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Daniel S. Engstrøm

Loughborough University

23H指数
57论文数
1.5K被引数
收录论文 21
发表时间
Microwave backscatter enhancement using radial anisotropy in biomimetic core-shell spheres
err2023-06-20
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errFinlayson, Ewan D.; Gallagher, Cameron P.; Whittaker, Thomas; Goulas, Athanasios; Engstrom, Daniel S.; Whittow, William; Sambles, J. Roy; Hibbins, Alastair P.; Powell, Alexander W.
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Hot ceramic lithography of silica-based ceramic cores: The effect of process temperature on vat-photopolymierisation
err2022-10-01
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errOzkan, Basar; Sameni, Farzaneh; Goulas, Athanasios; Karmel, Sarah; Engstrom, Daniel S.; Sabet, Ehsan
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Synthesis and dielectric characterisation of a low loss BaSrTiO3/ABS ceramic/polymer composite for fused filament fabrication additive manufacturing
err2022-07-01
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errGoulas, Athanasios; McGhee, Jack R.; Whittaker, Tom; Ossai, Daisy; Mistry, Esha; Whittow, Will; Vaidhyanathan, Bala; Reaney, Ian M.; Vardaxoglou, John (Yiannis) C.; Engstrom, Daniel S.
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A systematic study of vat-polymerization binders with potential use in the ceramic suspension 3D printing
err2021-11-01
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errOezkan, Basar; Sameni, Farzaneh; Karmel, Sarah; Engstrom, Daniel S.; Sabet, Ehsan
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3D conformal bandpass millimeter-wave frequency selective surface with improved fields of view
err2021-06-18
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errAlvarez, H. Fernandez; Cadman, Darren A.; Goulas, Athanasios; Gomez, M. E. de Cos; Engstrom, Daniel S.; Vardaxoglou, J. C.; Zhang, Shiyu
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Direct ink writing of bismuth molybdate microwave dielectric ceramics
err2021-03-01
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errGoulas, Athanasios; Chi-Tangyie, George; Zhang, Shiyu; Wang, Dawei; Ketharam, Annapoorani; Vaidhyanathan, Bala; Reaney, Ian M.; Cadman, Darren A.; Whittow, Will; Vardaxoglou, John (Yiannis) C.; Engstrom, Daniel S.
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Microstructure and microwave dielectric properties of 3D printed low loss Bi2Mo2O9 ceramics for LTCC applications
err2020-12-01
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PREAI
errGoulas, Athanasios; Chi-Tangyie, George; Wang, Dawei; Zhang, Shiyu; Ketharam, Annapoorani; Vaidhyanathan, Bala; Reaney, Ian M.; Cadman, Darren A.; Whittow, Will G.; Vardaxoglou, John (Yiannis) C.; Engstrom, Daniel S.
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Indium tin oxide nanowires manufactured via printing and laser irradiation
err2020-12-01
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errMcGhee, J. R.; Goulas, A.; Southee, D. J.; Sagu, J. S.; Engstrom, D. S.; Wang, J.; Hutt, D. A.; Evans, P. S. A.; Zhou, Z.; Wijayantha, K. G. U.; Conway, R.; Carmalt, C. J.
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3D-printable zwitterionic nano-composite hydrogel system for biomedical applications
err2020-10-29
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errSallstrom, Nathalie; Capel, Andrew; Lewis, Mark P.; Engstrom, Daniel S.; Martin, Simon
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The effect of print speed and material aging on the mechanical properties of a self-healing nanocomposite hydrogel
err2020-10-01
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errSallstrom, Nathalie; Goulas, Athanasios; Martin, Simon; Engstrom, Daniel S.
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Fused filament fabrication of functionally graded polymer composites with variable relative permittivity for microwave devices
err2020-08-01
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errGoulas, Athanasios; Zhang, Shiyu; McGhee, Jack R.; Cadman, Darren A.; Whittow, Will G.; Vardaxoglou (Yiannis), John C.; Engstrom, Daniel S.
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Printability of photo-sensitive nanocomposites using two-photon polymerization使用双光子聚合的光敏纳米复合材料的可印刷性
err2020-05-15
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errYeung, Ka-Wai; Dong, Yuqing; Chen, Ling; Tang, Chak-Yin; Law, Wing-Cheung; Tsui, Gary Chi-Pong; Engstrom, Daniel S.
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Layer-dependent properties of material extruded biodegradable Polylactic Acid
err2020-04-01
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errEkinci, Alper; Johnson, Andrew A.; Gleadall, Andy; Engstrom, Daniel S.; Han, Xiaoxiao
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Multi-material additive manufacturing of low sintering temperature Bi2Mo2O9 ceramics with Ag floating electrodes by selective laser burnout
err2020-01-06
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errGheisari, Reza; Chamberlain, Henry; Chi-Tangyie, George; Zhang, Shiyu; Goulas, Athanasios; Lee, Chih-Kuo; Whittaker, Tom; Wang, Dawei; Ketharam, Annapoorani; Ghosh, Avishek; Vaidhyanathan, Bala; Whittow, Will; Cadman, Darren; Vardaxoglou, Yiannis C.; Reaney, Ian M.; Engstrom, Daniel S.
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Ultrasonic additive manufacturing using feedstock with build-in circuitry for 3D metal embedded electronics
err2019-10-01
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errBournias-Varotsis, Alkaios; Han, Xiaoxiao; Harris, Russell A.; Engstrom, Daniel S.
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Ultrasonic Additive Manufacturing as a form-then-bond process for embedding electronic circuitry into a metal matrix
err2018-04-01
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errBournias-Varotsis, Alkaios; Friel, Ross J.; Harris, Russell A.; Engstrom, Daniel S.
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