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On-Demand Metallization System Using Micro-Plasma Bubbles
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DOI：10.3390/mi13081312.png)
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摘要
En 中文
3D wiring technology is required for the integration of micro-nano devices on various 3D surfaces. However, current wiring technologies cannot be adapted to a variety of materials and surfaces. Here, we propose a new metal deposition method using only a micro-plasma bubble injector and a metal ion solution. Micro-plasma bubbles were generated on demand using pulses, and the localized reaction field enables metal deposition independent of the substrate. Three different modes of micro-plasma bubble generation were created depending on the power supply conditions and mode suitable for metal deposition. Furthermore, using a mode in which one bubble was generated for all pulses among the three modes, copper deposition on dry/wet materials, such as chicken tissue and glass substrates, was achieved. In addition, metal deposition of copper, nickel, chromium, cobalt, and zinc was achieved by simply changing the metal ion solution. Finally, patterning on glass and epoxy resin was performed. Notably, the proposed metal deposition method is conductivity independent. The proposed method is a starting point for 3D wiring of wet materials, which is difficult with existing technologies. Our complete system makes it possible to directly attach sensors and actuators to living organisms and robots, for example, and contribute to soft robotics and biomimetics.
Keyword:
collapse of bubble
plasma discharge
metal deposition
reduction
wiring
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