1
Back
M

Microelectronics International

IF0.8
Papers30
Citations301
Journal Papers 30
Publication Date
delete
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteSalsabiila, Natasya; Nayan, Nafarizal; Azman, Zulkifli; Bakri, Anis Suhaili; Abu Bakar, Ahmad Shuhaimi; Adriyanto, Feri
deleteShare
deleteSave
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions - a critical review
deleteMicroelectronics International
IF0.8
delete2026-04-01
delete0
PREAI
deleteGan, Chong Leong; Chung, Min-Hua; Huang, Chen-Yu
deleteShare
deleteSave
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteWang, Yuqi; Yao, Ran; Li, Hui; Lai, Wei; Yuan, Wenqian; Ji, Yirun; Huai, Qing; Yuan, Xi; Jie, Ziyao
deleteShare
deleteSave
Stress-strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loading
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Xiaobin; Huang, Chunyue; Yang, Jinmei
deleteShare
deleteSave
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Xianjia; Huang, Long; Huang, Chunyue; Chen, Yonglin; Liang, Ying; Gao, Chao; Wu, Liye; Cao, Zhiqin
deleteShare
deleteSave
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
deleteMicroelectronics International
IF0.8
delete2026-03-01
delete0
PREAI
deleteLiu, Yun-Xin; Zhang, Liang; Chen, Yu-Hao; Zhang, Jia-Min; Chen, Mo; Liu, Tao; Shi, Lei
deleteShare
deleteSave
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteWang, Yanfeng; Peng, Sui; Fu, Yan; He, Lingfeng; Huang, Jun; Yang, Lingyun; Huang, Zhicong
deleteShare
deleteSave
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteYang, Juefei; Wang, Yunfei; Mo, Ze; Ouyang, Liangxuan; Zhang, Qingyu; Fang, Yan; Zhao, Zhaoyang
deleteShare
deleteSave
Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteYang, Xuexia; Zhu, Miao; Sun, Yanxi; Lin, Jinbao; Hao, Xin; Shu, Xuefeng; Xiao, Gesheng
deleteShare
deleteSave
Heat dissipation performance of solid-state drives under convective cooling: analyzing the impact of heat sink fin spacing
deleteMicroelectronics International
IF0.8
delete2026-02-01
delete0
PREAI
deleteApalowo, Rilwan Kayode; Abas, Aizat; Bin Salim, Muhammad Razin; Famuyiwa, Samuel Olusina; Kok, Chia Siang
deleteShare
deleteSave
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback
deleteMicroelectronics International
IF0.8
delete2026-01-01
delete0
PREAI
deleteJiang, Kezheng; Ao, Yuqi; Zhao, Yifan; Xiong, Ping; Ding, Hao; Zhou, Yi
deleteShare
deleteSave
Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics
deleteMicroelectronics International
IF0.8
delete2026-01-01
delete0
PREAI
deleteSundararajan, Muralidharan; Devarajan, Mutharasu; Azahar, Ahmad Zarif; Mong, Derek
deleteShare
deleteSave
Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems (DEC, 10.1108/MI-07-2025-0122, 2025)
deleteMicroelectronics International
IF0.8
delete2025-12-01
delete1
PREAI
deleteLi, S.; Xu, Y.; Wang, S.; Wang, H.; Li, B.
deleteShare
deleteSave
Novel bipolar output high step-up sepic DC/DC converter with parasitical parameters self-balance
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-12-01
delete0
PREAI
deleteAi, Jian; Wu, Zhichao; Bi, Kaitao; Fan, Qigao; Yan, Wenxu; Qiu, Yue; Dai, Sichu; Qian, Lei; Ai, Jingcheng; Wang, Canmin; Han, Yuelong
deleteShare
deleteSave
Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration
deleteMicroelectronics International
IF0.8
delete2025-12-01
delete0
PREAI
deleteTang, Wenxue; Ji, Yong; Zhou, Liyan; Bai, Yufei; Zhu, Yuan; Yang, Cheng; Wang, Gang; Wang, Chengqian
deleteShare
deleteSave
Fluorine implantation for nanostructured silicon Zener diodes: a study on electrical characterization and reliability
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-11-01
delete0
PREAI
deleteLee, Sai Link; Packeer Mohamed, Mohamed Fauzi; Tan, Chan Lik
deleteShare
deleteSave
The role of PI thickness and opening dimensions on void suppression in solder bump fabrication
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-11-01
delete0
PREAI
deleteZhang, Lei; Li, Te; Zhang, Zhengkai; Zhang, Zhongnan; Zhang, Shuai; Wang, Chengqian
deleteShare
deleteSave
A chemosensitive based ammonia gas sensor with PANI/PEO-ZnO nanofiber composites sensing layer
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-10-27
delete0
PREAI
delete[Anonymous]
deleteShare
deleteSave
Minimization of common-mode voltage for matrix converter-fed permanent magnet synchronous motor system with model predictive control
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-10-01
delete0
PREAI
deleteGong, Siyang; Feng, Huihua; Chu, Quanhong; Xiao, Shuxin; Li, Shanhu
deleteShare
deleteSave
Study on the dielectric properties at grain boundaries of ZnO film by electrostaticforce microscope
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-10-01
delete0
PREAI
deleteZhang, Yidong
deleteShare
deleteSave