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Ashutosh Sharma

Ajou University

40H指数
212论文数
5.3K被引数
收录论文 75
发表时间
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Correction: Sharma et al. Recent Advancements in AI-Enabled Smart Electronics Packaging for Structural Health Monitoring. Metals 2021, 11, 1537更正：Sharma 等人，人工智能赋能的智能电子封装在结构健康监测中的最新进展。Metals 2021, 11, 1537
errMetals
IF2.5
err2026-05-08
err0
errOAAI
errVinamra Bhushan Sharma; Saurabh Tewari; Susham Biswas; Bharat Lohani; Umakant Dhar Dwivedi; Deepak Dwivedi; Ashutosh Sharma; Jae Pil Jung
err分享
err收藏
Laser solder ball jetting of SAC305/ENIG joints: Microstructure, kinetics, and reliability under multiple reflow cyclesSAC305/ENIG焊点的激光焊料球喷射：微观结构、动力学及多回流循环下的可靠性
errIntermetallics
IF4.8
err2025-11-28
err0
PREAI
errSeungchan Ka; Deborah Bae; Ashutosh Sharma; Jae Pil Jung; Hyun-Sik Kim
err分享
err收藏
Layered and Polycrystalline Architectures of Boron Nitride Unveiled by Electron Microscopy
errKOREAN JOURNAL OF MATERIALS RESEARCH
IF0.3
err2025-11-01
err0
PREAI
errYadav, Ankita; Kumar, Mukesh; Sharma, Ashutosh
err分享
err收藏
MXene nanomaterials in action: Revolutionizing antibacterial strategies and smart wound healingMXene纳米材料的应用：革新抗菌策略和智能伤口愈合
errSustainable Materials and Technologies
IF9.2
err2025-08-13
err0
PREAI
errMadhu Yadav; Mukesh Kumar; Ashutosh Sharma; Jamilur R. Ansari
err分享
err收藏
Effect of laser beam power on microstructure evolution and interface kinetics of laser-soldered mini-LEDs for MEMS packaging激光束功率对用于MEMS封装的激光焊mini-LEDs微观结构演变和界面动力学的影响
errmaterials science materials in electronics
IF0
err2025-08-07
err0
PREAI
errJun Ho Ku; Sri Harini Rajendran; Ashutosh Sharma; Jae Pil Jung; Hyun-Sik Kim
err分享
err收藏
Advanced through-glass via (TGV) electro-filling and solder bumping for miniaturized 3D MEMS packaging用于微型化3D MEMS封装的先进玻璃通孔（TGV）电填充电镀与焊料凸点技术
errJournal of Alloys and Compounds
IF6.3
err2025-07-29
err0
PREAI
errChul Hwa Jung; Jae Pil Jung; Ashutosh Sharma; Hyun-Sik Kim
err分享
err收藏
Initial hydrogenation in multiphase TiFeCoNiCu high-entropy alloy for hydrogen storage多相TiFeCoNiCu高熵合金的初始氢化作用及其在储氢中的应用
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2025-04-01
err0
PREAI
errLee, Hansung; Dewangan, Sheetal Kumar; Sharma, Ashutosh
err分享
err收藏
Entropy engineering stimulates the thermoelectric performance of FeCoNiAlSix high-entropy alloys
errMATERIALS RESEARCH BULLETIN
IF5.7
err2025-02-01
err0
PREAI
errNagarjuna, Cheenepalli; Lee, Hansung; Dewangan, Sheetal Kumar; Madavali, Babu; Sharma, Ashutosh; Ahn, Byungmin
err分享
err收藏
Progress in niobium-derived MXenes: synthesis, properties and applications钽基MXenes的进展：合成、性质与应用
errCRYSTENGCOMM
IF2.6
err2025-01-01
err0
PREAI
errYadav, Madhu; Kumar, Mukesh; Sharma, Ashutosh
err分享
err收藏
In situ ex-solution of CoFeRu solid solution nanoparticles from non-stoichiometric (La0.8Sr0.2)0.9Co0.1Fe0.8Ru0.1O3-δ perovskite for hydrogen gas sensor
errSENSORS AND ACTUATORS B-CHEMICAL
IF7.7
err2025-01-01
err2
errOAAI
errSharma, Bharat; Kumar, Mukesh; Sharma, Ashutosh
err分享
