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Journal of Electronic Packaging

IF2.3
Papers41
Citations1955
Journal Papers 41
Publication Date
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Experimental Investigation of In-Plane Thermal Isolation Strategies for 2.5D Silicon-Based Integration Systems
deleteJournal of Electronic Packaging
IF2.3
delete2026-04-01
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deleteChen, Zhengwei; Song, Yingru; Yang, Ye; Quan, Ian Xin; Marconnet, Amy M.; Wei, Tiwei
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Two-Phase Jet Impingement Cooling With Copper Inverse Opal Coated Microfins Using Novec 649
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IF2.3
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deleteShi, Shangyang; Ning, Shangjin; Wang, Wei; Zhang, Chi
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Impact of Dielectrophoretic Vapor Extraction Force on Electronics Performance
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IF2.3
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deletePodlaski, Lindsey H.; Yagoobi, Jamal S.
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Experimental Characterization and Server-Level Demonstration of Confined, Direct-on-Silicon Two-Phase Jet-Impingement Cooling With Additively Manufactured Porous-Wick-Assisted Phase Separation
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IF2.3
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deleteYogi, Ketan; Sahu, Gopinath; Rajeev, Sidharth; Lattupalli, Harish Kumar; Wang, Keyu; Chen, Zhengwei; Yang, Yunchun; Schiffres, Scott N.; Rangarajan, Srikanth; Sammakia, Bahgat; Weibel, Justin A.; Wei, Tiwei
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Improved Productivity With High-Speed Imaging for Printed Circuit Board Applications in Electronics Assembly
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
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deleteAgarwal, Sunny
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Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components
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IF2.3
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deleteKocak, Eyup; Turkoglu, Hasmet
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High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire-Polydimethylsiloxane Composite Thermal Interface Materials Tape
deleteJournal of Electronic Packaging
IF2.3
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deleteJiang, Kaiying; Kwon, Heungdong; Qiao, Hansen; He, Yini; Asheghi, Mehdi; Goodson, Kenneth E.
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Maturation of Pumped Two-Phase Liquid Cooling to Commercial Scale-Up Deployment
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IF2.3
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deleteTipton, Russ; Wise, Ashley; Mutabdzija, Srdan; Shores, Craig; Kulkarni, Devdatta
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Impact of Thermal Cycling on Phase Change Material Based Thermal Management Systems
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IF2.3
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deleteTripathi, Piyush Mani; Marconnet, Amy
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Inhibiting Intermetallic Compound Growth at the Cu/Sn Interface Through the Electrochemical Deposition of Multiwalled Carbon Nanotubes on Cu
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IF2.3
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deleteKim, Kanghun; Kim, Yonghwan; An, Won Young; Chang, Yujin; Hwang, Seon Jae; Park, Jonghyock; Kang, Minkyu; Cho, Sungho; Kim, Dasom; Piao, Yuanzhe
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Investigation of the High-Vacuum Au/Si Eutectic Wafer Bonding Process for MEMS Resonators
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IF2.3
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deleteZha, Kaixiang; Wang, Shuo; Zhao, Junyuan; Niu, Bo; Hong, Yiyi; Zhu, Yinfang; Yang, Jinling
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A Physics-Informed Adaptive Segmentation Fitting Method for Transient Thermal Test Analysis
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IF2.3
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deleteZhu, Haorui; Jian, Maoliang; Yang, Lianqiao
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Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
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deleteLi, Zong-Tao; Sun, Hao-Lin; Tan, Jing; Yu, Bin-Hai; Li, Jia-Sheng; Fan, Zhi-Yong
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Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure Up to 1 Year Aging
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IF2.3
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deleteLall, Pradeep; Zhang, Yunli
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Effect of Bismuth Addition to SAC305 on the Microstructure and Mechanical Properties of Solder Joints
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IF2.3
delete2026-03-01
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deleteHamasha, Khozima; Hamasha, Mohammad M.; Hamasha, Sa'd
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Using Finite Element Analysis to Analyze the Effects of Paste-to-Ball Volume Ratio and Package Design Parameters on Thermal Cycling Performance of Hybrid SAC-LTS Solder Joints
deleteJournal of Electronic Packaging
IF2.3
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deleteChakraborty, Souvik; Mondal, Debabrata; Suhling, Jeffrey C.; Lall, Pradeep
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Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials
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IF2.3
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deleteWagh, Akshay; Krishnan, Shankar; Ramamoorthy, Sripriya
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Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing
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IF2.3
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deleteShih, Meng-Kai; Chen, Jing-Hao; Huang, Bo-Han; Ding, Yuan-Hong
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Manufacturing Challenges of Hybrid Bonding for Chiplets Heterogenerous Integration
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IF2.3
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deleteLu, Mei-Chien
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Characterization of Non-PFAS Underfill Behavior Under Harsh Operating Conditions
deleteJournal of Electronic Packaging
IF2.3
delete2026-03-01
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deleteLall, Pradeep; Kasturi, Madhu; Janowsky, Leyton; Davis, Edward
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