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收藏Review of Short-Wavelength Infrared Flip-Chip Bump Bonding Process Technology短波长红外倒装凸点键合工艺技术综述
Du, Junhao; Zhao, Xuewei; Su, Jiale; Li, Ben; Duan, Xiangliang; Dong, Tianyu; Lin, Hongxiao; Ren, Yuhui; Miao, Yuanhao; Radamson, Henry H.
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收藏CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology
Radamson, Henry H.; Miao, Yuanhao; Zhou, Ziwei; Wu, Zhenhua; Kong, Zhenzhen; Gao, Jianfeng; Yang, Hong; Ren, Yuhui; Zhang, Yongkui; Shi, Jiangliu; Xiang, Jinjuan; Cui, Hushan; Lu, Bin; Li, Junjie; Liu, Jinbiao; Lin, Hongxiao; Xu, Haoqing; Li, Mengfan; Cao, Jiaji; He, Chuangqi; Duan, Xiangyan; Zhao, Xuewei; Su, Jiale; Du, Yong; Yu, Jiahan; Wu, Yuanyuan; Jiang, Miao; Liang, Di; Li, Ben; Dong, Yan; Wang, Guilei
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收藏Ultrashallow heavily constrained quantum wells: The cradle for fully electrically controlled and microwave coupled quantum bits
Zhang, Yiwen; Li, Zonghu; Zhou, Yuchen; Ren, Yuhui; Ke, Jiahan; Su, Jiale; Song, Yanpeng; Deng, Jun; Liu, Yang; Zhang, Runze; Li, Haiou; Wang, Baochuan; Wu, Zhenhua; Luo, Jun; Kong, Zhenzhen; Cao, Gang; Guo, Guoping; Zhao, Chao; Wang, Guilei
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收藏Interface Investigation on SiGe/Si Multilayer Structures: Influence of Different Epitaxial Process ConditionsSiGe/Si多层结构的界面研究: 不同外延工艺条件的影响
Kong, Zhenzhen; Song, Yanpeng; Wang, Hailing; Liu, Xiaomeng; Wang, Xiangsheng; Liu, Jinbiao; Li, Ben; Su, Jiale; Tan, Xinguang; Luan, Qingjie; Lin, Hongxiao; Ren, Yuhui; Zhang, Yiwen; Liu, Jingxiong; Li, Junfeng; Du, Anyan; Radamson, Henry H.; Zhao, Chao; Ye, Tianchun; Wang, Guilei
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收藏Undoped Strained Ge Quantum Well with Ultrahigh Mobility of Two Million
Kong, Zhenzhen; Li, Zonghu; Cao, Gang; Su, Jiale; Zhang, Yiwen; Liu, Jinbiao; Liu, Jingxiong; Ren, Yuhui; Li, Huihui; Wei, Laiming; Guo, Guo-ping; Wu, Yuanyuan; Radamson, Henry H.; Li, Junfeng; Wu, Zhenhua; Li, Hai-ou; Yang, Jiecheng; Zhao, Chao; Ye, Tianchun; Wang, Guilei
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