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Taguchi Optimization of Wetting, Thermal and Mechanical Properties of Sn-1.0wt.%Ag-0.5wt.%Cu Alloys Modified with Bi and Sb
errMATERIALS
IF3.2
err2024-06-01
err0
errOAAI
errHong, Sung-joon; Sharma, Ashutosh; Jung, Jae Pil
err分享
err收藏
Review of Ti3C2T x MXene Nanosheets and their ApplicationsTi3C2T x MXene纳米片及其应用研究进展
errACS APPLIED NANO MATERIALS
IF5.5
err2024-05-01
err4
PREAI
errYadav, Madhu; Kumar, Mukesh; Sharma, Ashutosh
err分享
err收藏
Highly sensitive and selective nanoengineered PtO2-BNNT heterostructures for ppb level ammonia gas sensing
errSENSORS AND ACTUATORS B-CHEMICAL
IF7.7
err2024-02-01
err4
PREAI
errSharma, Bharat; Karuppasamy, K.; Srivastava, Ashok Kumar; Alfantazi, Akram; Sharma, Ashutosh
err分享
err收藏
Unfolding the hydrogen gas sensing mechanism across 2D Pnictogen/graphene heterostructure sensors
errSENSORS AND ACTUATORS B-CHEMICAL
IF7.7
err2024-01-01
err4
PREAI
errKumar, Neeraj; Jasani, Jaykumar; Sonvane, Yogesh; Korvink, J. G.; Sharma, Ashutosh; Sharma, Bharat
err分享
err收藏
Taguchi optimized wear and self-lubricating properties of Al-alloy composite reinforced with hybrid B4C-MoS2 particulates
errJOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
IF6.6
err2024-01-01
err4
errOAAI
errKumar, Neeraj; Sharma, Ashutosh; Manoj, M. K.; Ahn, Byungmin
err分享
err收藏
Advanced 3D Through-Si-Via and Solder Bumping Technology: A Review
errMATERIALS
IF3.2
err2023-12-14
err5
errOAAI
errJang, Ye Jin; Sharma, Ashutosh; Jung, Jae Pil
err分享
err收藏
Review on applications of artificial neural networks to develop high entropy alloys: A state-of-the-art technique人工神经网络在高熵合金开发中的应用综述: 一项最新技术
errMATERIALS TODAY COMMUNICATIONS
IF4.5
err2023-12-01
err15
PREAI
errDewangan, Sheetal Kumar; Nagarjuna, Cheenepalli; Jain, Reliance; Kumawat, Rameshwar L.; Kumar, Vinod; Sharma, Ashutosh; Ahn, Byungmin
err分享
err收藏
Room-temperature response of MOF-derived Pd@PdO core shell/γ-Fe2O3 microcubes decorated graphitic carbon based ultrasensitive and highly selective H2 gas sensor
errJOURNAL OF COLLOID AND INTERFACE SCIENCE
IF9.7
err2023-12-01
err16
PREAI
errKaruppasamy, K.; Sharma, Ashutosh; Vikraman, Dhanasekaran; Lee, Yoon-A.; Sivakumar, Periyasamy; Korvink, Jan G.; Kim, Hyun-Seok; Sharma, Bharat
err分享
err收藏
Prediction of nanoindentation creep behavior of tungsten-containing high entropy alloys using artificial neural network trained with Levenberg-Marquardt algorithm用levenberg-marquardt算法训练的人工神经网络预测含钨高熵合金的纳米压痕蠕变行为
errJOURNAL OF ALLOYS AND COMPOUNDS
IF6.3
err2023-10-01
err21
PREAI
errDewangan, Sheetal Kumar; Sharma, Ashutosh; Lee, Hansung; Kumar, Vinod; Ahn, Byungmin
err分享
err收藏
Dry sliding wear and friction behavior of powder metallurgy FeCoNiAlSi0.2 high-entropy alloys
errWEAR
IF6.1
err2023-10-01
err22
PREAI
errLee, Hansung; Sharma, Ashutosh; Ahn, Byungmin
err分享
err收藏

研究方向

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合作学者
合作期刊
N
Neeraj Kumar
H 指数: 130 · 论文数: 1.5K
J
Jung‐Hyun Lee
H 指数: 68 · 论文数: 673
H
Hyun‐Seok Kim
H 指数: 62 · 论文数: 448
A
Akram Alfantazi
H 指数: 54 · 论文数: 402
J
Jan G. Korvink
H 指数: 53 · 论文数: 719
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