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Tae‐Ik Lee

korea institute of industrial technology

19H指数
60论文数
1.7K被引数
收录论文 29
发表时间
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Size-dependent top extraction and finite-NA capture in ultra-small blue GaN micro-LEDs via peripheral-emission-weighted FDTD analysis尺寸依赖的顶部提取和有限数值孔径捕获在超小蓝色GaN微LED中的周界发射加权FDTD分析
errScientific Reports
IF3.9
err2026-09-02
err0
errOAAI
errYeon-Sik Kim; Minjeong Sohn; Tae-Ik Lee; Byeong-Kwon Ju
err分享
err收藏
Nonlinear Warpage Modeling of Dielectric-Controlled Carrier Wafers介电控载流子晶圆的非线性翘曲建模
errInternational Journal of Mechanical Sciences
IF9.4
err2026-02-06
err0
PREAI
errChang-Yeon Gu; Min Hyeok Choi; Min Sang Ju; Dohun Kim; Sung Woo Ma; Tae-Ik Lee; Taek-Soo Kim
err分享
err收藏
Low Thermal Conductivity and High Electrical Conductivity in PEDOT:PSS/DMSO Composite with Hollow Glass Microspheres
errACS Applied Polymer Materials
IF4.7
err2026-01-29
err0
PREAI
errMinsoo Kim; Minjeong Sohn; Tae-Ik Lee; Joon Sang Kang
err分享
err收藏
Improved thermal management and manufacturing flexibility in power module heatsinks through rapid large-area laser soldering and maximized convective heat transfer通过快速大面积激光焊接和最大化对流换热，提高功率模块散热器的热管理性能和制造灵活性
errCase Studies in Thermal Engineering
IF6.4
err2025-12-26
err0
errOAAI
errByeongchan Kim; Ha-Young Yu; Junwoo Park; Byeong Kwon Ju; Yong-Ho Ko; Sehoon Yoo; Tae-Ik Lee; Dongjin Kim
err分享
err收藏
A review of the thermo-mechanical analysis framework for microelectronics packaging: Mechanics, material property determination, and structural considerations微电子封装热-力分析框架综述：力学、材料性能确定与结构考虑
errMaterials Science in Semiconductor Processing
IF4.6
err2025-12-10
err0
PREAI
errJeong-Hyeon Park; Eunhye Lee; Im-Deok Kim; Hyunwoo Jung; Jihyun Kim; Jungwan Cho; Jong-hyoung Kim; Tae-Ik Lee; Seung-Kyun Kang; Eun-Ho Lee
err分享
err收藏
Absorber-Free Laser Welding of Transparent Thermoplastic Films via Expanded Beam for Flexible Displays无吸收剂激光焊接透明热塑性薄膜（通过扩展光束用于柔性显示）
errACS Applied Materials and Interfaces
IF8.2
err2025-11-01
err0
PREAI
errLee, Eunhye; Na, Jeehoo; Ju, Byeong-Kwon; Lee, Tae-Ik
err分享
err收藏
Deformation-informed design of dual-cure adhesives for camera modules via microscale digital image correlation通过微尺度数字图像相关法对相机模块用双固化胶粘剂的变形感知设计
errMaterials & Design
IF7.9
err2025-10-31
err0
errOAAI
errMinhyuck Lee; Jangmi Seo; Jiwon Baek; Sang-Eui Lee; Tae-Ik Lee
err分享
err收藏
Glycerol Vapor Assisted Cu Direct Bonding: Implications for 3D Semiconductor Packaging
errADVANCED MATERIALS TECHNOLOGIES
IF6.2
err2024-11-02
err0
PREAI
errNa, Jeehoo; Lee, Eunhye; Park, Kyung-Ho; Lee, Dongwoo; Lee, Tae-Ik
err分享
err收藏
Evaluating Free Thermal Expansion and Glass Transition of Ultrathin Polymer Films on Heated Liquid
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2024-05-23
err3
PREAI
errLee, Tae-Ik; Kim, Ji Hun; Kim, Dong Jun; Kim, Taek-Soo
err分享
err收藏
Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation
errSCIENTIFIC REPORTS
IF3.9
err2023-09-01
err4
errOAAI
errJeong, Jong-Min; Sohn, Minjeong; Bang, Junghwan; Lee, Tae-Ik; Kim, Min-Su
err分享
err收藏
Siloxane Hybrid Material-Encapsulated Highly Robust Flexible μLEDs for Biocompatible Lighting Applications
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2022-06-08
err8
PREAI
errLee, Han Eol; Lee, Daewon; Lee, Tae-Ik; Jang, Jinhyeong; Jang, Junho; Lim, Young-Woo; Shin, Jung Ho; Kang, Seung-Mo; Choi, Gwang-Mun; Joe, Daniel J.; Kim, Jeong Hyeon; Lee, Seung Hyung; Park, Sang Hyun; Park, Chan Beum; Kim, Taek-Soo; Lee, Keon Jae; Bae, Byeong-Soo
