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Soldering and Surface Mount Technology
IF
1.8
Papers
2
Citations
617
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Journal Papers
2
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Journal Papers
2
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Publication Date
IF
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A review of development and applications of SiC power devices in packaging and interconnect technology
SOLDERING & SURFACE MOUNT TECHNOLOGY
IF
1.8
2025-09-01
2
PRE
AI
Chen, Jibing; Liu, Yanfeng; Yang, Junsheng; He, Liang; Tang, Hui; Li, Xin
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Aspects of advanced thermal management for flip chip on low temperature cofired ceramics (LTCC)
SOLDERING & SURFACE MOUNT TECHNOLOGY
IF
1.8
2009-04-10
0
PRE
AI
Noren, M.; Brunner, S.; Hoffmann, C.; Salz, W.; Aichholzer, K.
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