Rajarshi Saha - Publications, H-index & Citations

Rajarshi Saha

university system of georgia

16H指数

99论文数

980被引数

收录论文 21

发表时间

Pan India fluoride hazard assessment in groundwater

JOURNAL OF HAZARDOUS MATERIALS

IF11.3

2024-10-01

PREAI

Saha, Rajarshi; Wankhede, Tushar; Majumdar, Ritwik; Das, Iswar Chandra

Robust Semi-Decentralized Federated Learning via Collaborative Relaying

IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS

IF10.7

2024-07-01

PREAI

Yemini, Michal; Saha, Rajarshi; Ozfatura, Emre; Gunduz, Deniz; Goldsmith, Andrea J.

Decentralized Optimization Over Noisy, Rate-Constrained Networks: Achieving Consensus by Communicating Differences

IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS

IF17.2

2022-02-01

OAAI

Saha, Rajarshi; Rini, Stefano; Rao, Milind; Goldsmith, Andrea J.

PV,Battery and Ultra-capacitor Based Hybrid Energy Storage System 基于光伏、电池和超级电容的混合储能系统

2019 IEEE 16TH INDIA COUNCIL INTERNATIONAL CONFERENCE (IEEE INDICON 2019)

IF0

2019-12-01

PREAI

Saha, Rajarshi; Dey, Jayati

Power Coordination System between Multiple Sources in Electric Vehicle Application

2019 INNOVATIONS IN POWER AND ADVANCED COMPUTING TECHNOLOGIES (I-PACT)

IF0

2019-03-01

PREAI

Hajari, Sanchari; Saha, Rajarshi; Dey, Jayati

Fabrication and Electrochemical Performance of Interconnected Silicon Nanowires Synthesized from AlCu Catalyst

JOURNAL OF PHYSICAL CHEMISTRY C

IF3.2

2013-04-23

PREAI

Wen, Zhongsheng; Stark, Johanna; Saha, Rajarshi; Parker, Jack; Kohl, Paul A.

Deformation in 28Si* produced via the 16O+12C reaction

PHYSICAL REVIEW C

IF3.4

2013-02-06

OAAI

Kundu, S.; Bhattacharya, C.; Bhattacharya, S.; Rana, T. K.; Banerjee, K.; Muhkopadhayay, S.; Gupta, D.; Dey, A.; Saha, R.

Electroless Copper Bonding with Local Suppression for Void-Free Chip-to-Package Connections

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2012-01-01

OAAI

Koo, Hyo-Chol; Saha, Rajarshi; Kohl, Paul A.

Fabrication and Thermo-Mechanical Characterization of Fine Pitch All-Copper Interconnect

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2012-01-01

PREAI

Saha, Rajarshi; Koo, Hyo-Chol; An, Ping Nicole; Kohl, Paul A.

Copper Electroless Bonding of Dome-Shaped Pillars for Chip-to-Package Interconnect

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

IF3.3

2011-01-01

PREAI

Koo, Hyo-Chol; Saha, Rajarshi; Kohl, Paul A.

Characteristics of axial and radial segregation of single and mixed particle system based on terminal settling velocity in the riser of a circulating fluidized bed

CHEMICAL ENGINEERING JOURNAL

IF13.2

2008-12-01

PREAI

Das, Mitah; Meikap, B. C.; Saha, R. K.

Fragment emission studies of the 16O+12C reaction

PHYSICAL REVIEW C

IF3.4

2008-10-01

PREAI

Kundu, S.; Dey, A.; Banerjee, K.; Rana, T. K.; Muhkopadhayay, S.; Gupta, D.; Saha, R.; Bhattacharya, S.; Bhattacharya, C.

Characterization of fragment emission in 20Ne(7-10 MeV/nucleon)+12C reactions

PHYSICAL REVIEW C

IF3.4

2007-09-21

OAAI

Dey, Aparajita; Bhattacharya, C.; Bhattacharya, S.; Kundu, S.; Banerjee, K.; Mukhopadhyay, S.; Gupta, D.; Bhattacharjee, T.; Banerjee, S. R.; Bhattacharyya, S.; Rana, T. K.; Basu, S. K.; Saha, R.; Krishan, K.; Mukherjee, A.; Bandopadhyay, D.; Beck, C.

Study of dissipative collisions of 20Ne (≈7-11 MeV/nucleon)+27Al

PHYSICAL REVIEW C

IF3.4

2007-06-08

OAAI

Dey, Aparajita; Bhattacharya, C.; Bhattacharya, S.; Rana, T. K.; Kundu, S.; Banerjee, K.; Mukhopadhyay, S.; Banerjee, S. R.; Gupta, D.; Saha, R.

Structure-property relationships in the optimization of polysilicon thin films for electrical recording/stimulation of single neurons 用于电记录/刺激单个神经元的多晶硅薄膜优化中的结构-性质关系

BIOMEDICAL MICRODEVICES

IF3.3

2007-01-03

PREAI

Saha, Rajarshi; Muthuswamy, Jit