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SOLDERING & SURFACE MOUNT TECHNOLOGY

IF1.8
Papers28
Citations
Journal Papers 28
Publication Date
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteJu, Fan; Pu, Jie; Wang, Yuebing; Yang, Cheng; Dai, Feihu; Ji, Yong; Wang, Chengqian
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AI-Driven cross-scale modeling for SiP thermo-mechanical simulation
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IF1.8
delete2026-05-01
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PREAI
deleteZeng, Ce; Zhang, Yanming; Gao, Mingqi; Sheng, Can; Lei, Dongyang; Li, Yang; Li, Yangyang; Cui, Zhenduo; Zhu, Shengli
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Reliability analysis for heterogeneous millimeter-wave RF front-end package using a hybrid FEA-machine learning model
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IF1.8
delete2026-05-01
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PREAI
deleteHuang, Lichang; Zhang, Yingjun; Tong, Yuting; Xu, Xiaobin; Chen, Jinxing; Xu, Sha; Zhang, Yu
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L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits
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IF1.8
delete2026-05-01
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PREAI
deleteXiang, Yuyan; Jingming, Fei; Hongmei, Zhang; Qi, An
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Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteYao, Anqi; Yu, Huan; Ji, Wenhao; Liu, Ruxia; Xiao, Yong
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Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteChen, Zhuo; Luo, Zhiheng; Zhang, Junqin; Li, Jie; Gao, Mingyu; Che, Qin; Zhang, Jiayi
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Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-05-01
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PREAI
deleteZulkifli, Muhammad Nubli
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A comparative study of the mechanical properties of sintered submicron and micron Cu
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteHuang, Jian; Wang, Bi; He, Siliang; Cai, Miao; Qin, Hongbo; Yan, Haidong
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Experimental characterizations of the influence of sintering pressure on the high-temperature tensile behavior of sintered silver
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteGharaibeh, Mohammad A.; Ganzenmueller, Georg C.; Hiermaier, Stefan
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Reliability study of hybrid bonded structures based on flux divergence method
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IF1.8
delete2026-04-01
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PREAI
deleteWang, Yukang; Gan, Wumiao; Tang, Daokuan; Wang, Yaoting; Zhu, Yiying; Zhou, Zhukun
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Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteMuhamed Mukhtar, Muhamed Abdul Fatah; Phang, Jia Xin; Abd Khalid, Nor Rashikin; Abdullah, Muhammad Khalil; Ramli, Mohamad Riduwan
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Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-04-01
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PREAI
deleteHan, Dan; Chen, Xiao; Shen, Zicai; Chen, Rui; Cao, Rongxing; Liu, Yang; Liu, Hanxun; Xue, Yuxiong
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Comparative analysis of the fatigue life of the FLASH under joint error conditions
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-02-01
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PREAI
deleteLei, Le; Lei, Bing; Li, Lingbo
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Investigation on the effect of die-attaching on the mechanical properties and microstructure of nano-Cu sintered joints
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-02-01
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PREAI
deleteLiu, Quanyi; Ding, Zhicheng; Sun, Hongsheng; Liu, Biao; Liu, Yang
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Effect of thermal aging on microstructure and mechanical properties of indium-doped Sn-Ag-Cu lead free solder alloys
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-02-01
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PREAI
deleteHameed, Muhammad Sohail; Wakeel, Aneela; Ullah, Barkat; Channar, Hassan Raza; Zubair, Muhammad
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Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-02-01
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PREAI
deleteLi, Yulong; Tian, Jinke; Hao, Ruijie; Ding, Feng; Wu, Haoyue; Lin, Wei; Hong, Jinhua; Lei, Min; Li, Xuewen
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Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-02
delete1
PREAI
deleteAbas, Aizat; Mukhtar, Muhamed Abdul Fatah Muhamed; Apalowo, Rilwan Kayode; Ani, Fakhrozi Che
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Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteSim, Yunsub; Maeng, Jongsun; Oh, Minho; Choi, Won; Kim, Taek-Soo; Hur, Eunkwang; Sohn, Yoonchul
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Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteWang, Bo; Ke, Zhanglong; Chen, Zimeng; Li, Wangyun; Huang, Wei; He, Siliang; Pan, Kailin; Nishikawa, Hiroshi
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Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents
deleteSOLDERING & SURFACE MOUNT TECHNOLOGY
IF1.8
delete2026-01-01
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PREAI
deleteZhao, Zehao; Wu, Wei; Gao, Li-Yin; Liu, Zhi-Quan
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