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Phase Change Memory

delete2010-12-01
delete1.7K
PRE
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H
H.‐S. Philip Wong *
S
Simone Raoux
S
Sang‐Bum Kim
J
Jiale Liang
J
John P. Reifenberg
B
Bipin Rajendran
M
Mehdi Asheghi
K
Kenneth E. Goodson
DOI:10.1109/JPROC.2010.2070050delete
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Abstract

Abstract

En 中文
In this paper, recent progress of phase change memory (PCM) is reviewed. The electrical and thermal properties of phase change materials are surveyed with a focus on the scalability of the materials and their impact on device design. Innovations in the device structure, memory cell selector, and strategies for achieving multibit operation and 3-D, multilayer high-density memory arrays are described. The scaling properties of PCM are illustrated with recent experimental results using special device test structures and novel material synthesis. Factors affecting the reliability of PCM are discussed.
Keywords:
Chalcogenides
emerging memory
heat conduction
nonvolatile memory
PCRAM
phase change material
phase change memory (PCM)
PRAM
thermal physics
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Journal

Proceedings of the IEEE cover
Proceedings of the IEEE
IF:
25.9
Papers:
9.9K
Citations:
4.5W

Organization

S
Stanford University
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Papers: 8.2W
Citations: 17.0W
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international business machines (ibm)
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5.7K
Papers: 4.5K
Citations: 4
I
Intel Corporation
Scholars:
2.7K
Papers: 2.0K
Citations: 6
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