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Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges
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DOI：10.1038/s41699-024-00508-2.png)
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Abstract
En 中文
Solution-processable 2D materials (2DMs) are gaining attention for applications in logic, memory, and sensing devices. This review surveys recent advancements in memristors, transistors, and sensors using 2DMs, focusing on their charge transport mechanisms and integration into silicon CMOS platforms. We highlight key challenges posed by the material's nanosheet morphology and defect dynamics and discuss future potential for monolithic 3D integration with CMOS technology.
Keywords:
TRANSITION-METAL DICHALCOGENIDES
DER-WAALS HETEROSTRUCTURES
THIN-FILM TRANSISTORS
FEW-LAYER MOS2
BORON-NITRIDE
COVALENT FUNCTIONALIZATION
EXFOLIATED GRAPHENE
BLACK PHOSPHORUS
RESISTIVE MEMORY
NANOSHEETS
Journal
IF:
8.8
Papers:
754
Citations:
4.9K