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H

Haedo Jeong

pusan national university

30H指数
223论文数
2.7K被引数
收录论文 31
发表时间
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Correlation between structured surface pad design and material removal rate in Chemical Mechanical Polishing化学机械抛光中结构化表面垫设计与材料去除率之间的关系
errJournal of Manufacturing Processes
IF6.8
err2025-11-19
err0
PREAI
errYoungwook Park; Hokyoung Jung; Hanchul Cho; Doyeon Kim; Taekyung Lee; Haedo Jeong; Hyoungjae Kim
err分享
err收藏
Quantitative assessment of contamination suppression and removal techniques for PVA brush in Post-CMP cleaning聚乙烯醇刷在抛光后化学机械抛光清洁中的污染抑制和去除技术的定量评估
errMaterials Science in Semiconductor Processing
IF4.6
err2025-11-15
err0
PREAI
errHokyoung Jung; Doyeon Kim; Taekyung Lee; Haedo Jeong; Hanchul Cho
err分享
err收藏
Precision Engineering and Intelligent Technologies for Predictable CMP精密工程与智能技术用于可预测的化学机械抛光
errInternational Journal of Precision Engineering and Manufacturing
IF3.6
err2025-10-01
err0
PREAI
errSomin Shin; Hyun Jun Ryu; Sanha Kim; Haedo Jeong; Hyunseop Lee
err分享
err收藏
Process Temperature Control for Low Dishing in CMPCMP中低凹陷的工艺温度控制
errMaterials 2025, Vol. 18, Page 4461
IF3.2
err2025-09-30
err0
errOAAI
errYeongil Shin; Jongmin Jeong; Jiho Shin; Haedo Jeong
err分享
err收藏
Particle removal behavior of micropatterned pad buffing in post-CMP cleaning微图案垫抛光在CMP后清洗中的粒子去除行为
errMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
IF4.6
err2025-06-17
err0
errOAAI
errJung, Hokyoung; Park, Youngwook; Cho, Hanchul; Kim, Doyeon; Lee, Taekyung; Jeong, Haedo; Kim, Hyoungjae
err分享
err收藏
Characterizing the contact evolution through the combination of surface roughness parameters in chemical mechanical polishing using a polyurethane polishing pad
errWEAR
IF6.1
err2025-04-01
err0
PREAI
errJeong, Jongmin; Shin, Yeongil; Jeong, Seunghun; Jeong, Haedo
err分享
err收藏
Deep ensemble learning for material removal rate prediction in chemical mechanical planarization with pad surface topography
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2024-06-01
err2
PREAI
errJeong, Jongmin; Shin, Yeongil; Jeong, Seunghun; Jeong, Seonho; Jeong, Haedo
err分享
err收藏
Novel Probability Density Function of Pad Asperity by Wear Effect over Time in Chemical Mechanical Planarization
errMATERIALS
IF3.2
err2024-04-15
err0
errOAAI
errJeong, Seonho; Shin, Yeongil; Jeong, Jongmin; Jeong, Seunghun; Jeong, Haedo
err分享
err收藏
Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping
errMICROMACHINES
IF3
err2020-08-14
err6
errOAAI
errLee, Taekyung; Jeong, Haedo; Lee, Sangjik; Kim, Doyeon; Kim, Hyoungjae
err分享
err收藏
Changes in the structure properties. and CMP manufacturability of a poly-Si film induced by deposition and annealing processes
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2016-08-01
err9
PREAI
errPark, Sungmin; Jeong, Haedo; Yoon, Sang-Hee
err分享
err收藏
Experimental investigation of process parameters for roll-type linear chemical mechanical polishing (Roll-CMP) system
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2014-10-01
err14
PREAI
errLee, Hyunseop; Wang, Han; Park, Jaehong; Jeong, Haedo
err分享
err收藏
Development of intelligent pad monitoring system and application to analysis of pressure distribution in chemical mechanical polishing process
errprecision engineering journal of the international societies for precision engineering and nanotechnology
IF3.6
err2014-09-07
err6
PREAI
errLee, Changsuk; Park, Jaehong; Kinoshita, Masaharu; Jeong, Haedo
err分享
err收藏
Semi-empirical material removal rate distribution model for SiO2 chemical mechanical polishing (CMP) processes
errPRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY
IF3.7
err2013-04-01
err94
errOAAI
errLee, H. S.; Jeong, H. D.; Dornfeld, D. A.
err分享
err收藏
Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires
errCIRP ANNALS-MANUFACTURING TECHNOLOGY
IF3.6
err2013-01-01
err41
PREAI
errKim, Hyoungjae; Kim, Doyeon; Kim, Chulmin; Jeong, Haedo
err分享
err收藏
A hybrid polysilicon planarization for suppressing dishing defects
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2012-12-01
err1
PREAI
errPark, Sungmin; Yoon, Sang-Hee; Kim, Hyoungjae; Jeong, Haedo
err分享
err收藏
A wafer-scale material removal rate profile model for copper chemical mechanical planarization用于铜化学机械平坦化的晶圆级材料去除率轮廓模型
errINTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
IF18.8
err2011-05-01
err64
PREAI
errLee, Hyunseop; Jeong, Haedo
err分享
err收藏
Effect of mechanical factor in uniformity for electrochemical mechanical planarization
errSENSORS AND ACTUATORS A-PHYSICAL
IF4.9
err2010-09-01
err10
PREAI
errJeong, Sukhoon; Bae, Jaehyun; Lee, Hyunseop; Lee, Hojun; Lee, Youngkyun; Park, Boumyoung; Kim, Hyoungjae; Kim, Sungryul; Jeong, Haedo
err分享
err收藏
Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization
errAPPLIED SURFACE SCIENCE
IF6.9
err2010-01-01
err16
PREAI
errJeong, Sukhoon; Lee, Hyunseop; Cho, Hanchul; Lee, Sangjik; Kim, Hyoungjae; Kim, Sungryul; Park, Jaehong; Jeong, Haedo
err分享
err收藏
Mechanical effect of colloidal silica in copper chemical mechanical planarization
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2009-11-01
err54
PREAI
errLee, Hyunseop; Joo, Sukbae; Jeong, Haedo
err分享
err收藏
Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization
errJOURNAL OF MATERIALS PROCESSING TECHNOLOGY
IF7.5
err2009-02-01
err35
PREAI
errLee, Hyunseop; Park, Boumyoung; Jeong, Haedo
err分享
err收藏

研究方向

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合作学者
合作期刊
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Dong‐Woo Cho
H 指数: 79 · 论文数: 500
王涵 封面图
王涵 (Han Wang)
H 指数: 68 · 论文数: 1.5K
D
David Dornfeld
H 指数: 64 · 论文数: 422
S
Sung‐Min Park
H 指数: 51 · 论文数: 863
S
Steven Lee
H 指数: 33 · 论文数: 232
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