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Embeddable modular hardware for multi-functional sensor networks

delete2007-09-05
delete11
PRE
AI
K
Kyle Mitchell
S
Steve E. Watkins *
J
James W. Fonda
S
S. Jagannathan
DOI:10.1088/0964-1726/16/5/N01delete
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摘要

摘要

En 中文
A multi-layer node is described for multi-functional sensor networks. The generation-4 smart sensor node (G4SSN) is light weight, has a small footprint, and is low power to support dedicated, embedded applications. It has core layers for data sensing, data processing and wireless networking. The modular physical layout is built around a flexible, multi-channel bus architecture and routing protocols are easily tailored. Additional stackable layers and devices can be easily configured and programmed to meet specific application requirements, especially for prototyping and research investigations. The feasibility for high-resolution sensor data acquisition and wireless transmission is demonstrated using the dynamic strain behavior of an instrumented cantilever beam. The G4SSN is adaptable with different hardware components such as different sensor types and radio layer capabilities.
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Smart Materials and Structures 封面图
Smart Materials and Structures
IF:
3.8
论文数:
8.5K
被引数:
2.5W

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