arrow
返回
H

Hongseok Choi

University of Wisconsin System

33H指数
146论文数
4.5K被引数
收录论文 38
发表时间
C24 Ceramide Lipid Nanoparticles for Skin Wound Healing
err2025-02-12
err0
errOAAI
errLee, Ji-Hye; Kim, Jin-Hyun; Hyeon, Tong-Il; Min, Khee-Tae; Lee, Se-Young; Ko, Han-Chul; Choi, Hong-Seok; Ju, Kuk-Youn; Cho, Young-Seok; Yoon, Tae-Jong
err分享
err收藏
Failure modes and bonding strength of ultrasonically-soldered glass joints
err2022-01-01
err6
errOAAI
errBrown, Jennifer Shaffer; Wilson, Caleb; Bohlen, Charles; Choi, Hongseok; Thompson, Lonny; Bostwick, Joshua B.
err分享
err收藏
Enhanced wettability in ultrasonic-assisted soldering to glass substrates
err2021-04-01
err9
PREAI
errWilson, Caleb; Thompson, Lonny; Choi, Hongseok; Bostwick, Joshua B.
err分享
err收藏
Acoustic analysis of ultrasonic assisted soldering for enhanced adhesion
err2020-02-01
err15
PREAI
errMaassen, Ken F.; Brown, Jennifer Shaffer; Choi, Hongseok; Thompson, Lonny L.; Bostwick, Joshua B.
err分享
err收藏
Development of an open-sourced automated ultrasonic-assisted soldering system
err2019-11-01
err7
PREAI
errShaffer, J.; Maassen, K.; Wilson, C.; Tilton, P.; Thompson, L.; Choi, H.; Bostwick, J.
err分享
err收藏
Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites
err2018-03-10
err10
errOAAI
errFlorian-Algarin, David; Marrero, Raul; Li, Xiaochun; Choi, Hongseok; Suarez, Oscar Marcelo
err分享
err收藏
Reinforced thermoplastic composites with interfacial microarchitectural anchoring: Computational study
err2017-05-01
err7
PREAI
errOzsoy, Istemi B.; Choi, Hongseok; Joseph, Paul; Li, Gang; Luzinov, Igor; Zhao, Huijuan
err分享
err收藏
Urchin-like AlOOH nanostructures on Al microspheres grown via in-situ oxide template
err2014-10-01
err5
PREAI
errXu, Jiaquan; Estruga, Marc; Chen, Lianyi; Yahata, Brennan; Choi, Hongseok; Li, Xiaochun
err分享
err收藏
Rapid control of phase growth by nanoparticles
err2014-05-09
err181
errOAAI
errChen, Lian-Yi; Xu, Jia-Quan; Choi, Hongseok; Konishi, Hiromi; Jin, Song; Li, Xiao-Chun
err分享
err收藏
err分享
err收藏
Transient Temperature and Heat Flux Measurement in Ultrasonic Joining of Battery Tabs Using Thin-Film Microsensors
err2013-09-16
err49
PREAI
errLi, Hang; Choi, Hongseok; Ma, Chao; Zhao, Jingzhou; Jiang, Hongrui; Cai, Wayne; Abell, Jeffrey A.; Li, Xiaochun
err分享
err收藏
Assembly of metals and nanoparticles into novel nanocomposite superstructures
err2013-04-25
err49
errOAAI
errXu, Jiaquan; Chen, Lianyi; Choi, Hongseok; Konish, Hiromi; Li, Xiaochun
err分享
err收藏
Insertable thin film thermocouples for in situ transient temperature monitoring in ultrasonic metal welding of battery tabs
err2013-01-01
err65
PREAI
errZhao, Jingzhou; Li, Hang; Choi, Hongseok; Cai, Wayne; Abell, Jeffrey A.; Li, Xiaochun
err分享
err收藏