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Chung-Lun Kuo

ming chuan university

16H指数
69论文数
2.0K被引数
收录论文 21
发表时间
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The method of two-point angular basis function for solving Laplace equation
err2019-09-01
err3
PREAI
errKuo, Chung-Lun; Yeih, Weichung; Ku, Cheng-Yu; Fan, Chia-Ming
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A 55nm SAW-Less NB-IoT CMOS Transceiver in an RF-SoC with Phase Coherent RX and Polar Modulation TXRf-soc中的55nm无SAW nb-iot CMOS收发器,具有相位相干RX和极性调制TX
err2019-06-01
err21
PREAI
errTseng, P. S.; Yang, W.; Wu, M. J.; Jin, L. M.; Li, D. P.; Low, E. C.; Hsiao, C. H.; Lin, H. T.; Yang, K. H.; Shen, S. C.; Kuo, C. M.; Heng, C. L.; Dehng, G. K.
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Numerical solution of three-dimensional Laplacian problems using the multiple scale Trefftz method
err2015-01-01
err30
PREAI
errKu, Cheng-Yu; Kuo, Chung-Lun; Fan, Chia-Ming; Liu, Chein-Shan; Guan, Pai-Chen
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Investigations on the high temperature properties of a superalloy after microstructure engineering
err2014-08-01
err8
PREAI
errYeh, A. C.; Huang, Y. H.; Tsao, T. K.; Chang, S. C.; Li, M. Y.; Kuo, S. M.; Kuo, C. M.
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Developing an advanced Si-bearing DS Ni-base superalloy
err2014-02-01
err19
PREAI
errYeh, A. C.; Yang, K. C.; Yeh, J. W.; Kuo, C. M.
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