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D

Daniel Wheeler

Ohio State University

31H指数
131论文数
4.3K被引数
收录论文 23
发表时间
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Active learning for regression of structure-property mapping: the importance of sampling and representation
errDIGITAL DISCOVERY
IF5.6
err2024-01-01
err0
errOAAI
errLiu, Hao; Yucel, Berkay; Ganapathysubramanian, Baskar; Kalidindi, Surya R.; Wheeler, Daniel; Wodo, Olga
err分享
err收藏
Phase field benchmark problems for nucleation
errCOMPUTATIONAL MATERIALS SCIENCE
IF3.3
err2021-06-01
err19
errOAAI
errWu, W.; Montiel, D.; Guyer, J. E.; Voorhees, P. W.; Warren, J. A.; Wheeler, D.; Granasy, L.; Pusztai, T.; Heinonen, O. G.
err分享
err收藏
Microstructure-based knowledge systems for capturing process-structure evolution linkages基于微观结构的知识系统，用于捕获过程-结构演化联系
errCURRENT OPINION IN SOLID STATE & MATERIALS SCIENCE
IF13.4
err2017-06-01
err40
errOAAI
errBrough, David B.; Wheeler, Daniel; Warren, James A.; Kalidindi, Surya R.
err分享
err收藏
Influence of Analysis Method on the Experimentally Observed Capacitance at the Gold-Ionic Liquid Interface
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2014-02-25
err21
PREAI
errSmall, L. J.; Wheeler, D. R.
err分享
err收藏
Spatial-Temporal Modeling of Extreme Bottom-up Filling of Through-Silicon-Vias
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2013-12-06
err72
errOAAI
errWheeler, D.; Moffat, T. P.; Josell, D.
err分享
err收藏
Formation mechanisms of self-organized core/shell and core/shell/corona microstructures in liquid droplets of immiscible alloys
errACTA MATERIALIA
IF9.3
err2013-02-01
err154
PREAI
errShi, R. P.; Wang, C. P.; Wheeler, D.; Liu, X. J.; Wang, Y.
err分享
err收藏
Modeling Extreme Bottom-Up Filling of Through Silicon Vias
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2012-01-01
err110
errOAAI
errJosell, D.; Wheeler, D.; Moffat, T. P.
err分享
err收藏
Predicting microstructure development during casting of drug-eluting coatings
errACTA BIOMATERIALIA
IF9.6
err2011-02-01
err18
PREAI
errSaylor, David M.; Guyer, Jonathan E.; Wheeler, Daniel; Warren, James A.
err分享
err收藏
Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing
errELECTROCHIMICA ACTA
IF5.6
err2007-11-01
err155
errOAAI
errMoffat, T. P.; Wheeler, D.; Kim, S.-K.; Josell, D.
err分享
err收藏
UHV STM I(V) and XPS studies of aryl diazonium molecules assembled on Si(111)
errLANGMUIR
IF3.9
err2007-03-29
err19
PREAI
errPandey, Deepak; Zemlyanov, Dmitry Y.; Bevan, Kirk; Reifenberger, Ronald G.; Dirk, Shawn M.; Howell, Steve W.; Wheeler, D. R.
err分享
err收藏
Superfilling when adsorbed accelerators are mobile
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2007-01-01
err62
PREAI
errJosell, D.; Moffat, T. P.; Wheeler, D.
err分享
err收藏
Curvature enhanced adsorbate coverage model for electrodeposition
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2006-01-01
err140
PREAI
errMoffat, TP; Wheeler, D; Kim, SK; Josell, D
err分享
err收藏
Gold superfill in submicrometer trenches: Experiment and prediction
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2006-01-01
err40
PREAI
errJosell, D; Wheeler, D; Moffat, TP
err分享
err收藏
An exact algebraic solution for the incubation period of superfill
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2004-01-01
err10
errOAAI
errJosell, D; Moffat, TP; Wheeler, D
err分享
err收藏
Influence of a catalytic surfactant on roughness evolution during film growth
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2004-01-01
err28
errOAAI
errWheeler, D; Moffat, TP; McFadden, GB; Coriell, S; Josell, D
err分享
err收藏
Electrodeposition of copper in the SPS-PEG-Cl additive system - I. Kinetic measurements: Influence of SPSSps-peg-cl添加剂体系中电沉积铜-I.动力学测量: SPS的影响
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2004-01-01
err342
PREAI
errMoffat, TP; Wheeler, D; Josell, D
err分享
err收藏
Interconnect fabrication by superconformal iodine- catalyzed chemical vapor deposition of copper
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2003-01-01
err37
PREAI
errJosell, D; Kim, S; Wheeler, D; Moffat, TP; Pyo, SG
err分享
err收藏
A mechanism for brightening - Linear stability analysis of the curvature-enhanced coverage model
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2003-01-01
err29
PREAI
errMcFadden, GB; Coriell, SR; Moffat, TP; Josell, D; Wheeler, D; Schwarzacher, W; Mallett, J
err分享
err收藏
Modeling superconformal electrodeposition using the level set method
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2003-01-01
err139
PREAI
errWheeler, D; Josell, D; Moffat, TP
err分享
err收藏
Superconformal electrodeposition of silver from a KAg(CN2)-KCN-KSeCN electrolyte
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2003-01-01
err55
PREAI
errBaker, BC; Freeman, M; Melnick, B; Wheeler, D; Josell, D; Moffat, TP
err分享
err收藏

研究方向

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合作学者
合作期刊
S
Surya R. Kalidindi
H 指数: 86 · 论文数: 474
P
Peter W. Voorhees
H 指数: 70 · 论文数: 492
D
Dmitry Zemlyanov
H 指数: 54 · 论文数: 239
B
Baskar Ganapathysubramanian
H 指数: 48 · 论文数: 452
J
James A. Warren
H 指数: 48 · 论文数: 226
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