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European Microelectronics and Packaging Conference and Exhibition
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Journal Papers
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Journal Papers
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Laser Frit Sealing Approach for Ultrathin Glass
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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2019-09-01
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Bedjaoui, M.; Brun, J.; Amiran, J.
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Investigating the Overdischarge Failure on Copper Dendritic Phenomenon of Lithium ion Batteries in Portable Electronics
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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2019-09-01
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Chen, Chengcheng; He, Guanghui; Cai, Jinbao; Zhao, Zhenbo; Luo, Daojun
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Innovative Authentication Method for IoT Devices
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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2019-09-01
1
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Vasile, Daniel C.; Svasta, Paul M.
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Thermosonic wedge -wedge bonding using dosed tool heating
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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Printed Functional Applications: Batteries, Communication E e ents, Antennas and Conductive Paths on Technical Textiles
2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC)
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