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Stiffness and Interface Engineered Soft Electronics with Large-Scale Robust Deformability

delete2024-08-23
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PRE
AI
X
Xiangye Liu
Q
Qiangzheng Wang
S
Sufeng Zhou
S
Shiwei Feng
Y
Yulin Wei
F
Fan Bu
王
王凯 (Kexin Wang)
汪俊华 封面图
汪俊华 (John Wang)
B
Biao Zhang
官
官操 (Cao Guan) *
DOI:10.1002/adma.202407886delete
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摘要

摘要

En 中文
Skin-like stretchable electronics emerge as promising human-machine interfaces but are challenged by the paradox between superior electronic property and reliable mechanical deformability. Here, a general strategy is reported for establishing robust large-scale deformable electronics by effectively isolating strains and strengthening interfaces. A copolymer substrate is designed to consist of mosaic stiff and elastic areas with nearly four orders of magnitudes modulus contrast and cross-linked interfaces. Electronic functional devices and stretchable liquid metal (LM) interconnects are conformally attached at the stiff and elastic areas, respectively, through hydrogen bonds. As a result, functional devices are completely isolated from strains, and resistances of LM conductors change by less than one time when the substrate is deformed by up to 550%. By this strategy, solar cells, wireless charging antenna, supercapacitors, and light-emitting diodes are integrated into a self-powered electronic skin that can laminate on the human body and exhibit stable performances during repeated multimode deformations, demonstrating an efficient path for realizing highly deformable energy autonomous soft electronics. By simultaneously regulating stiffness and enhancing interfacial binding force, this work provides an efficient path to realize robust large-scale deformable electronic skins. Stiff and elastic areas of the designed substrate have nearly four orders of magnitudes modulus contrast and cross-linked interfaces. Electronic devices and liquid metal interconnects are conformally attached at the stiff and elastic areas, respectively, through hydrogen bonds. image
Keyword:
energy autonomy
large-scale deformability
liquid metal
stiffness and interface engineering
stretchable electronics

期刊

Advanced Materials 封面图
Advanced Materials
IF:
26.8
论文数:
3.4W
被引数:
46.0W

机构

N
Northwestern Polytechnical University
学者数:
4.6W
论文数: 3.7W
被引数: 5.3W
N
National University of Singapore
学者数:
7.6W
论文数: 6.5W
被引数: 11.4W
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