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Y

Yvan Avenas

communaute universite grenoble alpes

22H指数
220论文数
2.5K被引数
收录论文 20
发表时间
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Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2020-09-01
err40
errOAAI
errSamavatian, Vahid; Iman-Eini, Hossein; Avenas, Yvan; Samavatian, Majid
err分享
err收藏
Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2020-04-01
err19
errOAAI
errSamavatian, Vahid; Iman-Eini, Hossein; Avenas, Yvan
err分享
err收藏
A Method for Accelerated Aging Tests of Power Modules for Photovoltaic Inverters Considering the Inverter Mission Profiles
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2019-12-01
err7
errOAAI
errDbeiss, Mouhannad; Avenas, Yvan; Zara, Henri; Dupont, Laurent; Al Shakarchi, Franck
err分享
err收藏
Power Semiconductor Ageing Test Bench Dedicated to Photovoltaic Applications
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2019-05-01
err6
PREAI
errDbeiss, Mouhannad; Avenas, Yvan
err分享
err收藏
An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm
errINTERNATIONAL JOURNAL OF FATIGUE
IF6.8
err2018-11-01
err46
PREAI
errSamavatian, Vahid; Iman-Eini, Hossein; Avenas, Yvan
err分享
err收藏
Parameters affecting forced convection enhancement in ferrofluid cooling systems
errAPPLIED THERMAL ENGINEERING
IF6.9
err2017-08-01
err15
PREAI
errCherief, Wahid; Avenas, Yvan; Ferrouillat, Sebastien; Kedous-Lebouc, Afef; Jossic, Laurent; Petit, Mickael
err分享
err收藏
Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2017-01-01
err25
errOAAI
errMarchesini, Jean-Louis; Jeannin, Pierre-Olivier; Avenas, Yvan; Delaine, Johan; Buttay, Cyril; Riva, Raphael
err分享
err收藏
Condition Monitoring A Decade of Proposed Techniques
errIEEE INDUSTRIAL ELECTRONICS MAGAZINE
IF4.1
err2015-12-01
err96
PREAI
errAvenas, Yvan; Dupont, Laurent; Baker, Nick; Zara, Henri; Barruel, Franck
err分享
err收藏
Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2015-11-01
err49
errOAAI
errDupont, Laurent; Avenas, Yvan
err分享
err收藏
Improved Reliability of Power Modules A Review of Online Junction Temperature Measurement Methods
errIEEE INDUSTRIAL ELECTRONICS MAGAZINE
IF4.1
err2014-09-01
err191
errOAAI
errBaker, Nick; Liserre, Marco; Dupont, Laurent; Avenas, Yvan
err分享
err收藏
Power Electronics Cooling of 100 W/cm2 Using AC Electroosmotic Pump
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2014-01-01
err12
PREAI
errBerrouche, Youcef; Avenas, Yvan
err分享
err收藏
Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2013-07-01
err178
errOAAI
errDupont, Laurent; Avenas, Yvan; Jeannin, Pierre-Olivier
err分享
err收藏
Drift Region Integrated Microchannels for Direct Cooling of Power Electronic Devices: Advantages and Limitations
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2013-05-01
err16
PREAI
errVladimirova, Kremena; Crebier, Jean-Christophe; Avenas, Yvan; Schaeffer, Christian
err分享
err收藏
Numerical and Experimental Investigations of the Thermal Management of Power Electronics With Liquid Metal Mini-Channel Coolers
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2013-05-01
err34
PREAI
errTawk, Mansour; Avenas, Yvan; Kedous-Lebouc, Afef; Petit, Mickael
err分享
err收藏
Temperature Measurement of Power Semiconductor Devices by Thermo-Sensitive Electrical Parameters-A Review
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2012-06-01
err459
errOAAI
errAvenas, Yvan; Dupont, Laurent; Khatir, Zoubir
err分享
err收藏
Single Die Multiple 600 V Power Diodes With Deep Trench Terminations and Isolation
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2011-11-01
err9
PREAI
errVladimirova, Kremena; Crebier, Jean-Christophe; Avenas, Yvan; Schaeffer, Christian
err分享
err收藏
A Bus-Bar-Like Power Module Based on Three-Dimensional Power-Chip-on-Chip Hybrid Integration
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2010-09-01
err38
PREAI
errVagnon, Eric; Jeannin, Pierre-Olivier; Crebier, Jean-Christophe; Avenas, Yvan
err分享
err收藏
DBC Technology for Extremely Thin Flat Heat Pipes
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2009-01-01
err7
PREAI
errKamenova, Lora; Avenas, Yvan; Schaeffer, Christian; Tzanova, Slavka; Kapelski, Georges; Schulz-Harder, Juergen
err分享
err收藏
Design of a Porous Electroosmotic Pump Used in Power Electronic Cooling
errIEEE TRANSACTIONS ON INDUSTRY APPLICATIONS
IF4.5
err2009-01-01
err28
PREAI
errBerrouche, Youcef; Avenas, Yvan; Schaeffer, Christian; Chang, Hsueh-Chia; Wang, Ping
err分享
err收藏
Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging
errIEEE TRANSACTIONS ON POWER ELECTRONICS
IF6.5
err2006-11-01
err48
PREAI
errIvanova, Mariya; Avenas, Yvan; Schaeffer, Christian; Dezord, Jean-Bemard; Schulz-Harder, Juergen
err分享
err收藏

研究方向

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合作学者
合作期刊
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Marco Liserre
H 指数: 91 · 论文数: 938
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Hsueh‐Chia Chang
H 指数: 62 · 论文数: 372
汪
汪萍 (Ping Wang)
H 指数: 49 · 论文数: 299
H
Hossein Iman‐Eini
H 指数: 36 · 论文数: 215
R
Raphaël Riva
H 指数: 28 · 论文数: 173
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