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SaveShare Save Share Save Solution-processable 2D materials for monolithic 3D memory-sensing-computing platforms: opportunities and challenges
Tang, Baoshan; Sivan, Maheswari; Leong, Jin Feng; Xu, Zefeng; Zhang, Yu; Li, Jianan; Wan, Ruyue; Wan, Quanzhen; Zamburg, Evgeny; Thean, Aaron V-Y Share Save Share Save Share Save Wafer-scale solution-processed 2D material analog resistive memory array for memory-based computingTang, Baoshan; Veluri, Hasita; Li, Yida; Yu, Zhi Gen; Waqar, Moaz; Leong, Jin Feng; Sivan, Maheswari; Zamburg, Evgeny; Zhang, Yong-Wei; Wang, John; Thean, Aaron V-Y Share Save Stress-Memorized HZO for High-Performance Ferroelectric Field-Effect MemtransistorTsai, Shih-Hao; Fang, Zihang; Wang, Xinghua; Chand, Umesh; Chen, Chun-Kuei; Hooda, Sonu; Sivan, Maheswari; Pan, Jieming; Zamburg, Evgeny; Thean, Aaron Voon-Yew Share Save All WSe2 1T1R resistive RAM cell for future monolithic 3D embedded memory integrationSivan, Maheswari; Li, Yida; Veluri, Hasita; Zhao, Yunshan; Tang, Baoshan; Wang, Xinghua; Zamburg, Evgeny; Leong, Jin Feng; Niu, Jessie Xuhua; Chand, Umesh; Thean, Aaron Voon-Yew Share Save Share Save 
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