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Chih‐Ming Chen

national chung hsing university

37H指数
315论文数
5.7K被引数
收录论文 112
发表时间
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Corrosion of electroplated Cu in photoresist stripper电镀铜在光刻胶剥离液中的腐蚀
errMaterials Science in Semiconductor Processing
IF4.6
err2026-04-22
err0
PREAI
errYen-Ju Chu; Xin-You Ye; Zong-Hao Yang; Yee‐Wen Yen; Chih-Ming Chen
err分享
err收藏
Samarium-engineered Ni–Co–V spinel oxides for long-term alkaline electrochemical water splitting钐工程化Ni–Co–V尖晶石氧化物用于长期碱性电化学水分解
errInternational Journal of Hydrogen Energy
IF8.3
err2026-01-12
err0
PREAI
errMahalakshmi Vedanarayanan; Chandrasekaran Pitchai; Chih-Ming Chen
err分享
err收藏
Co-silanization engineering to construct molecular diffusion barrier for copper metallization on silicon硅烷化共处理工程构建用于硅上铜金属化的分子扩散屏障
errJournal of the Taiwan Institute of Chemical Engineers
IF6.3
err2026-01-03
err0
PREAI
errTzu-Yu Chu; Chi-Chien Chang; Chun-Jen Huang; Zhen-Yi Wu; Ming-Tzer Lin; Chih-Ming Chen
err分享
err收藏
Liquid/Solid Interfacial Reactions Between Lead-Free Solders and Cu-6.01wt.% Sn-0.12wt.%P Alloy无铅焊料与Cu-6.01wt.% Sn-0.12wt.%P合金之间的液/固界面反应
errJournal of Electronic Materials
IF2.5
err2025-12-01
err0
PREAI
errYen, Yee-wen; Ramadhani, Mavindra; Chen, Chih-Ming; Huang, Yu-En; Hsiao, Hsien-Ming; Chiu, Hsiang Yu
err分享
err收藏
CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES铜-铜机械键合用于下一代电子芯片的三维集成：界面机制、表面工程和新兴低温策略
errFACTA UNIVERSITATIS-SERIES MECHANICAL ENGINEERING
IF11.8
err2025-12-01
err1
PREAI
errChoi, Sooyong; Chen, Chih-Ming; Hwang, Byungil
err分享
err收藏
Unidirectional cross-interface grain growth in Cu–Cu direct bondingCu–Cu直接键合中的单向界面晶粒生长
errJournal of Materials Research and Technology
IF6.6
err2025-08-11
err0
errOAAI
errJia-Syuan Chang; Jenn-Ming Song; Chih-Ming Chen
err分享
err收藏
Effect of entropy stabilization on high entropy brownmillerites for boosting oxygen evolution reaction熵稳定作用对高熵布朗米勒石促进氧析出反应的影响
errElectrochimica Acta
IF5.6
err2025-07-20
err0
PREAI
errChandrasekaran Pitchai; Mahalakshmi Vedanarayanan; Yi-Cheng Kuo; Heng-Jui Liu; Chih-Ming Chen
err分享
err收藏
Ex-situ observation of microstructure evolution and electrical resistance transition in micro joints under electron current stressing外场观察微连接中微观结构演变和电学电阻转变的电子电流应力实验
errSURFACE & COATINGS TECHNOLOGY
IF6.1
err2025-06-01
err0
PREAI
errWu, Yi-An; Yang, Zhao-Yu; Hsu, Pei-Chia; Chen, Chih-Ming; Shen, Yu-An; Ho, Cheng-En
err分享
err收藏
Bismuth-induced microstructural evolution and dissolution during aging: Enhancing mechanical properties, thermal stability, and wettability of Sn-9Zn alloy铋诱导的微观结构演变和时效过程中的溶解：增强Sn-9Zn合金的力学性能、热稳定性和润湿性
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-05-01
err0
PREAI
errKao, Hao-Zhe; Liang, Chih-Ming; Chen, Chih-Ming; Ho, Cheng-En; Shen, Yu-An
err分享
err收藏
Photocurrent enhancement in dye-sensitized solar cells by polyimide covalent organic frameworks decorated with silver nanoparticles
errJOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A-CHEMISTRY
IF4.7
err2025-02-01
err5
PREAI
errChen, Yu-Hsuan; Huang, Chao-Fang; Lo, Ting-Yu; Sil, Manik Chandra; Chen, Chih-Ming
err分享
err收藏
Low-temperature soldering using Sn/Bi electrodeposited bilayer