err分享
err收藏
Ultrathin, Flexible, and Transparent Oxide Thin-Film Transistors by Delamination and Transfer Methods for Deformable Displays通过分层和转移方法用于可变形显示器的超薄，柔性和透明氧化物薄膜晶体管
errADVANCED MATERIALS TECHNOLOGIES
IF6.2
err2021-07-15
err8
PREAI
errKo, Jong Beom; Lee, Seung Hee; Lee, Tae-Ik; Lee, Sangmin; Kim, Jingyu; Kim, Hyeok; Kim, Taek-Soo; Park, Sang-Hee Ko
err分享
err收藏
Interfacial Reactions and Mechanical Properties of Sn-58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding
errMATERIALS
IF3.2
err2021-01-11
err10
errOAAI
errJeong, Gyuwon; Yu, Dong-Yurl; Baek, Seongju; Bang, Junghwan; Lee, Tae-Ik; Jung, Seung-Boo; Kim, JungSoo; Ko, Yong-Ho
err分享
err收藏
Creation of Curved Nanostructures Using Soft-Materials-Derived Lithography使用软材料衍生的光刻技术创建弯曲的纳米结构
errNANOMATERIALS
IF4.3
err2020-12-03
err2
errOAAI
errJang, Hyun-Ik; Yoon, Hae-Su; Lee, Tae-Ik; Lee, Sangmin; Kim, Taek-Soo; Shim, Jaesool; Park, Jae Hong
err分享
err收藏
Wearable, Ultrawide-Range, and Bending-Insensitive Pressure Sensor Based on Carbon Nanotube Network-Coated Porous Elastomer Sponges for Human Interface and Healthcare Devices基于碳纳米管网络涂层多孔弹性体海绵的可穿戴，超宽范围和弯曲不敏感的压力传感器，用于人机界面和医疗保健设备
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2019-06-10
err181
PREAI
errKim, Seunghwan; Amjadi, Morteza; Lee, Tae-Ik; Jeong, Yongrok; Kwon, Donguk; Kim, Min Seong; Kim, Kyuyoung; Kim, Taek-Soo; Oh, Yong Suk; Park, Inkyu
err分享
err收藏
Thermal expansion behavior of thin films expanding freely on water surface
errSCIENTIFIC REPORTS
IF3.9
err2019-05-08
err29
errOAAI
errKim, Jae-Han; Jang, Kyung-Lim; Ahn, Kwangho; Yoon, Taeshik; Lee, Tae-Ik; Kim, Taek-Soo
err分享
err收藏
Performance improvement of flexible piezoelectric energy harvester for irregular human motion with energy extraction enhancement circuit基于能量提取增强电路的人体不规则运动柔性压电能量采集器性能改进
errNANO ENERGY
IF17.1
err2019-04-01
err96
PREAI
errKhan, Muhammad Bilawal; Kim, Dong Hyun; Han, Jae Hyun; Saif, Hassan; Lee, Hyeonji; Lee, Yongmin; Kim, Minsun; Jang, Eunsang; Hong, Seong Kwang; Joe, Daniel Juhyung; Lee, Tae-Ik; Kim, Taek-Soo; Lee, Keon Jae; Lee, Yoonmyung
err分享
err收藏
Direct Visualization of Cross-Sectional Strain Distribution in Flexible Devices
errACS APPLIED MATERIALS & INTERFACES
IF8.2
err2019-03-21
err26
PREAI
errLee, Tae-Ik; Jo, Woosung; Kim, Wansun; Kim, Ji-Hye; Paik, Kyung-Wook; Kim, Taek-Soo
err分享
err收藏
Wireless powered wearable micro light-emitting diodes无线供电可穿戴微型发光二极管
errNANO ENERGY
IF17.1
err2019-01-01
err89
PREAI
errLee, Han Eol; Lee, Daewon; Lee, Tae-Ik; Shin, Jung Ho; Choi, Gwang-Mun; Kim, Cheolgyu; Lee, Seung Hyung; Lee, Jae Hee; Kim, Yong Ho; Kang, Seung-Mo; Park, Sang Hyun; Kang, Il-Suk; Kim, Taek-Soo; Bae, Byeong-Soo; Lee, Keon Jae
err分享
err收藏
Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer (vol 26, 1707102, 2018)
errADVANCED FUNCTIONAL MATERIALS
IF19
err2018-11-05
err1
errOAAI
errSeo, Jeongmin; Kim, Cheogyu; Ma, Boo Soo; Lee, Tae-Ik; Bong, Jae Hoon; Oh, Joong Gun; Cho, Byung Jin; Kim, Taek-Soo
err分享
err收藏

研究方向

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合作学者
合作期刊
J
Jang Wook Choi
H 指数: 109 · 论文数: 400
C
Chan Beum Park
H 指数: 79 · 论文数: 331
K
Keon Jae Lee
H 指数: 78 · 论文数: 250
I
Inkyu Park
H 指数: 65 · 论文数: 463
T
Taek‐Soo Kim
H 指数: 62 · 论文数: 572
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