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C

Chao‐Chang A. Chen

cmp innovation center

16H指数
63论文数
765被引数
收录论文 13
发表时间
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Sustainable chemical mechanical planarization optimization for copper thin film wafer with multi-objective optimization approach基于多目标优化方法的铜薄膜晶圆可持续化学机械平坦化优化
errThe International Journal of Advanced Manufacturing Technology
IF0
err2025-10-09
err0
PREAI
errChan-Yun Yang; Jie-Sheng Chen; Steve H. Wang; Gene Eu Jan; Chao-Chang A. Chen
err分享
err收藏
Determination of sawing temperature in multi-diamond wire sawing of mono-crystalline silicon carbide单晶碳化硅多金刚石线锯切割中锯切温度的测定
errCIRP JOURNAL OF MANUFACTURING SCIENCE AND TECHNOLOGY
IF5.4
err2025-06-11
err0
PREAI
errSefene, Eyob Messele; Chen, Chao-Chang A.; Wang, Steve Hsueh-Ming
err分享
err收藏
Enhancing sustainability and machinability in electrophoretic-assisted diamond wire sawing of monocrystalline silicon wafer
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2024-12-01
err1
PREAI
errSefene, Eyob Messele; Chen, Chao-Chang A.; Lien, Hung-Chang
err分享
err收藏
A comprehensive review of diamond wire sawing process for single-crystal hard and brittle materials
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2024-12-01
err5
PREAI
errSefene, Eyob Messele; Chen, Chao-Chang A.; Tsai, Yueh-Hsun
err分享
err收藏
Recent Advances In Silicon Carbide Chemical Mechanical Polishing Technologies碳化硅化学机械抛光技术的最新进展
errMICROMACHINES
IF3
err2022-10-16
err32
errOAAI
errHsieh, Chi-Hsiang; Chang, Che-Yuan; Hsiao, Yi-Kai; Chen, Chao-Chang A.; Tu, Chang-Ching; Kuo, Hao-Chung
err分享
err收藏
Study on high efficient sapphire wafer processing by coupling SG-mechanical polishing and GLA-CMP
errINTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
IF18.8
err2018-08-01
err74
PREAI
errXu, Yongchao; Lu, Jing; Xu, Xipeng; Chen, Chao-Chang A.; Lin, Yujing
err分享
err收藏
Optical design of soft multifocal contact lens with uniform optical power in center-distance zone with optimized NURBS
errOPTICS EXPRESS
IF3.3
err2018-02-01
err7
errOAAI
errVu, Lien T.; Chen, Chao-Chang A.; Yu, Chia-Wei
err分享
err收藏
Material removal mechanism of Cu-CMP studied by nano-scratching under various environmental conditions
errWEAR
IF6.1
err2012-03-01
err20
PREAI
errFu, Wei-En; Chen, Chao-Chang A.; Huang, Kuo-Wei; Chang, Yong-Qing
err分享
err收藏
A process model of wafer thinning by diamond grinding
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2008-05-01
err35
PREAI
errChen, Chao-Chang A.; Hsu, Li-Sheng
err分享
err收藏
Toolpath generation for diamond shaping of aspheric lens array非球面透镜阵列金刚石成形的刀具轨迹生成
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2007-10-01
err26
PREAI
errChen, Chao-Chang A.; Chen, Chien-Ming; Chen, Jr-Rung
err分享
err收藏
Mechano-chemical polishing of silicon wafers硅片的机械化学抛光
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2003-09-01
err43
PREAI
errChen, CCA; Shu, LS; Lee, SR
err分享
err收藏
Generation of fractal toolpaths for irregular shapes of surface finishing areas
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2002-09-01
err27
PREAI
errChen, CCA; Juang, YS; Lin, WZ
err分享
err收藏
Development of an automated surface finishing system (ASFS) with in-process surface topography inspection
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err1996-12-01
err7
PREAI
errChen, CCA; Duffie, NA
err分享
err收藏

研究方向

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合作学者
合作期刊
Kuo-Wei Huang 封面图
Kuo-Wei Huang (Kuo‐Wei Huang)
H 指数: 83 · 论文数: 778
H
Hao‐Chung Kuo
H 指数: 74 · 论文数: 1.5K
C
Chien‐Ming Chen
H 指数: 51 · 论文数: 541
X
Xipeng Xu
H 指数: 43 · 论文数: 214
N
Neil A. Duffie
H 指数: 27 · 论文数: 112
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