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科言猫学术研究的AI总结
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Yuzi Han

hong kong university of science & technology

5H指数
9论文数
127被引数
收录论文 4
发表时间
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Bubble dynamics in microfluidic electroless copper interconnection for advanced 3D chip integration微流控自催化铜互连中的气泡动力学研究及其在先进3D芯片集成中的应用
errInternational Communications in Heat and Mass Transfer
IF6.4
err2026-01-02
err0
PREAI
errYonglin Zhang; Yuzi Han; Peilun Yao; Zunyu Guan; Hongxu Zhan; Haibin Chen; Jinglei Yang
err分享
err收藏
Programming Interfacial Polymerization: Machine Learning Unveils Quantitative Rational Design Rules for Microcapsules and Beyond界面聚合编程：机器学习揭示微胶囊及更广泛应用的定量理性设计规则
errAdvanced Materials
IF26.8
err2026-01-01
err1
PREAI
errHan, Yuzi; Du, Wutong; Zhang, Yonglin; Qiu, Cheng; Law, Mankwan; Zhao, Ying; Tang, Ben Zhong; Wang, Yang; Yang, Jinglei
err分享
err收藏
Microfluidic electroless deposition for uniform stacking chip interconnection: Simulation framework and experimental validation
errCHEMICAL ENGINEERING JOURNAL
IF13.2
err2022-04-01
err13
PREAI
errZhang, Yonglin; Yao, Peilun; Han, Yuzi; Yang, Jun; Chen, Haibin; Wu, Jingshen; Yang, Jinglei
err分享
err收藏
An even-load-distribution design for composite bolted joints using a novel circuit model and neural network使用新型电路模型和神经网络的复合材料螺栓接头的均匀载荷分布设计
errCOMPOSITE STRUCTURES
IF7.1
err2022-01-01
err14
PREAI
errQiu, Cheng; Han, Yuzi; Shanmugam, Logesh; Jiang, Fengyang; Guan, Zhidong; Du, Shanyi; Yang, Jinglei
err分享
err收藏

研究方向

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合作学者
合作期刊
J
Jinglei Yang
H 指数: 68 · 论文数: 526
S
Shanyi Du
H 指数: 34 · 论文数: 240
Z
Zhidong Guan
H 指数: 24 · 论文数: 145
Y
Yonglin Zhang
H 指数: 19 · 论文数: 161
L
Logesh Shanmugam
H 指数: 17 · 论文数: 27
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