金的电学、热学和热电输运性质的演化
errJournal of the Korean Ceramic Society
IF3.8
err2025-07-19
err0
PREAI
errSeungchan Seon; Ranganayakulu K. Vankayala; Beomsoo Kim; Se-jun Kim; Changwoo Lee; Hyun-Sik Kim; Sang-il Kim
err分享
err收藏

研究方向

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合作学者
合作期刊
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Joseph Wang
H 指数: 190 · 论文数: 1.5K
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Taeghwan Hyeon
H 指数: 169 · 论文数: 688
G
G. Jeffrey Snyder
H 指数: 144 · 论文数: 945
S
S. J. Pearton
H 指数: 115 · 论文数: 2.9K
Y
Yung‐Eun Sung
H 指数: 100 · 论文数: 754
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