Μ. Y. Tsai - Publications, H-index & Citations

Μ. Y. Tsai

chang gung university

30H指数

171论文数

3.6K被引数

收录论文 16

发表时间

Biaxial bending strength of TGV glass substrates in ring-on-ring tests: Stress analysis and experimental investigation 环压测试中TGV玻璃基板的抗双轴弯曲强度：应力分析与实验研究

Materials Science in Semiconductor Processing

IF4.6

2026-09-11

PREAI

M.Y. Tsai; C.T. Chang; W.Y. Chen; T. Onishi

A theoretical solution for a novel load-on-elastic-foundation (LoEF) uniaxial bending test and its application to strength evaluation of thin silicon dies 一种新型弹性地基荷载（LoEF）单轴弯曲测试的理论解及其在薄硅片强度评估中的应用

Materials Science in Semiconductor Processing

IF4.6

2026-02-26

PREAI

P.J. Hsieh; M.Y. Tsai

Biaxial bending strength of thin silicon dies in the ring-on-ring test by considering geometric nonlinearity and material anisotropy

MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

IF4.6

2025-02-01

PREAI

Tsai, M. Y.; Kuo, T. C.; Hsieh, P. J.; Huang, P. S.

Comparing the Performance of Rolled Steel and 3D-Printed 316L Stainless Steel 轧制钢和3d打印316L不锈钢的性能比较

MICROMACHINES

IF3

2024-02-29

OAAI

Lin, Yao-Tsung; Tsai, Ming-Yi; Yen, Shih-Yu; Lung, Guan-Hua; Yei, Jin-Ting; Hsu, Kuo-Jen; Chen, Kai-Jung

Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes

MATERIALS

IF3.2

2023-04-19

OAAI

Tsai, Ming-Yi; Wang, Yu-Wen; Lu, Yen-Jui; Lu, Tzu-Min; Chung, Shu-Tan

Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges 通过应变仪测量的倒装芯片和2.5D IC封装的热致变形和翘曲

MATERIALS

IF3.2

2021-07-02

OAAI

Tsai, Ming-Yi; Wang, Yu-Wen; Liu, Chia-Ming

Polishing Characteristics of Hydrophilic Pad in Chemical Mechanical Polishing Process 化学机械抛光过程中亲水抛光垫的抛光特性

MATERIALS AND MANUFACTURING PROCESSES

IF4.7

2012-06-01

PREAI

Tsai, Ming-Yi; Chen, Chiou-Yuan; He, Ying-Rong

Development of a micro-graphite impregnated grinding wheel 一种微石墨浸渍砂轮的研制

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

IF18.8

2012-05-01

PREAI

Tsai, Ming-Yi; Jian, Shi-Xing

Combined ultrasonic vibration and chemical mechanical polishing of copper substrates

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

IF18.8

2012-02-01

PREAI

Tsai, Ming-Yi; Yang, Wei-Zheng

Investigation of a Novel Diamond Disk's Effect on Pad Topography in Oxide Chemical Mechanical Polishing

MATERIALS AND MANUFACTURING PROCESSES

IF4.7

2010-12-03

PREAI

Tsai, Ming-Yi; Peng, Jian-Da

An investigation into the stresses in double-lap adhesive joints with laminated composite adherends

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

IF3.8

2010-12-01

OAAI

Tsai, M. Y.; Morton, J.

Characteristics of chemical mechanical polishing using graphite impregnated pad 石墨浸渍垫化学机械抛光的特点

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

IF18.8

2010-12-01

PREAI

Tsai, Ming-Yi; Yan, Li-Wei

Polycrystalline diamond shaving conditioner for CMP pad conditioning

JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

IF7.5

2010-06-01

PREAI

Tsai, Ming-Yi

Expression of DAZL1 in human female gonad

HUMAN REPRODUCTION

IF6.1

1999-06-01

OAAI

Tsai, MY; Chang, SY; Lo, HY; Cheng, YS

Improved theoretical solutions for adhesive lap joints

INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES

IF3.8

1998-04-01

340

PREAI

Tsai, MY; Oplinger, DW; Morton, J

Absence of mutations in the regulatory domain of the gap junction protein connexin 43 in patients with visceroatrial heterotaxy

HEART

IF4.4

1997-04-01

OAAI

Splitt, MP; Tsai, MY; Burn, J; Goodship, JA

研究方向