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IEEE Transactions on Semiconductor Manufacturing

IF2.3
Papers64
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Journal Papers 64
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Finite Element Simulation of Localized Flip-Chip Thermo-Compression Bonding for GaN-Based Micro-LEDs
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deleteWang, Zhihua; Zhang, Kaixin; Yan, Qun; Lin, Chang; Zhou, Xiongtu; Sun, Jie
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Critical Roles of Copper Surface Planarity in Achieving Reliable Cu/SiO2 Hybrid Bonding
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deleteSeo, Kangmin; Kim, Sunjae; Choi, Junyoung; Jang, Suin; Lee, Hoogwan; Kim, Sarah Eunkyung
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AI-Driven Optimization of Thin Film and CMP Processes in 3-D NAND Manufacturing
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deleteYu, Hsiang-Meng; Hsiao, Han-Yu; Hsieh, Meng-Hsun; Yang, Alex; Chang, Yu-Chih; Luoh, Tuung; Hsieh, Jung-Yu; Yang, Ling-Wuu; Yang, Tahone; Chen, Kuang-Chao
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A Novel Health Index Framework for Semiconductor Equipment Using Multi-View Data
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deleteAhn, Jeongsun; Cho, Sang-Hyun; Kim, Hong-Yeon; Kim, Hongyeon; Choi, Hyeonjeong; Ham, Dain; Kim, Yongjo; Kim, Hyun-Jung
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Semi-Damascene FSAV: Via CD and Overlay Process Window Analysis
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deleteHermans, Yannick; Marti, Giulio; Delie, Gilles; Murdoch, Gayle; Mingardi, Andrea; Halder, Sandip; Wu, Chen; Park, Seongho; Tokei, Zsolt
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Advanced SHG Metrology for Epitaxial SiGe Characterization in Semiconductor Manufacturing
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deleteLiu, Zhongming; Liang, Jintai; Zhou, Puxi; Xu, Guangwei; Long, Shibing
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Effectiveness of a High-Velocity-Type Laminar Air Curtain Device for Moisture Isolation Under EFEM Airflow Deflection During FOUP Door Opening
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deleteWen, Chi-Jen; Lin, Tee; Ali Zargar, Omid; Hsieh, Chi-Huan; Hu, Shih-Cheng; Shih, Yang-Cheng; Leggett, Graham
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