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-02-01
err0
PREAI
errWang, Wei-Li; Cherng, Sheng-Jye; Huang, Yu-Ting; Gao, Runhua; Tatsumi, Hiroaki; Nishikawa, Hiroshi; Chen, Chih-Ming
err分享
err收藏
Investigating microstructure and interfacial stability of Bi-enhanced Sn-9Zn alloy on electroplated Cu during aging
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-02-01
err0
PREAI
errLin, Chan-Ying; Oh, Minho; Kobayashi, Equo; Chen, Chih-Ming; Shen, Yu-An
err分享
err收藏
Electrochemically enhanced oxygen evolution and urea oxidation reactions with advanced high-entropy LDH nanoneedles
errSUSTAINABLE ENERGY & FUELS
IF4.1
err2025-01-01
err0
PREAI
errPitchai, Chandrasekaran; Chen, Chih-Ming
err分享
err收藏
Interfacial reaction and thermomigration of copper/indium joints
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2025-01-01
err0
errOAAI
errHuang, Zi-Yu; Chu, Yen-Ju; Ho, Cheng-En; Shen, Yu-An; Chen, Chih-Ming
err分享
err收藏
A composite electrocatalytic poly(3,4-ethylenedioxythiophene) film incorporated with silver nanowires for bifacial dye-sensitized solar cells结合银纳米线的复合电催化聚 (3，4-乙撑二氧噻吩) 膜用于双面染料敏化太阳能电池
errELECTROCHIMICA ACTA
IF5.6
err2024-12-01
err0
PREAI
errLo, Yu-Hsuan; Chen, Yu-Hsuan; Huang, Chao-Fang; Pitchai, Chandrasekaran; Liu, Wen-Shiuan; Chang, Cheng-Chung; Chen, Chih-Ming
err分享
err收藏
Strong grain size effect on the liquid/solid reactions between molten solder and electroplated Cu
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2024-12-01
err4
PREAI
errHuang, Pin-Yu; Chung, Man-Hsuan; Jhan, Jhih-Jhu; Hwang, Byungil; Chen, Chih-Ming
err分享
err收藏
Engineering of uniform anisotropic interconnection system with polyimide films for flexible electronics用于柔性电子的聚酰亚胺薄膜均匀各向异性互连系统的工程设计
errAIN SHAMS ENGINEERING JOURNAL
IF5.9
err2024-12-01
err0
errOAAI
errHa, Heebo; Lee, Byunghoon; Choi, Sooyong; Qaiser, Nadeem; Kwon, Sera; Choi, Zungsun; Chen, Chih-Ming; Hwang, Byungil
err分享
err收藏
Emergence and transmission of the high-risk ST78 clone of OXA-48-producing Enterobacter hormaechei in a single hospital in Taiwan
errEMERGING MICROBES & INFECTIONS
IF7.5
err2024-09-22
err0
errOAAI
errChen, Chih-Ming; Tang, Hui-Ling; Chen, Ying-Tsong; Ke, Se-Chin; Lin, Yi-Pei; Chen, Bo-Han; Teng, Ru-Hsiou; Chiou, Chien-Shun; Lu, Min-Chi; Lai, Yi-Chyi
err分享
err收藏
Electrochemical oxidation of seawater using vanadium facilitated quaternary layered double hydroxides integrated with sulfur-doped carbon dots
errELECTROCHIMICA ACTA
IF5.6
err2024-09-01
err2
PREAI
errVedanarayanan, Mahalakshmi; Pitchai, Chandrasekaran; Chen, Chih-Ming; Gopalakrishnan, Sethuraman Mathur
err分享
err收藏
Efficient Hydrogen and Oxygen Evolution: Dual-Functional Electrocatalyst of Zinc Iron Layered Double Hydroxides and Nickel Cobalt Sulfides on Nickel Foam for Seawater Splitting
errACS APPLIED ENERGY MATERIALS
IF5.5
err2024-08-20
err1
errOAAI
errVedanarayanan, Mahalakshmi; Chen, Chih-Ming; Sethuraman, Mathur Gopalakrishnan
err分享
err收藏

研究方向

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合作学者
合作期刊
刘彬 封面图
刘彬 (Bin Liu)
H 指数: 142 · 论文数: 1.7K
P
Pi‐Tai Chou
H 指数: 108 · 论文数: 1.2K
P
Po‐Ren Hsueh
H 指数: 106 · 论文数: 1.3K
Y
Yün Chi
H 指数: 93 · 论文数: 858
W
Wallace C. H. Choy
H 指数: 74 · 论文数: 486
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