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曹

曹军 (Jun Cao)

henan polytechnic university

14H指数
93论文数
568被引数
收录论文 31
发表时间
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Microstructure evolution and strength–conductivity synergy in Cu–2Ag alloy wires induced by high-speed large-deformation cold drawingCu–2Ag合金丝在高速大变形冷拉过程中微观结构演变及强度–导电性协同作用
errMaterials Science and Engineering A-Structural Materials Properties Microstructure and Processing
IF7
err2026-10-09
err0
errOAAI
errJunchao Zhang; Jun Cao; Liuyong He; Xiaoning Xu; Huiyi Tang; Baoan Wu; Wenjing Zhang; Haifeng Li; Xian Dong
err分享
err收藏
Investigation on FAB Morphology Evolution and Pd Redistribution Behavior in Palladium-Coated Copper Wires During Electronic Flame-Off (EFO) Process电子火焰切断（EFO）过程中镀钯铜丝的FAB形貌演变和钯再分布行为研究
errMicromachines
IF3
err2026-09-04
err0
errOAAI
errJunling Fan; Haoyang Wang; Yongzhen Sun; Jun Cao; Weilong Liu
err分享
err收藏
Resolving the bonding and electron transport dilemma for ultra-high conductivity in titanium-enhanced copper/graphene composites解决钛增强铜/石墨烯复合材料中超高导电性的键合和电子传输难题
errMaterials Today Physics
IF9.7
err2026-06-01
err0
PREAI
errSun, Bo; Cheng, Haoyan; Song, Kexing; Huang, Tao; Ma, Shuaiyu; Cui, Haojie; Lu, Kangjing; Cao, Jun; Zhou, Yanjun; Hu, Hao
err分享
err收藏
W-La2O3 alloys and related composites: preparation technology, strengthening mechanism and future prospectW-La2O3合金及其相关复合材料：制备技术、强化机制与未来展望
errJournal of Materials Research and Technology
IF6.6
err2026-04-22
err0
errOAAI
errJun Cao; Yongzhen Sun; Xiaoyu Shen; Yong Ding; Kexing Song; Guoshang Zhang
err分享
err收藏
Size Effects in Metallic Materials: From Yielding and Plastic Flow to Fracture Mechanisms and Engineering Implications金属材料中的尺寸效应：从屈服和塑性流动到断裂机制及工程应用
errJournal of Materials Research and Technology
IF6.6
err2026-03-02
err0
errOAAI
errJun Cao; Guochao Wang; SuJuan Zhong; Xian Dong; Junhua Guo; Junchao Zhang
err分享
err收藏
Effect of Hot Rolling on the Microstructure and Properties of Dispersion-Strengthened W-La Alloy热轧对分散强化W-La合金微观结构和性能的影响
errMetals 2025, Vol. 15, Page 1157
IF0
err2025-10-20
err0
errOAAI
errJunling Fan; Tianlin Zhu; Jun Cao; Yongzhen Sun; Junchao Zhang
err分享
err收藏
Investigation on the microstructure evolution and strengthening behavior of rolled bonding Cu strip
errJOURNAL OF SCIENCE-ADVANCED MATERIALS AND DEVICES
IF6.8
err2025-03-01
err1
errOAAI
errCao, Jun; Zhang, Junchao; Tang, Huiyi; Shen, Xiaoyu; Song, Kexing; Zhou, Yanjun; Cui, Chengqiang
err分享
err收藏
Oxidation resistance mechanism of copper wire regulated by nano-palladium coating
errAPPLIED SURFACE SCIENCE
IF6.9
err2025-01-01
err0
PREAI
errLi, Shaolin; Su, Hui; Song, Kexing; Zhou, Yanjun; Cao, Jun; Xiao, Lili; Cao, Fei; Ge, Chenyang; Li, Jiyuan
err分享
err收藏
Study on the Influence of Au Content and Bonding Parameters on the Free Air Ball Morphology and Bonding Reliability of Ag-Au-Pd Alloy Wire
errMICROMACHINES
IF3
err2024-12-20
err0
errOAAI
errFan, Junling; He, Fang; Chen, Bing; Zhang, Junchao; Yang, Fan; Cao, Jun; Wang, Furong
