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B

Balázs Illés

electronics technology

29H指数
216论文数
2.3K被引数
收录论文 56
发表时间
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Quality and microstructural analysis of SnBiAg-xTiO2 composite low-temperature solder jointsSnBiAg-xTiO2复合材料低温焊点的质量与微观结构分析
errJournal of Materials Research and Technology
IF6.6
err2026-03-04
err0
errOAAI
errBalázs Illés; Krzysztof Szostak; Andras Hegyessy; Karel Dušek; David Bušek; Attila Géczy
err分享
err收藏
Effect of ZrO2 and CuO nanoparticles on corrosion-induced Sn whisker grwoth from SnAgCu alloys: An experimental and quantum mechanical studyZrO2和CuO纳米颗粒对SnAgCu合金中腐蚀诱导的Sn须生长的影响：一项实验和量子力学研究
errMaterials & Design
IF7.9
err2025-12-08
err0
errOAAI
errBalázs Illés; Krzysztof Szostak; Halim Choi; Agata Skwarek
err分享
err收藏
Influence of Fe-Nanoparticle Doped Flux on Electromigration Effects in SAC305 Solder JointsFe纳米颗粒掺杂助焊剂对SAC305焊点电迁移效应的影响
errJournal of Materials Research and Technology
IF6.6
err2025-09-07
err0
errOAAI
errIrina Wodak; Attila Géczy; Oliver Krammer; Balázs Illés; Paweł Piotr Michałowski; Zoltán Tafferner; Golta Khatibi; Andriy Yakymovych
err分享
err收藏
Electrical characterization of thermal vacuum grown submicron-thick Sn whiskers热真空生长的亚微米级厚Sn晶须的电学表征
errMaterials & Design
IF7.9
err2025-08-06
err0
errOAAI
errAgata Skwarek; Balázs Illés; Ernest Brzozowski; Adam Łaszcz; Piotr Zachariasz
err分享
err收藏
Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review
errMATERIALS
IF3.2
err2025-03-01
err0
errOAAI
errChoi, Halim; Illes, Balazs; Dusek, Karel
err分享
err收藏
Insights into copper electrochemical migration through numerical modeling and Monte Carlo simulation通过数值建模和蒙特卡洛模拟洞察铜电化学迁移
errRESULTS IN ENGINEERING
IF7.9
err2025-03-01
err0
errOAAI
errDayoub, Ali; Gharaibeh, Ali; Illes, Balazs; Medgyes, Balint
err分享
err收藏
Vapour phase reflow soldering with vertical assembly stacking to improve productivity
errRESULTS IN ENGINEERING
IF7.9
err2025-03-01
err0
errOAAI
errHavellant, Gergo; Illes, Balazs; Kovacs, Patrik; Busek, David; Dusek, Karel; Geczy, Attila
err分享
err收藏
Effects of ZrO2 Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study
errNANOMATERIALS
IF4.3
err2024-10-12
err3
errOAAI
errSkwarek, Agata; Choi, Halim; Hurtony, Tamas; Byun, Jaeduk; Mohamad, Ahmad Azmin; Busek, David; Dusek, Karel; Illes, Balazs
err分享
err收藏
3D Printed and Electrospun, Transparent , Hierarchical Polylactic Acid Mask Nanoporous Filter
errINTERNATIONAL JOURNAL OF BIOPRINTING
IF6
err2024-08-02
err59
errOAAI
errHe, Haijun; Gao, Min; Illes, Balazs; Molnar, Kolos
err分享
err收藏
Improving efficiency of vapour phase soldering ovens with pressure and temperature-based process monitoring
errCASE STUDIES IN THERMAL ENGINEERING
IF6.4
err2024-05-01
err2
errOAAI
errHavellant, Gergo; Illes, Balazs; Busek, David; Geczy, Attila
err分享
err收藏
Personal Air-Quality Monitoring with Sensor-Based Wireless Internet-of-Things Electronics Embedded in Protective Face Masks
errSENSORS
IF3.5
err2024-04-18
err1
errOAAI
errKuglics, Lajos; Geczy, Attila; Dusek, Karel; Busek, David; Illes, Balazs
err分享
err收藏
Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study
errSCRIPTA MATERIALIA
IF5.6
err2024-04-01
err5
errOAAI
errIlles, Balazas; Michalowski, Pawel Piotr; Skwarek, Agata; Choi, Halim; Byun, Jaeduk; Dusek, Karel; Busek, David; Pietruszka, Adrian
err分享
err收藏
Corrosion problems of SAC-SiC composite solder alloys
errCORROSION SCIENCE
IF8.5
err2023-11-01
err5
errOAAI
errChoi, Halim; Illes, Balazs; Hurtony, Tamas; Byun, Jaeduk; Geczy, Attila; Skwarek, Agata
err分享
err收藏
Incorporation and corrosion protection mechanism of TiO2 nano-particles in SnAgCu composite alloys: Experimental and density functional theory study
errCERAMICS INTERNATIONAL
IF5.6
err2023-07-01
err11
errOAAI
errIlles, Balazs; Choi, Halim; Byun, Jaeduk; Dusek, Karel; Busek, David; Skwarek, Agata
err分享
err收藏
Can ChatGPT Help in Electronics Research and Development? A Case Study with Applied Sensors
errSENSORS
IF3.5
err2023-05-18
err9
errOAAI
errTafferner, Zoltan; Illes, Balazs; Krammer, Oliver; Geczy, Attila
err分享
err收藏
Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic
errMATERIALS
IF3.2
err2023-01-17
err2
errOAAI
errGeczy, Attila; Havellant, Gergo; Batorfi, Reka; Skwarek, Agata; Dusek, Karel; Busek, David; Illes, Balazs
err分享
err收藏
Influence of SiC reinforcement on microstructural and thermal properties of SAC0307 solder joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2023-01-01
err17
errOAAI
errSkwarek, Agata; Illes, Balazs; Gorecki, Pawel; Pietruszka, Adrian; Tarasiuk, Jacek; Hurtony, Tamas
err分享
err收藏
Selective etching of lead-free solder alloys: A brief review无铅焊料合金的选择性蚀刻: 简要回顾
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2022-12-01
err8
PREAI
errYahaya, Muhamad Zamri; Nazeri, Muhammad Firdaus Mohd; Salleh, Nor Azmira; Kurt, Adem; Kheawhom, Soorathep; Illes, Balazs; Skwarek, Agata; Abdullah, Aboubakr M.; Mohamad, Ahmad Azmin
err分享
err收藏
Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2022-09-01
err18
errOAAI
errIlles, Balazs; Choi, Halim; Hurtony, Tamas; Dusek, Karel; Busek, David; Skwarek, Agata
err分享
err收藏
Investigating Machine Learning Techniques for Predicting the Process Characteristics of Stencil Printing
errMATERIALS
IF3.2
err2022-07-06
err6
errOAAI
errMartinek, Peter; Illes, Balazs; Codreanu, Norocel; Krammer, Oliver
err分享
err收藏

研究方向

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合作学者
合作期刊
A
Aboubakr M. Abdullah
H 指数: 57 · 论文数: 348
A
Ahmad Azmin Mohamad
H 指数: 41 · 论文数: 251
J
József Kovács
H 指数: 31 · 论文数: 220
G
Gábor Harsányi
H 指数: 29 · 论文数: 203
T
Tadashi Shinohara
H 指数: 27 · 论文数: 194
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