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Semiconductor Wafer Bonding: Science, Technology and Applications
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Papers
43
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Journal Papers
43
Related Insights
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Journal Papers
43
Publication Date
Publication Date
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Citations
Glass Frit Wafer Bonding Sealed Cavity Pressure in Relation to Bonding Process Parameters
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
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2016-08-24
0
PRE
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Knechtel, Roy; Dempwolf, Sophia; Klingner, Holger
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Heterogeneous Photonic Integration by Direct Wafer Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
4
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Davenport, Michael L.; Chang, Lin; Huang, Duanni; Volet, Nicolas; Bowers, John E.
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Cu-Cu Die to Die Surface Activated Bonding in Atmospheric Environment using Ar and Ar/N2 Plasma
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
10
PRE
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Chua, S. L.; Tan, C. S.
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Adhesion energy and bonding wave velocity measurements
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
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0
2016-08-24
10
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Larrey, V.; Mauguen, G.; Fournel, F.; Radisson, D.; Rieutord, F.; Morales, C.; Bridoux, C.; Moriceau, H.
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Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
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2016-08-24
4
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Floetgen, C.; Razek, N.; Dragoi, V.; Wimplinger, M.
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Self-Assembly Based Multichip-to-Wafer Bonding Technologies for 3D/Hetero Integration
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
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2016-08-24
0
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Fukushima, T.; Lee, K. W.; Tanaka, T.; Koyanagi, M.
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Analysis of Defect Levels at GaAs/GaAs Surface-Activated Bonding Interface for Multi-Junction Solar Cells
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
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2016-08-24
0
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Sugiyama, M.; Yamashita, D.; Watanabe, K.; Fujino, M.; Suga, T.; Nakano, Y.
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Determination of Band Structure at GaAs/4H-SiC Heterojunctions
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
3
PRE
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Liang, J. B.; Shimizu, S.; Arai, M.; Shigekawa, N.
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Invited: High Output Power Deep Ultraviolet Light-Emitting Diodes with Hemispherical Lenses Fabricated Using Room-Temperature Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
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2016-08-24
8
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Ichikawa, M.; Endo, S.; Sagawa, H.; Fujioka, A.; Kosugi, T.; Mukai, T.; Uomoto, M.; Shimatsu, T.
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High Efficiency Cleaning Processes for Direct Wafer Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
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2016-08-24
3
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Dussault, D.; Rothballer, J.; Kurz, F.; Reichardt, M.; Dragoi, V.
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High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
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2016-08-24
9
PRE
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Kurz, F.; Plach, T.; Suess, J.; Wagenleitner, T.; Zinner, D.; Rebhan, B.; Dragoi, V.
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Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
0
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Poppe, E.; Jensen, G. U.; Moe, S. T.; Wang, D.
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Edge Water Penetration in Direct Bonding Interface
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
1
PRE
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Rieutord, F.; Tardif, S.; Landru, D.; Kononchuk, O.; Larrey, V.; Moriceau, H.; Tedjini, M.; Fournel, F.
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Low Temperature Thermo Compression Bonding with Printed Intermediate Bonding Layers
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
1
PRE
AI
Wiemer, M.; Roscher, F.; Seifert, T.; Vogel, K.; Ogashiwa, T.; Gessner, T.
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Locally Measuring the Adhesion of InP Membranes Directly Bonded on Silicon
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
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2016-08-24
0
PRE
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Patriarche, G.; Pantzas, K.; Le Bourhis, E.; Beaudoin, G.; Talneau, A.
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Wafer-level Vacuum Packaging by Thermocompression Bonding using Silver after Fly-cut Planarization
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
1
PRE
AI
Liu, C.; Hirano, H.; Froemel, J.; Tanaka, S.
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Suppressed Self-Heating in Multi-Finger InP-Based DHBTs with Au Subcollector Fabricated on SiC Substrate by Surface-Activated Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
5
PRE
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Shiratori, Y.; Hoshi, T.; Kashio, N.; Kurishima, K.; Higurashi, E.; Matsuzaki, H.
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The roles of band bending, surface misorientation, and passivation on electrical transport across III-V bonded structures
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
1
PRE
AI
Yee, M.; Liao, M.; Seal, M.; Goorsky, M. S.
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Room Temperature Bonding with Lift-Off Resist Using the Surface Activated Bonding Method for a Layer Transfer Platform
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
1
PRE
AI
Matsumae, Takashi; Suga, Tadatomo
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Combined Surface Activated Bonding Technique for Hydrophilic SiO2-SiO2 and Cu-Cu Bonding
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY AND APPLICATIONS 14
IF
0
2016-08-24
10
PRE
AI
He, Ran; Fujino, Masahisa; Yamauchi, Akira; Suga, Tadatomo
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