err分享
err收藏
Research Progress on Rolling Forming of Tungsten Alloy
errMATERIALS
IF3.2
err2024-09-14
err0
errOAAI
errCao, Jun; Xia, Jie; Shen, Xiaoyu; Song, Kexing; Zhou, Yanjun; Cui, Chengqiang
err分享
err收藏
A Study on the Effect of Pd Layer Thickness on the Properties of Cu-Ag Intermetallic Compounds at the Bonding Interface
errMATERIALS
IF3.2
err2024-09-01
err0
errOAAI
errFan, Junling; Yuan, Donglin; Du, Juan; Hou, Tao; Wang, Furong; Cao, Jun; Yang, Xuemei; Zhang, Yuemin
err分享
err收藏
Influence of Pd-Layer Thickness on Bonding Reliability of Pd-Coated Cu WirePd层厚度对镀Pd铜丝键合可靠性的影响
errMICROMACHINES
IF3
err2024-07-22
err2
errOAAI
errFan, Junling; Yuan, Donglin; Du, Juan; Hou, Tao; Wang, Furong; Cao, Jun; Yang, Xuemei; Zhang, Yuemin
err分享
err收藏
Interaction of Y and impurity P on the synergistic enhancement of elongation and electrical conductivity of single crystal copper rodY和杂质P的相互作用协同增强单晶铜棒的伸长率和导电性
errMATERIALS & DESIGN
IF7.9
err2024-01-01
err3
errOAAI
errGe, Chenyang; Li, Shaolin; Song, Kexing; Guo, Xiuhua; Zhou, Yanjun; Liu, Haitao; Zhang, Chaomin; Cao, Jun; Cao, Fei; Gao, Yan; Su, Hui
err分享
err收藏
Diffusion and reaction behavior of palladium coating and copper matrix prepared using a halogen-free direct coating process使用无卤直接涂覆工艺制备的钯涂层和铜基体的扩散和反应行为
errSURFACE & COATINGS TECHNOLOGY
IF6.1
err2023-12-01
err4
PREAI
errSu, Hui; Li, Shaolin; Song, Kexing; Zhou, Yanjun; Cao, Jun; Cao, Fei; Gao, Yan; Ge, Chenyang; Li, Jiyuan
err分享
err收藏
A Review of Silver Wire Bonding Techniques
errMICROMACHINES
IF3
err2023-11-20
err3
errOAAI
errAn, Bin; Zhou, Hongliang; Cao, Jun; Ming, Pingmei; Persic, John; Yao, Jingguang; Chang, Andong
err分享
err收藏
Processing and Properties of Single-Crystal Copper Wire
errMICROMACHINES
IF3
err2023-11-10
err0
errOAAI
errCao, Jun; Wu, Xuefeng; Su, Chenghao; Jia, Hewei; Sun, Yongzhen
err分享
err收藏
Study on the Effect of Cold Deformation and Heat Treatment on the Properties of Cu-Ag Alloy Wire
errMICROMACHINES
IF3
err2023-08-19
err2
errOAAI
errWu, Xuefeng; Jia, Hewei; Fan, Junling; Cao, Jun; Su, Chenghao
err分享
err收藏
Copper Wire Bonding: A Review
errMICROMACHINES
IF3
err2023-08-16
err12
errOAAI
errZhou, Hongliang; Chang, Andong; Fan, Junling; Cao, Jun; An, Bin; Xia, Jie; Yao, Jingguang; Cui, Xiaobin; Zhang, Yingchong
err分享
err收藏
Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire
errMICROMACHINES
IF3
err2023-08-12
err4
errOAAI
errZhou, Hongliang; Chang, Andong; Fan, Junling; Cao, Jun; Zhang, Yingchong; An, Bin; Xia, Jie
err分享
err收藏
Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging
errMICROMACHINES
IF3
err2023-07-31
err5
errOAAI
errZhang, Yuemin; Guo, Haiyun; Cao, Jun; Wu, Xuefeng; Jia, Hewei; Chang, Andong
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
D
David Hui
H 指数: 89 · 论文数: 912
章
章毅 (Yi Zhang)
H 指数: 52 · 论文数: 1.9K
吴
吴雪峰 (Xue-Feng Wu)
H 指数: 52 · 论文数: 413
H
Hao Hu
H 指数: 41 · 论文数: 208
杨帆 封面图
杨帆 (Fan Yang)
H 指数: 41 · 论文数: 330
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