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Chang‐Chun Lee

national tsing hua university

27H指数
278论文数
3.1K被引数
收录论文 73
发表时间
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Metamaterials from Plasma-Treated Block Copolymer Monolith等离子体处理的嵌段共聚物单体超材料
errACS Applied Materials & Interfaces
IF0
err2026-03-23
err0
errOAAI
errChien Chen; Jui-Chang Chuang; Ke-Hsin Yin; Cheng-Hsun Tung; Kai-Cheng Yang; Yu-Chueh Hung; Chang-Chun Lee; Rong-Ming Ho
err分享
err收藏
Omnidirectional tunable-sensitivity strain sensors based on LI-Ag/GN composites
errChemical Engineering Journal
IF13.2
err2026-01-21
err0
PREAI
errShih-Feng Tseng; Cheng-Hao Yu; Wen-Tse Hsiao; Chang-Chun Lee
err分享
err收藏
Mechanical reliability of high-power modules via simulation-based machine learning基于模拟机器学习的高功率模块机械可靠性
errENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE
IF8
err2025-05-24
err0
PREAI
errLee, Chang-Chun; Tsai, Wei-Cheng; Chuang, Jui-Chang
err分享
err收藏
Well-Ordered Nanonetwork Invar from Templated Electrochemical Deposition as Mechanical Metamaterials作为机械超材料，通过模板电化学沉积制备的良序纳米网络不变量
errSMALL
IF12.1
err2025-04-08
err0
PREAI
errLin, An-Sheng; Siddique, Suhail K.; Xie, Yi-Ting; Lee, Chang-Chun
err分享
err收藏
Surface modification of nanotwinned copper and SiCN using N2 and Ar plasma activation
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-03-01
err0
PREAI
errLee, Rou-Jun; He, Pin-Syuan; Tran, Dinh-Phuc; Chiu, Wei-Lan; Chang, Hsiang-Hung; Lee, Chang-Chun; Chen, Chih
err分享
err收藏
Laser-induced nano-Ag/graphene composites for highly responsive flexible strain sensors
errCOMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING
IF8.9
err2025-01-01
err1
PREAI
errTseng, Shih-Feng; Tsai, Han-Ting; Lee, Chang-Chun; Kuo, Chil-Chyuan
err分享
err收藏
Stress-induced warpage estimation of advanced semiconductor copper interconnect processes
errINTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
IF9.4
err2024-12-01
err0
PREAI
errLee, Chang-Chun; Lin, Yen-Hung; Yang, Dei-Pei
err分享
err收藏
Experimental and Simulated Verification of Power Cycling Reliability for Thin and Low Warpage Power Modules
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2024-10-01
err0
PREAI
errLee, Chang-Chun; Kao, Kuo-Shu; Huang, Yuan-Cheng
err分享
err收藏
Chipping-induced fracture investigation of glass interposer with dielectric coatings
errSURFACE & COATINGS TECHNOLOGY
IF6.1
err2024-08-01
err0
PREAI
errLee, Chang-Chun; Chuang, Jui-Chang; Lee, Chien-Han; Cheng, Hsien-Chie
err分享
err收藏
Extent of immune history shapes the antibody response against the influenza virus in a mouse model免疫历史程度塑造了小鼠模型中抗流感病毒的抗体反应
errJOURNAL OF IMMUNOLOGY
IF3.4
err2024-05-01
err0
PREAI
errLyu, Huibin; Lyu, Huibin; Teo, Qi Wen; Lee, Chang-Chun; Liang, Weiwen; Choi, Danbi; Mao, Kevin; Bruzzone, Roberto; Wilson, Ian; Wu, Nicholas; Mok, Chris
err分享
err收藏
Modeling the cure shrinkage-induced warpage of epoxy molding compound环氧模塑料固化收缩引起的翘曲建模
errINTERNATIONAL JOURNAL OF MECHANICAL SCIENCES
IF9.4
