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收藏Electronic quality factor for thermoelectrics热电材料的电子品质因数
Zhang, Xinyue; Bu, Zhonglin; Shi, Xuemin; Chen, Zhiwei; Lin, Siqi; Shan, Bing; Wood, Maxwell; Snyder, Alemayouh H.; Chen, Lidong; Snyder, G. Jeffrey; Pei, Yanzhong 分享 收藏 Expression of interfacial Seebeck coefficient through grain boundary engineering with multi-layer graphene nanoplatelets多层石墨烯纳米片晶界工程界面塞贝克系数的表达Lin, Yue; Wood, Maxwell; Imasato, Kazuki; Kuo, Jimmy Jiahong; Lam, David; Mortazavi, Anna N.; Slade, Tyler J.; Hodge, Stephen A.; Xi, Kai; Kanatzidis, Mercouri G.; Clarke, David R.; Hersam, Mark C.; Snyder, G. Jeffrey 分享 收藏 Understanding the thermally activated charge transport in NaPbmSbQm+2 (Q = S, Se, Te) thermoelectrics: weak dielectric screening leads to grain boundary dominated charge carrier scatteringSlade, Tyler J.; Grovogui, Jann A.; Kuo, Jimmy Jiahong; Anand, Shashwat; Bailey, Trevor P.; Wood, Maxwell; Uher, Ctirad; Snyder, G. Jeffrey; Dravid, Vinayak P.; Kanatzidis, Mercouri G. 分享 收藏 分享 收藏 
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