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Selective Electroplating for 3D-Printed Electronics
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DOI：10.1002/admt.201900126.png)
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Abstract
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Creating 3D-printed parts with embedded circuitry is the next frontier in additive manufacturing, but printing of conductors with performance comparable to bulk metals such as copper is a difficult challenge. A hybrid process based on 3D printing followed by electroplating on highly conductive thermoplastic filament is used to manufacture 3D circuit boards and electronic packaging. Dual extruder heads on a standard fused filament fabrication printer are used to selectively define regions for electroplating, allowing distinct traces and multiple materials to be patterned in the same 3D-printed parts. Using this approach, a 3D-printed surface-mount package and a 555 timer oscillator circuit are demonstrated, including soldering of components onto the electroplated copper surface.
Keywords:
3D printing
composite filament
electroplating
fused filament fabrication
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