Min Park - Publications, H-index & Citations

Min Park

samsung electronics

9H指数

19论文数

315被引数

收录论文 9

发表时间

Interfacial coordination-driven crystalline engineering of phase change material using cellulose nanofibers for ultra-high-density thermal energy storage 利用纤维素纳米纤维通过界面配位驱动的结晶工程制备相变材料，用于超高密度热能存储

Composites Part A-Applied Science and Manufacturing

IF8.9

2026-09-27

PREAI

Wondu Lee; Taeyun Hwang; Min Park; Pei-Chen Su; Jooheon Kim

Exploring synthesis techniques for an imidazole-based one-component epoxy latent curing agent: Chemical capping and mechano-chemical capsuling 探索基于咪唑的单组分环氧潜伏性固化剂的合成技术: 化学封端和机械化学封端

CHEMICAL ENGINEERING JOURNAL

IF13.2

2024-11-01

OAAI

Jang, Han Gyeol; Lim, Deok Jae; An, Sohyun; Park, Jong Hyuk; Park, Min; Park, Jinwoo; Park, Hyungbum; Kim, Byeong-Su; Lee, Doh C.; Kim, Jaewoo

Ultrahigh strength, modulus, and conductivity of graphitic fibers by macromolecular coalescence

SCIENCE ADVANCES

IF12.5

2022-04-22

OAAI

Lee, Dongju; Kim, Seo Gyun; Hong, Seungki; Madrona, Cristina; Oh, Yuna; Park, Min; Komatsu, Natsumi; Taylor, Lauren W.; Chung, Bongjin; Kim, Jungwon; Hwang, Jun Yeon; Yu, Jaesang; Lee, Dong Su; Jeong, Hyeon Su; You, Nam Ho; Kim, Nam Dong; Kim, Dae-Yoon; Lee, Heon Sang; Lee, Kun-Hong; Kono, Junichiro; Wehmeyer, Geoff; Pasquali, Matteo; Vilatela, Juan J.; Ryu, Seongwoo; Ku, Bon-Cheol

Enhanced electrical conductivity of polymer microspheres by altering assembly sequence of two different shaped conductive fillers

COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

IF8.9

2021-10-01

OAAI

Cho, Young Min; Lee, Sang-Soo; Park, Chong Rae; Kim, Tae Ann; Park, Min

Solvent-free encapsulation of curing agents for high performing one-component epoxy adhesives

COMPOSITES PART B-ENGINEERING

IF14.2

2020-12-01

PREAI

Jee, Sung Min; Ahn, Cheol-Hee; Park, Jong Hyuk; Kim, Tae Ann; Park, Min