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Microelectronics International

IF0.8
Papers34
Citations301
Journal Papers 34
Publication Date
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A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms
deleteMicroelectronics International
IF0.8
delete2026-05-01
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PREAI
deleteWu, Min
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Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1
deleteMicroelectronics International
IF0.8
delete2026-04-10
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PREAI
deleteZhao, Zhaoyang; Zhang, Jun; Wei, Xinwei; Sui, Xin
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Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability
deleteMicroelectronics International
IF0.8
delete2026-04-01
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PREAI
deleteYu, Haolin; Liu, Huiqiao; Cao, Huanxi; Jin, Yu; Lu, Wenbiao; Xiao, Qian; Mu, Yunfei; Jia, Hongjie
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Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice
deleteMicroelectronics International
IF0.8
delete2026-04-01
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deleteSalsabiila, Natasya; Nayan, Nafarizal; Azman, Zulkifli; Bakri, Anis Suhaili; Abu Bakar, Ahmad Shuhaimi; Adriyanto, Feri
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Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide
deleteMicroelectronics International
IF0.8
delete2026-04-01
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PREAI
deleteZhang, Tao; Zou, Danqing; Meng, Fan-Yi; Wang, Yuxin; Sun, Hongpeng; Fu, Jia-Hui; Ding, Chang
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Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions - a critical review
deleteMicroelectronics International
IF0.8
delete2026-04-01
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deleteGan, Chong Leong; Chung, Min-Hua; Huang, Chen-Yu
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Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling
deleteMicroelectronics International
IF0.8
delete2026-03-01
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PREAI
deleteWang, Yuqi; Yao, Ran; Li, Hui; Lai, Wei; Yuan, Wenqian; Ji, Yirun; Huai, Qing; Yuan, Xi; Jie, Ziyao
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Stress-strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loading
deleteMicroelectronics International
IF0.8
delete2026-03-01
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PREAI
deleteLiu, Xiaobin; Huang, Chunyue; Yang, Jinmei
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Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm
deleteMicroelectronics International
IF0.8
delete2026-03-01
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PREAI
deleteLiu, Xianjia; Huang, Long; Huang, Chunyue; Chen, Yonglin; Liang, Ying; Gao, Chao; Wu, Liye; Cao, Zhiqin
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Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints
deleteMicroelectronics International
IF0.8
delete2026-03-01
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PREAI
deleteLiu, Yun-Xin; Zhang, Liang; Chen, Yu-Hao; Zhang, Jia-Min; Chen, Mo; Liu, Tao; Shi, Lei
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Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power
deleteMicroelectronics International
IF0.8
delete2026-02-01
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PREAI
deleteWang, Yanfeng; Peng, Sui; Fu, Yan; He, Lingfeng; Huang, Jun; Yang, Lingyun; Huang, Zhicong
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Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters
deleteMicroelectronics International
IF0.8
delete2026-02-01
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PREAI
deleteYang, Juefei; Wang, Yunfei; Mo, Ze; Ouyang, Liangxuan; Zhang, Qingyu; Fang, Yan; Zhao, Zhaoyang
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Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads
deleteMicroelectronics International
IF0.8
delete2026-02-01
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PREAI
deleteYang, Xuexia; Zhu, Miao; Sun, Yanxi; Lin, Jinbao; Hao, Xin; Shu, Xuefeng; Xiao, Gesheng
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Heat dissipation performance of solid-state drives under convective cooling: analyzing the impact of heat sink fin spacing
deleteMicroelectronics International
IF0.8
delete2026-02-01
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PREAI
deleteApalowo, Rilwan Kayode; Abas, Aizat; Bin Salim, Muhammad Razin; Famuyiwa, Samuel Olusina; Kok, Chia Siang
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Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback
deleteMicroelectronics International
IF0.8
delete2026-01-01
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PREAI
deleteJiang, Kezheng; Ao, Yuqi; Zhao, Yifan; Xiong, Ping; Ding, Hao; Zhou, Yi
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Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics
deleteMicroelectronics International
IF0.8
delete2026-01-01
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PREAI
deleteSundararajan, Muralidharan; Devarajan, Mutharasu; Azahar, Ahmad Zarif; Mong, Derek
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Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems (DEC, 10.1108/MI-07-2025-0122, 2025)
deleteMicroelectronics International
IF0.8
delete2025-12-01
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PREAI
deleteLi, S.; Xu, Y.; Wang, S.; Wang, H.; Li, B.
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Novel bipolar output high step-up sepic DC/DC converter with parasitical parameters self-balance
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-12-01
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PREAI
deleteAi, Jian; Wu, Zhichao; Bi, Kaitao; Fan, Qigao; Yan, Wenxu; Qiu, Yue; Dai, Sichu; Qian, Lei; Ai, Jingcheng; Wang, Canmin; Han, Yuelong
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Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration
deleteMicroelectronics International
IF0.8
delete2025-12-01
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PREAI
deleteTang, Wenxue; Ji, Yong; Zhou, Liyan; Bai, Yufei; Zhu, Yuan; Yang, Cheng; Wang, Gang; Wang, Chengqian
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Fluorine implantation for nanostructured silicon Zener diodes: a study on electrical characterization and reliability
deleteMICROELECTRONICS INTERNATIONAL
IF0.8
delete2025-11-01
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PREAI
deleteLee, Sai Link; Packeer Mohamed, Mohamed Fauzi; Tan, Chan Lik
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