err2024-04-01
err4
PREAI
errLee, Chang-Chun; Lin, Hao-Zhou
err分享
err收藏
Topological effect on mechanical properties of self-assembled block copolymer
errGIANT
IF4.9
err2024-03-01
err2
errOAAI
errSiddique, Suhail K.; Sadek, Hassan; Lee, Tsung-Lun; Manesi, Gkreti-Maria; Avgeropoulos, Apostolos; Wang, Chi-Wei; Lee, Chang-Chun; Thomas, Edwin L.; Ho, Rong-Ming
err分享
err收藏
Layout Dependence Stress Investigation in through Glass via Interposer Architecture Using a Submodeling Simulation Technique and a Factorial Design Approach
errMICROMACHINES
IF3
err2023-07-27
err1
errOAAI
errWang, Shih-Hung; Hsu, Wensyang; Liou, Yan-Yu; Huang, Pei-Chen; Lee, Chang-Chun
err分享
err收藏
Morphological Diagram of Dynamic-Interfacial-Release-Induced Surface Instability
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2023-07-21
err5
PREAI
errLai, Yu-Fang; Chang, Meng-Yuan; Liou, Yan-Yu; Lee, Chang-Chun; Hsueh, Han-Yu
err分享
err收藏
Starfish-Inspired Diamond-Structured Calcite Single Crystals from a Bottom-up Approach as Mechanical Metamaterials
errACS NANO
IF16
err2023-06-30
err4
PREAI
errSadek, Hassan; Siddique, Suhail K.; Wang, Chi-Wei; Chiu, Po-Ting; Lee, Chang-Chun; Ho, Rong-Ming
err分享
err收藏
Diamond-structured nanonetwork gold as mechanical metamaterials from bottom-up approach
errNPG ASIA MATERIALS
IF8.3
err2023-06-23
err1
errOAAI
errSiddique, Suhail K.; Sadek, Hassan; Wang, Chi-Wei; Lee, Chang-Chun; Tsai, Cheng-Yuan; Chang, Shou-Yi; Li, Chia-Lin; Hsueh, Chun-Hway; Ho, Rong-Ming
err分享
err收藏
Mechanical characteristic comparison of additively manufactured Ti-6Al-4V lattice structures in biocompatible bone tissue growth
errMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
IF7
err2022-11-01
err18
PREAI
errTseng, Shih-Feng; Wang, I-Hsin; Chang, Chun-Ming; Lee, Chang-Chun; Yeh, De-Yi; Chen, Tso-Wei; Yeh, An-Chou
err分享
err收藏
Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
errMATERIALS
IF3.2
err2022-10-20
err5
errOAAI
errWang, Shih-Hung; Hsu, Wensyang; Liou, Yan-Yu; Huang, Pei-Chen; Lee, Chang-Chun
err分享
err收藏
Bioinspired Nanonetwork Hydroxyapatite from Block Copolymer Templated Synthesis for Mechanical Metamaterials来自嵌段共聚物模板合成的生物启发纳米网络羟基磷灰石，用于机械超材料
errACS NANO
IF16
err2022-10-20
err8
PREAI
errSadek, Hassan; Siddique, Suhail K.; Wang, Chi-Wei; Lee, Chang-Chun; Chang, Shou-Yi; Ho, Rong-Ming
err分享
err收藏
Simulation methodology development of warpage estimation for epoxy molding compound under considerations of stress relaxation characteristics and curing conditions applied in semiconductor packaging
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2022-07-01
err17
PREAI
errLee, Chang-Chun; Lee, Chia-Chi; Chang, Che-Pei
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
I
Ian A. Wilson
H 指数: 179 · 论文数: 1.7K
E
Edwin L. Thomas
H 指数: 112 · 论文数: 807
K
Kun‐Yi Andrew Lin
H 指数: 77 · 论文数: 559
R
Roberto Bruzzone
H 指数: 61 · 论文数: 207
陈
陈福荣 (Fu‐Rong Chen)
H 指数: 58 · 论文数: 567
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