K. N. Tu - Publications, H-index & Citations

K. N. Tu

zhejiang tongtu traffic engineering co., ltd., hangzhou 310051, china

61H指数

206论文数

1.6W被引数

收录论文 46

发表时间

Synergistic Microstructures, Mechanical Properties, and Piezoresistive Performance Improvement of Nanoengineered Cementitious Composites by CNT and GNP CNT和GNP纳米工程水泥基复合材料的协同微观结构、力学性能和压阻性能提升

Buildings 2025, Vol. 15, Page 4104

IF3.1

2025-11-18

OAAI

Kebiao Tu; Yeqing Zhang; Junjian Wang; Haiyan Yang; Jin Tao; Qiang Zeng

Large-scale multimodal model based embodied intelligent robots: A survey 基于大型多模态模型的具身智能机器人：综述

Engineering Applications of Artificial Intelligence

IF8

2025-11-12

PREAI

Kairong Tu; Xiaoguang Ma; Zhenxing Qian; Puhong Duan

Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit 三维集成电路中不朽微凸块内Al走线与Cu籽晶层间互扩散引起的电迁移失效

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2025-05-01

OAAI

Yao, Yifan; An, Yuxuan; Tu, K. N.

Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging 通过脱合金法制备纳米多孔-纳米孪晶Cu及其在高功率器件封装中的应用

JOURNAL OF ALLOYS AND COMPOUNDS

IF6.3

2025-04-01

PREAI

Lu, Wan-Hsin; Tran, Dinh-Phuc; Lin, Huai-En; Shen, Guan-You; Chen, Bo-Yan; Lee, Kang-Ping; Tsai, Chih-Chi; Lin, Yi-Quan; Tu, K. N.; Chen, Chih

To suppress tin whisker growth by using (100)-oriented copper

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2025-03-01

OAAI

Lin, Han-Wen; Lu, Jia-Ling; Hu, Chih-Chia; Tu, K. N.; Chen, Chih

Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology

SCRIPTA MATERIALIA

IF5.6

2024-09-01

PREAI

Yao, Yifan; Gusak, A. M.; Chen, Chih; Liu, Yingxia; Tu, K. N.

Effect of Joule heating on the reliability of microbumps in 3D IC 焦耳加热对3D IC微凸块可靠性的影响

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2024-07-01

OAAI

Yao, Yifan; An, Yuxuan; Dong, Jiatong; Wang, Yang; Tu, K. N.; Liu, Yingxia

Observer-based resilient dissipativity control for discrete-time memristor-based neural networks with unbounded or bounded time-varying delays

NEURAL NETWORKS

IF6.3

2024-07-01

PREAI

Tu, Kairong; Xue, Yu; Zhang, Xian

A new approach based on system solutions for passivity analysis of discrete-time memristor-based neural networks with time-varying delays

APPLIED MATHEMATICS AND COMPUTATION

IF3.4

2024-05-01

PREAI

Tu, Kairong; Xue, Yu; Zhang, Xian

Electrodeposition of slanted nanotwinned Cu foils with high strength and ductility 具有高强度和延展性的倾斜纳米孪晶Cu箔的电沉积

ELECTROCHIMICA ACTA

IF5.6

2021-09-01

PREAI

Dinh-Phuc Tran; Chen, Kuan-Ju; Tu, K. N.; Chen, Chih; Chen, Yao-Tsung; Chung, Stream

A solid state process to obtain high mechanical strength in Cu-to-Cu joints by surface creep on (111)-oriented nanotwins Cu

JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T

IF6.6

2021-09-01

OAAI

Juang, Jing-Ye; Lu, Chia-Ling; Li, Yu-Jin; Hsu, Po-Ning; Tsou, Nien-Ti; Tu, K. N.; Chen, Chih

Effect of anisotropic grain growth on improving the bonding strength of <111>-oriented nanotwinned copper films 各向异性晶粒生长对提高 <111> 取向纳米孪晶铜膜结合强度的影响

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2021-02-01

PREAI

Chang, Shih-Yang; Chu, Yi-Cheng; Tu, K. N.; Chen, Chih

Deformation induced columnar grain rotation in nanotwinned metals 变形引起的纳米孪晶金属中的柱状晶粒旋转

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

IF7

2020-10-01

PREAI

Li, Yu-Jin; Hsu, Chia-Wei; Ting, Yi-Hsin; Tsou, Nien-Ti; Lo, Yu-Chieh; Wu, Wen-Wei; Tu, K. N.; Chen, Chih

Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

MATERIALS SCIENCE & ENGINEERING R-REPORTS

IF26.8

2019-04-01

143

PREAI

Tu, K. N.; Liu, Yingxia

Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

SCIENTIFIC REPORTS

IF3.9

2018-09-17

OAAI

Juang, Jing-Ye; Lu, Chia-Ling; Chen, Kuan-Ju; Chen, Chao-Chang A.; Hsu, Po-Ning; Chen, Chih; Tu, K. N.

Effect of Joule heating and current crowding on electromigration in mobile technology

APPLIED PHYSICS REVIEWS

IF11.6

2017-01-20

134

PREAI

Tu, K. N.; Liu, Yingxia; Li, Menglu

Scaling effect of interfacial reaction on intermetallic compound formation in Sn/Cu pillar down to 1 μm diameter

ACTA MATERIALIA

IF9.3

2016-09-01

111

PREAI

Liu, Yingxia; Chu, Ying-Ching; Tu, K. N.

Microstructure control of unidirectional growth of η-Cu6Sn5 in microbumps on ⟨1 1 1⟩ oriented and nanotwinned Cu

ACTA MATERIALIA

IF9.3

2013-08-01

PREAI

Lin, Han-wen; Lu, Chia-ling; Liu, Chien-min; Chen, Chih; Chen, Delphic; Kuo, Jui-Chao; Tu, K. N.

Metallurgical challenges in microelectronic 3D IC packaging technology for future consumer electronic products

SCIENCE CHINA-TECHNOLOGICAL SCIENCES

IF4.9

2013-05-21

PREAI

Tu, K. N.; Tian Tian

Asymmetrical growth of Cu6Sn5 intermetallic compounds due to rapid thermomigration of Cu in molten SnAg solder joints

INTERMETALLICS

IF4.8

2012-10-01

PREAI

Guo, Ming-Yung; Lin, C. K.; Chen, Chih; Tu, K. N.

研究方向