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ChaBum Lee

Texas A&M University

16H指数
84论文数
1.0K被引数
收录论文 31
发表时间
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Through-silicon vias (TSV) critical dimension (CD) characterization by shadow image modeling and analysis通过硅通孔（TSV）关键尺寸（CD）的阴影图像建模与分析
erroptics & laser technology
IF0
err2026-04-09
err0
errOAAI
errKuan Lu; Byunggi Kim; Masahiro Nomura; Jiyong Park; ChaBum Lee
err分享
err收藏
Wafer-vacuum chuck interface characterization by electrochemical impedance spectroscopy晶圆-真空吸盘界面表征的电化学阻抗谱研究
errVacuum
IF3.9
err2026-03-19
err0
errOAAI
errTanbir Sarowar; Yeaeun Lim; Md Aminul Islam; Heebum Chun; Kuan Lu; ChaBum Lee
err分享
err收藏
Wafer bonding layer characterization and inspection by Electrochemical Impedance Spectroscopy (EIS)通过电化学阻抗谱(EIS)进行晶圆键合层表征与检测
errJournal of Manufacturing Processes
IF6.8
err2026-03-16
err0
PREAI
errChangdae Kim; Heebum Chun; Tanbir Sarowar; Hyunjae Lee; ChaBum Lee
err分享
err收藏
A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor Packaging先进半导体封装中硅通孔检测与测量技术的综述
errJOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME
IF2.9
err2025-12-01
err0
PREAI
errLu, Kuan; Lin, Pengfei; Chun, Heebum; Kim, Byunggi; Nomura, Masahiro; Park, Jiyong; Lee, ChaBum
err分享
err收藏
Shadowgraphic approach to through glass vias (TGV) metrology and inspection阴影成像法在玻璃通孔（TGV）测量与检测中的应用
errOptics & Laser Technology
IF0
err2025-11-09
err0
PREAI
errKuan Lu; Yeaeun Lim; Heebum Chun; Jiyong Park; ChaBum Lee
err分享
err收藏
Laser machining process monitoring using stethoscope and neural networks基于听诊器和神经网络的激光加工过程监控
errJournal of Manufacturing Processes
IF6.8
err2025-10-14
err0
errOAAI
errHeebum Chun; Chulyong Lim; William Park; Jiyong Park; ChaBum Lee; Woochul Nam
err分享
err收藏
Multifunctional and flexible graphene oxide/silk sericin/carbon nanotube thin films on polyimide for real-time humidity sensing
errEUROPEAN POLYMER JOURNAL
IF6.3
err2025-02-01
err0
PREAI
errLee, Chanui; Cho, Hyeonho; Choi, Jihye; Lee, Chabum; Lee, Sangmin; Kim, Dong Kyu; Kim, Sunghan
err分享
err收藏
Silicon-via (Si-via) hole metrology and inspection by grayfield edge diffractometry通过灰场边缘衍射法测量和检查硅通孔 (si-via) 孔
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2025-01-01
err0
PREAI
errLu, Kuan; Kim, Byunggi; Nomura, Masahiro; Park, Jiyong; Lee, Chabum
err分享
err收藏
Effect of applied electrical potential and humidity on friction of Graphene-Based thin films
errAPPLIED SURFACE SCIENCE
IF6.9
err2024-11-01
err1
PREAI
errCho, Hyeonho; Lee, Chabum; Lee, Sangmin; Kim, Sunghan
err分享
err收藏
Line-edge-roughness characterization of photomask patterns and lithography-printed patterns光掩模图案和光刻印刷图案的线边缘粗糙度表征
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2024-06-01
err1
PREAI
errWang, Zhikun; Lin, Pengfei; Nguyen, Phuc; Wang, Jingyan; Lee, ChaBum
err分享
err收藏
Non-destructive surface and subsurface characterization of the machined parts by using fiber optic Eddy current sensor
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2023-06-01
err3
PREAI
errKim, Jungsub; Ju, Song Hyeon; Nam, Jungsoo; Kuttolamadom, Mathew; Lee, ChaBum
err分享
err收藏
Robust, Ultrathin, and Highly Sensitive Reduced Graphene Oxide/Silk Fibroin Wearable Sensors Responded to Temperature and Humidity for Physiological Detection
errBIOMACROMOLECULES
IF5.4
err2023-04-19
err13
errOAAI
errCho, Hyeonho; Lee, Chanui; Lee, ChaBum; Lee, Sangmin; Kim, Sunghan
err分享
err收藏
In-Process Cutting Temperature Monitoring Method Based on Impedance Model of Dielectric Coating Layer at Tool-Chip Interface基于刀具-切屑界面介电涂层阻抗模型的过程中切削温度监测方法
errJOURNAL OF MANUFACTURING AND MATERIALS PROCESSING
IF3.3
err2022-09-08
err1
errOAAI
errChun, Heebum; Park, William; Kim, Jungsub; Lee, ChaBum
err分享
err收藏
Preliminary study of photomask pattern inspection by beam-shaped knife-edge interferometry光束形刀口干涉法检测光掩模图案的初步研究
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2022-09-01
err5
PREAI
errWang, Zhikun; Lin, Pengfei; Lee, ChaBum
err分享
err收藏
Three-axis displacement sensor-integrated spindle system for carbon fiber-reinforced plastic (CFRP) machining process monitoring
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2022-05-01
err8
PREAI
errKim, Jungsub; Chun, Heebum; Lee, ChaBum
err分享
err收藏
Fluorescence strobo-stereoscopy for specular reflection-suppressed full field of view imaging
errMEASUREMENT
IF5.6
err2022-03-01
err2
errOAAI
errGuo, Xiangyu; Lee, ChaBum
err分享
err收藏
Spindle vibration mitigation utilizing additively manufactured auxetic materials
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2022-01-01
err15
PREAI
errKim, Jungsub; Hegde, Himanshu; Kim, Hyo-young; Lee, ChaBum
err分享
err收藏
Preliminary study of phase-shifting strobo-stereoscopy for cutting tool monitoring
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2021-04-01
err12
errOAAI
errGuo, Xiangyu; Lee, ChaBum
err分享
err收藏
Compact curved-edge displacement sensor-embedded spindle system for machining process monitoring
errJOURNAL OF MANUFACTURING PROCESSES
IF6.8
err2021-04-01
err11
errOAAI
errKim, Jungsub; Lee, Seungjoo; Chun, Heebum; Lee, ChaBum
err分享
err收藏
Characterization of thermally stable compliant structures with internal fluidic channels
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2020-11-01
err5
PREAI
errChun, Heebum; Kim, Gyu Ha; Villarraga-Gomez, Herminso; Kim, Hyo-Young; Elwany, Alaa; Lee, ChaBum
err分享
err收藏

研究方向

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合作学者
合作期刊
S
Sangmin Lee
H 指数: 47 · 论文数: 220
M
Masahiro Nomura
H 指数: 46 · 论文数: 594
A
Alaa Elwany
H 指数: 40 · 论文数: 128
J
Ji‐Yong Park
H 指数: 38 · 论文数: 234
S
Seungjoo Lee
H 指数: 29 · 论文数: 193
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