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Takayuki Ohba

Institute of Science Tokyo

19H指数
173论文数
1.5K被引数
收录论文 5
发表时间
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Direct detection of grain boundary scattering in damascene Cu wires by nanoscale four-point probe resistance measurements
errAPPLIED PHYSICS LETTERS
IF3.6
err2009-08-07
err59
PREAI
errKitaoka, Yusuke; Tono, Takeshi; Yoshimoto, Shinya; Hirahara, Toru; Hasegawa, Shuji; Ohba, Takayuki
err分享
err收藏
Effect of Ru crystal orientation on the adhesion characteristics of Cu for ultra-large scale integration interconnects
errAPPLIED SURFACE SCIENCE
IF6.9
err2006-03-01
err26
PREAI
errKim, H; Koseki, T; Ohba, T; Ohta, T; Kojima, Y; Sato, H; Hosaka, S; Shimogaki, Y
err分享
err收藏
Cu wettability and diffusion barrier property of Ru thin film for Cu metallization
errJOURNAL OF THE ELECTROCHEMICAL SOCIETY
IF3.3
err2005-01-01
err154
errOAAI
errKim, H; Koseki, T; Ohba, T; Ohta, T; Kojima, Y; Sato, H; Shimogaki, Y
err分享
err收藏
Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WOW and COW无扰构建立方体（Bumpless Build Cube, BBCube）3D：利用WOW和COW的异质三维集成
errIEEE Journal on Emerging and Selected Topics in Circuits and Systems
IF3.8
err
err0
PREAI
errNorio Chujo; Hiroyuki Ryoson; Koji Sakui; Shinji Sugatani; Masao Taguchi; Takayuki Ohba
err分享
err收藏
A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices无凸点立方体(BBCube)堆叠存储器器件的片上通孔(TSV)架构
errIEEE Journal on Emerging and Selected Topics in Circuits and Systems
IF3.8
err
err0
errOAAI
errShinji Sugatani; Hiroyuki Ryoson; Norio Chujo; Masao Taguchi; Koji Sakui; Takayuki Ohba
err分享
err收藏

研究方向

暂时未获取到该数据
合作学者
合作期刊
S
Shuji Hasegawa
H 指数: 58 · 论文数: 483
H
Hiroshi Sato
H 指数: 42 · 论文数: 625
T
Toru Hirahara
H 指数: 33 · 论文数: 152
T
Tomohiro Ohta
H 指数: 33 · 论文数: 206
S
Shinya Yoshimoto
H 指数: 26 · 论文数: 163
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